ALBERT

All Library Books, journals and Electronic Records Telegrafenberg

X
feed icon rss

Your email was sent successfully. Check your inbox.

An error occurred while sending the email. Please try again.

Proceed reservation?

Export
Filter
  • Articles  (42,615)
  • Springer  (42,615)
  • Technology  (42,615)
Collection
Source
Keywords
Publisher
Years
Journal
Topic
  • 1
    Electronic Resource
    Electronic Resource
    Step by step development of an electrochemical microanalytical system (1997)
    Springer
    Microsystem technologies 3 (1997), S. 97-101 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract  The development of an electrochemical microanalytical system for ionometric measurements (acronym ELMAS) is described. ELMAS combines potentiometric microsensors with solid state ion sensitive membranes, plastic molded and adhesive mounted micropumps, a microchannel system for connecting all components (several sensors, the calibrating solution reservoirs, the micropumps) and microelectronic components for signal processing and system control. The development of any complex technical system requires a good understanding and asks for a specification of high quality. Very useful for this purpose are executable specifications; they can demonstrate system properties already in an early design stage and give a deep insight in the behaviour of the system. Thus the system requirements can be verified and design errors can be detected and eliminated earlier than by other approaches. So we started the development of the ELMAS microsystem with the creation of a dynamical executable specification model, based on Statecharts, performed by the STATEMATE tool. Statecharts are extended finite automata. This model has been combined with a graphical user interface. Running simulations guarantees the correct system behaviour. The graphical interface itself was used for communication between the institutes participating on the development of ELMAS. The next stage of development was characterized by substituting some simulated components by real ones. At this stage microsensors have been combined with macro pumps and conventional electronics. The model running on a workstation controls the sensor and actuator components of macro dimension. The result of this stage was a macro prototype of ELMAS. It was used for testing the new developed microsensors and analysing the system behaviour. Going from the macro to micro components and replacing the workstation by a microcontroller the step by step development of ELMAS ends up in a real microsystem for the simultaneous measurement of pNa and pH. Thus we get a closed chain from specification to realization.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s005420050063
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 2
    Electronic Resource
    Electronic Resource
    Tensile testing of microfabricated thin films (1997)
    Springer
    Microsystem technologies 3 (1997), S. 117-121 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract  Mechanical properties of titanium thin films of 0.5 μm thickness and aluminum thin films of 1.0 μm thickness, microfabricated by magnetron sputtering, were measured by using a novel tensile machine. These thin films are difficult to handle because they are fragile, so the thin film specimens were fabricated by using semiconductor manufacturing technology in a silicon frame to protect them. The test section of these specimens was 300 μm in width and 1400 μm in gauge length. By gripping the thin film specimen with a new device using a micrometer, it could be mounted on the tensile machine easily. The stress-strain diagrams of both thin films were measured continuously in the atmosphere at room temperature. The experimental results indicated that the titanium thin film and the aluminum thin film had a smaller breaking elongation although they had a larger tensile strength than bulk pure titanium and bulk pure aluminum, respectively.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s005420050067
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 3
    Electronic Resource
    Electronic Resource
    Novel fast atom beam (FAB) processes for fabricating functional nanostructures on three-dimensional microstructures (1997)
    Springer
    Microsystem technologies 3 (1997), S. 112-116 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract  We have developed four manufacturing processes that use a fast atom beam (FAB) for fabricating functional nanostructures on three-dimensional (3-D) microstructures. Such fabrication involves two steps: (1) producing the 3-D microstructure; and (2) producing the nanometer-size functional structures at a local point on this microstructure. The FAB methods that we developed for the first step are the separated (non-contact) mask FAB (SM-FAB) and moving mask FAB (MM-FAB), and those for the second step are the nanometer-motion moving mask FAB (NMM-FAB) and electron-beam deposition-pattern FAB (ED-FAB). We previously demonstrated the capability of the SM-FAB, by producing a multi-faced microstructure, a micro gojyunoto (named after an old Japanese temple tower). In this study, we describe and demonstrate the capability of the MM-FAB, by producing multiple, multi-curved and sloped structure, a diffraction grating structure; the NMM-FAB, by producing ultra-fine stairs, 30 nm wide and 30 nm high; and the ED-FAB, by producing a GaAs line structure, 55.3 nm wide and 13.6 nm high. These results show that these FAB methods are effective in producing 3-D microstructures and nano-structures. Combinations of these methods will make it possible to produce functional nanostructures on 3-D microstructures.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s005420050066
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 4
    Electronic Resource
    Electronic Resource
    Fusion bonding of rough surfaces with polishing technique for silicon micromachining (1997)
    Springer
    Microsystem technologies 3 (1997), S. 122-128 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract  Surface roughness is one of the crucial factors in silicon fusion bonding. Due to the enhanced surface roughness, it is almost impossible to bond wafers after KOH etching. This also applies when wafers are heavily doped, have a thick LPCVD silicon nitride layer on top or have a LPCVD polysilicon layer of poor quality. It has been demonstrated that these wafers bond spontaneously after a very brief chemical mechanical polishing step. An adhesion parameter, that comprises of both the mechanical and chemical properties of the surface, is introduced when discussing the influence of surface roughness on the bondability. Fusion bonding, combined with a polishing technique, will broaden the applications of bonding techniques in silicon micromachining.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s005420050068
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 5
    Electronic Resource
    Electronic Resource
    Injection molding and related techniques for fabrication of microstructures (1997)
    Springer
    Microsystem technologies 3 (1997), S. 129-133 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract  Injection molding technology and its different modifications represent established processes for manufacturing polymer products with high accuracy in large scale production. Enhanced machine and tool technologies like evacuation units and special temperization systems have already been adapted to the molding of microstructures with high aspect ratios. Cycle times are actually in the range of minutes and depend on the geometry of the microstructures and the materials used. Based on injection molding of lost plastic microforms new processes for the manufacturing of ceramic or metal microstructures are being developed.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s005420050069
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 6
    Electronic Resource
    Electronic Resource
    Low Z substrates for cost effective high-energy, stacked exposures (1997)
    Springer
    Microsystem technologies 4 (1997), S. 17-20 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract  Commercial application of the “direct” LIGA process requires solving two critical issues: throughput and price. Stacking of PMMA sheets bonded to substrates and exposed simultaneously with hard X-ray has been suggested recently. This paper presents a comparison of potential low Z substrates for stacked exposures in deep X-ray lithography based on elements of the second row of the periodic table. The transmission of various substrates considered for such an application have been calculated and experimentally determined. The transmission properties of materias such a beryllium, carbon, boron and compounds are by far better than that of silicon at lower photon energies typically used in LIGA applications, but this gain decreases with increasing photon energy. In stacked exposures, however, even small gains provide significant decrease in exposure time.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s005420050084
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 7
    Electronic Resource
    Electronic Resource
    Precision of micromilled x-ray masks and exposures (1997)
    Springer
    Microsystem technologies 4 (1997), S. 21-24 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract  Micromechanical milling has been shown to be a rapid and direct method for the fabrication of structures with the geometry and size suitable for use as x-ray mask absorbers. While the micromilling process can not duplicate the size and resolution of absorber patterns created by high energy electron beam or optical lithography methods, micromilling can repeatedly create absorber line widths down to 10 micrometers, or less, with a one-sigma tolerance of 0.5 micrometers. A method for easily characterizing milling tool run out has been adapted so tool change out can be more routine. The milling process leaves some absorber burrs and the absorber is apparently tapered at the machined wall which introduce process biases, both of which add to exposure degradation. Nevertheless, based on work to date, it appears both of these effects can be reduced to acceptable limits.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s005420050085
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 8
    Electronic Resource
    Electronic Resource
    X-Ray masks for very deep X-Ray lithography (1998)
    Springer
    Microsystem technologies 4 (1998), S. 70-73 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract  The high aspect ratio, deep x-ray lithography and electrodeposition process [Becker et al. (1986)] can be expensive unless throughput is high enough. The use of a very high energy synchrotron has allowed the cost of exposure to be significantly reduced through simultaneous exposure of stacked photoresist [Guckel et al (1994)]. Synchrotron radiation at high photon energies has resulted the use of a large area x-ray mask. Both stacked exposures and a large area x-ray masks have significantly increased the throughput of the deep x-ray lithography and electrodeposition process.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s005420050098
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 9
    Electronic Resource
    Electronic Resource
    Technology for movable microstructures - Transfer of laboratory processes to industrial production (1998)
    Springer
    Microsystem technologies 4 (1998), S. 120-121 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s005420050111
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 10
    Electronic Resource
    Electronic Resource
    Slip casting of ceramic microcomponents (1998)
    Springer
    Microsystem technologies 4 (1998), S. 125-127 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s005420050113
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 11
    Electronic Resource
    Electronic Resource
    Hot embossing - The molding technique for plastic microstructures (1998)
    Springer
    Microsystem technologies 4 (1998), S. 122-124 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract  Hot embossing is the technique to fabricate high precision and high quality plastic microstructures. Industrial fabrication of plastics components is normally achieved by injection molding. Hot embossing is actually used only for a few optical applications where high precision and high quality are important. The advantages of hot embossing are low material flow, avoiding internal stress which induces e.g. scattering centers infavorable for optical applications, and low flow rates, so more delicate structures can be fabricated, such as free standing thin columns or narrow oblong walls. The development of modular molding equipment, orientated on industrial standards has opened the door to the fabrication of plastic microcomponents in great numbers (for example LIGA-UV/VIS-spectrometers). Hot embossing has the potential of increasing production rates and therefore decreasing production costs by the enlargement of the molding surface and automatization of the molding process.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s005420050112
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 12
    Electronic Resource
    Electronic Resource
    LIGA-Technology for the fabrication of positioned planar structures (1998)
    Springer
    Microsystem technologies 4 (1998), S. 132-134 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract  A fabrication process is presented for polymer inserts in micro-optical benches, which combine the mechanical precision of the LIGA-process with the wide variety of optical functions offered by diffractive optical elements. For this purpose metal masters with continuous relief elements and LIGA-structures were used in a combined molding tool and precision micro-optical elements were replicated by injection molding.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s005420050115
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 13
    Electronic Resource
    Electronic Resource
    Multi-functional valve components fabricated by combination of LIGA processes and high precision mechanical engineering (1998)
    Springer
    Microsystem technologies 4 (1998), S. 128-131 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract  The advantage of thermoplastic molding as a convenient method for fabricating large quantities of microstructures is restricted by the possibilities and the necessary efforts for structuring the required molding tools. In order to increase the complexity of mold inserts without significantly increasing the fabrication expenditure a new process combining LIGA techniques and precision mechanics had been suggested by Research Center Karlsruhe. Recent work on the optimization of this process made it possible to manufacture multi-leveled mold inserts with which different three-dimensional microcomponents have successfully been molded. The two- and three-level structures feature among other details integrated alignment aids which worked very well during the assembly of the valve system the components were designed for. This paper deals with the process optimization, the manufacturing of the mold inserts, the fabrication of the three-dimensional microstructures by hot embossing in PMMA as well as in polymers with high thermal resistance and the application in a microvalve system.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s005420050114
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 14
    Electronic Resource
    Electronic Resource
    High aspect ratio micromachining by synchrotron radiation direct photo-etching (1998)
    Springer
    Microsystem technologies 4 (1998), S. 135-138 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract  We have carried out micromachining of Teflon-polymers such as PTFE, PFA and FEP as well as optical crystal such as NaCl and LiF by synchrotron radiation direct (without any chemicals) photo-etching and succeeded in creating microstructures with very high aspect ratios. The maximum aspect-ratio achieved was 50 and the maximum processing depth was 1500 microns. Dependence of the etching rate on the synchrotron beam current and on the substrate temperature was studied. Based on the study, we could use only x-rays from the synchrotron radiation so as to apply x-ray lithography technology (such as using an x-ray mask and processing in He atmosphere) to our process. A rise in the sample temperature results in significant enhancement of the etching rate. The etching rate measured was on the order of a few 100 μm/min. So that this process is much faster than hard x-ray deep lithography for the processing of more than 100 μm deep microstructures.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s005420050116
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 15
    Electronic Resource
    Electronic Resource
    Angular rate sensor and accelerometer combined on the same micromachined CMOS chip (1998)
    Springer
    Microsystem technologies 4 (1998), S. 139-142 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract  This paper describes an electroformed micromachining technology capable of producing both angular rate sensors and accelerometers. The sensors fabricated are CMOS integrated for improved signal output. Automotive applications for these devices will also be discussed.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s005420050117
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 16
    Electronic Resource
    Electronic Resource
    Fabrication of photoplastic high-aspect ratio microparts and micromolds using SU-8 UV resist (1998)
    Springer
    Microsystem technologies 4 (1998), S. 143-146 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract  An innovative method for fabrication and rapid prototyping of high-aspect ratio micromechanical components in photoresist is discussed. The photoresist is an epoxy-negative-tone resist, called SU-8, which can be structured to more than 2 mm in thickness by UV exposure. Small gears of 530 μm in diameter and 200 μm in thickness have been realized in this photoplastic and their functionality has been demonstrated. In addition a process called MIMOTECTM (MIcroMOlds TEChnology) has been established for the fabrication of metallic micromolds. MIMOTECTM is based on the use of the SU-8 spun on high thicknesses and electrodeposition of nickel. Thermoplastic microcomponents have been injected and mounted in watches.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s005420050118
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 17
    Electronic Resource
    Electronic Resource
    SLIGA Based underwater weapon safety and arming system (1998)
    Springer
    Microsystem technologies 4 (1998), S. 168-171 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract  The Naval Surface Warfare Center, Indian Head Division (NSWCIHD) is applying microelectromechanical system (MEMS) technology to underwater weapon Safety and Arming (S&A) system development. MEMS technology provides an opportunity to develop a miniaturized S&A system that is more sophisticated with improved safety and reliability at a lower cost compared to current systems. An S&A system prevents premature initiation of the weapon while reliably ensuring initiation at the appropriate time. An S&A system uses multiple sensors and devices. In comparison with other weapon S&A systems, a critical aspect of underwater weapon S&A systems is the mechanical interlock system utilizing actuators and mechanical sensors. This paper describes the design, development and fabrication of S&A SLIGA device prototypes and of a SLIGA based S&A system. NSWCIHD worked with members of the HI-MEMS Alliance during design, development and fabrication. Advancements achieved by the HI-MEMS Alliance and SLIGA S&A design issues are discussed.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s005420050123
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 18
    Electronic Resource
    Electronic Resource
    High winding density micro coils for magnetic actuators (1998)
    Springer
    Microsystem technologies 4 (1998), S. 172-175 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract  A high winding density micro coil technology is reported here which has been used to reduce the power requirements of several classes of micro actuators. [Christenson (1995)] Actuator design sets the required magnetic field and power. At low frequencies coil design translates these requirements to a total winding conductor cross-sectional area. The winding fill fraction of the coil technology sets the final coil size. Using the design equations, coil technologies may be compared.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s005420050124
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 19
    Electronic Resource
    Electronic Resource
    Transducer and protective PVD-films for applications in microsystem components (1998)
    Springer
    Microsystem technologies 5 (1998), S. 49-58 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract  In the development of microsystems, actuators are required which can be triggered in various different ways, can be scaled down to the micro-range, and allow a cost-effective manufacturing process. Of special interest are materials which transform electrical energy into mechanical energy as they can be directly used as actuators or by using the inverse effect as sensors. The corresponding energy conversion mechanisms are magnetostriction, piezoeffect, and shape memory effect. Especially, thin film deposition of these materials present interesting opportunities to realize micro-actuators or sensors as they offer features like simple actuator design and mass-production compatible to microsystem manufacturing processes. This paper contains a description and discussion of various PVD-techniques successfully used for the production of magnetostrictive films (amorphous, nanocrystalline and multilayered rare earth–Fe alloys), piezoelectric films (wurzite- and perovskite-type materials), and shape memory films (TiNi-based alloys) trained for the two-way-effect. Besides functional layers for sensors and actuators new and optimized protective layers like multilayer-, gradient- and multicomponent coatings are developed. The purpose is the protection of microsystem components against oxidation, corrosion, and wear or to prevent chemical reactions between adjacent materials. Promising thin film materials from the system Ti–Al–B–C–N as well as coating concepts are shortly characterized with respect to constitution, properties and tribological behaviour.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s005420050140
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 20
    Electronic Resource
    Electronic Resource
    Applications of full-field optical methods in micro-mechanics and material engineering (1998)
    Springer
    Microsystem technologies 5 (1998), S. 81-89 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract  Current trends in the development of micro-scale components, structures and systems place unprecedented requirements on their designers. To satisfy these demands, new experimental tools have to be employed along with the computational solutions. The biggest challenge includes the experimental knowledge of micromechanical behaviour of materials and to design validation of finished products. This information is provided by electronic holography and grating interferometry used as full-field, noninvasive experimental techniques. The usefulness of these methods are shown by several examples including the determination of local material properties of polycrystalline, composit and smart materials, as well as dynamic characteristic of structures.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s005420050146
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 21
    Electronic Resource
    Electronic Resource
    Recent advances in conductive adhesives for direct chip attach applications (1998)
    Springer
    Microsystem technologies 5 (1998), S. 72-80 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract  Conductive adhesives are widely used in electronics packaging applications such as in naked chip attachment and interconnection, component fixing, display interconnection and for heat transfer purposes. This paper gives a summary of recent achievements in the use of conductive adhesives in direct flip-chip attach applications. Special emphasis is put on the emerging technology of using anisotropically conductive adhesives as electronics interconnection materials. Some flip-chip application examples on low-cost printed circuitry are given. These examples include flip-chip ACF bonded electronics SBU-based six layer board for Casio′s radio electronics as well as memory chips assembled with the same technique in the latest Hitachi laptop computer. Current research activities as well as achievements so far are also presented. Different possible failure mechanisms for conductive adhesives are elaborated. Finally, future challenges and development trends are discussed. The paper shows that conductive adhesives play a significant role in electronics packaging applications and more applications will be expected in the years to come.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s005420050145
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 22
    Electronic Resource
    Electronic Resource
    Role of the film texturing on the response of particle detectors based on CVD diamond (1999)
    Springer
    Microsystem technologies 5 (1999), S. 151-156 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract  Recent improvements in the quality of diamond films grown by Chemical Vapour Deposition (CVD) have made synthetic diamond a very attractive material for detection applications. In this paper, polycrystalline diamond films synthesised by microwave plasma enhanced CVD using a CH4–CO2 gas mixture, previously investigated as particle detectors, have been characterised by X-ray diffraction and Raman spectroscopy. The detector response was measured in vacuo under irradiation with 5.5 MeV α-particle from a 241Am source. A systematic study of the influence of the film structural properties on the detector performance has been carried out by changing the methane concentration in the growth plasma and the deposition temperature. The existence of a correlation between growth conditions, film texturing and detector performance has been demonstrated. Independently of the substrate temperature, (1 0 0) orientated films exhibit the lowest detection efficiencies. The meas ured collection distances are smaller than the average grain sizes and seem to be limited by trapping centres within the grains. These results are confirmed by Raman analysis.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s005420050155
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 23
    Electronic Resource
    Electronic Resource
    Low-temperature anodic bonding of silicon to silicon wafers by means of intermediate glass layers (1999)
    Springer
    Microsystem technologies 5 (1999), S. 144-149 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract Silicon wafers have been anodically bonded to sputtered lithium borosilicate glass layers (Itb 1060) at temperatures as low as 150–180 °C and to sputtered Corning 7740 glass layers at 400 °C. Dependent on the thickness of the glass layer and the sputtering rate, the sputtered glass layers incorporate compressive stresses which cause the wafer to bow. As a result of this bowing, no anodic bond can be established especially along the edges of the silicon wafer. Successful anodic bonding not only requires plane surfaces, but also is determined very much by the alkali concentration in the glass layer. The concentration of alkali ions as measured by EDX and SNMS depends on both the sputtering rate and the oxygen fraction in the argon process gas. In Itb 1060 layers produced at a sputtering rate of 0.2 nm/s, and in Corning 7740 layers produced at sputtering rates of 0.03 and 0.5 nm/s, respectively, the concentration of alkali ions in the glass layers was sufficiently high, at oxygen partial pressures below 10-4 Pa, to achieve anodic bonding. High-frequency ultrasonic microanalysis allowed the bonding area to be examined non-destructively. Tensile strengths between 4 and 14 MPa were measured in subsequent destructive tensile tests of single-bonded specimens.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s005420050154
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 24
    Electronic Resource
    Electronic Resource
    Electrostatic comb-drive actuators made of polyimide for actuating micromotion convert mechanisms (1999)
    Springer
    Microsystem technologies 5 (1999), S. 161-165 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract  For conventional micromachines, in particular, micromotion convert mechanisms, the output points of the mechanism can move horizontally when input points move in the same direction. Therefore, we have proposed a three-dimensional motion convert mechanism whose output points can move vertically when the input points move in the horizontal direction. This 2-degree-of-freedom (DOF) mechanism consists of electrostatic comb-drive actuators and a basic mechanism with large-deflective elastic hinges. In this study, the characteristics of comb-drive actuators are analyzed. The electrostatic comb-drive actuator which is made up of polyimide is fabricated by CVD, RIE, Wet etching, etc., technologies. The relationship between the input (voltage) and the output (displacement) of the drive has been analyzed both theoretically and experimentally.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s005420050157
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 25
    Electronic Resource
    Electronic Resource
    Reactive ion etching for the production of metal microstructures by hot embossing (1999)
    Springer
    Microsystem technologies 6 (1999), S. 11-14 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract A reactive ion etching process which has been developed in order to remove the residual polymer layer, that remains at the bottom of microstructures made by hot embossing, is described. The influence of parameters and structures is explained.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s005420050167
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 26
    Electronic Resource
    Electronic Resource
    Electric field breakdown at micrometre separations in air and vacuum (1999)
    Springer
    Microsystem technologies 6 (1999), S. 6-10 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract At large separations, the behaviour of electrodes has been widely studied and is reasonably well understood. However, some fundamental problems have not been properly addressed such as maximum safe operating voltages and critical dimensions required at small separations between different types of materials. A systematic study of electrical breakdown at sub-millimetre separations using materials commonly used in the fabrication of microdevices has been undertaken. Specimens for examination at electrode separations from 500 nm to 25 μm have been made with different electrode configurations, such as flat to flat, flat to point and point to point. All the tests were made in air and at differing pressures.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s005420050166
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 27
    Electronic Resource
    Electronic Resource
    Raman characterisation and hardness properties of diamond-like carbon films grown by pulsed laser deposition technique (1999)
    Springer
    Microsystem technologies 6 (1999), S. 30-36 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract  A detailed Raman analysis is carried out in order to explain the results of the systematic morphological and mechanical characterisation of unhydrogenated and hydrogenated amorphous carbon films prepared by the pulsed laser deposition at substrate temperatures ranging from 25 to 600°C. The carbon bonding modifications produced by the different deposition conditions are discussed via the quantitative analysis of the changes correspondingly induced into the shape of the Raman spectra. The indications coming from scanning electron microscopy, atomic force microscopy and hardness measurements are understood in terms of the different sp3- to sp2-bonding fraction attained and the role of both substrate temperature and growth ambient on the quality of the deposited films is clarified. The existence is demonstrated of a very narrow temperature window for the achievement of a high sp3-bond percentage in hydrogen-free films resulting in relevant hardness values and a correlation between mechanical strengths and shape of the Raman spectrum is tentatively established.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s005420050171
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 28
    Electronic Resource
    Electronic Resource
    Heteroepitaxial growth of Pt (0 0 1) films on SrTiO3 by pulsed laser deposition (1999)
    Springer
    Microsystem technologies 6 (1999), S. 37-39 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract  New functional materials are being considered having in perspective an important role in the development of microsystems. In particular, in an experiment of pulsed laser deposition (equipped with in situ reflection high-energy diffraction of the growth surface) thin Pt epitaxial layers have been deposited on SrTiO3 (0 0 1) substrates. It is shown that thin single-crystal layers of metallic Pt (0 0 1) can be heteroepitaxially grown on SrTiO3 (0 0 1). Furthermore complex SrTiO3–Pt–SrTiO3 heteroepitaxial structures have been deposited. This result is of relevant importance for the growth of new functional materials consisting of heteroepitaxial structures involving both complex oxides and standard metals. These materials may reasonably open up new prospects in the field of microsystem technologies.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s005420050172
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 29
    Electronic Resource
    Electronic Resource
    TRANSTEC – A new tool for online educational multimedia training on innovative high aspect ratio microtechnologies (2000)
    Springer
    Microsystem technologies 6 (2000), S. 109-112 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract Microtechnology is regarded as one of the key technologies of the 21st century that will decisively influence nearly all fields of daily life. The demand for vocational education in this discipline is growing rapidly. This education must be a continuous life long learning process since microtechnology is characterised by frequent improvements of the fabrication processes and facilities. The use of Internet-resources offers new chances in teaching and training, especially for design, production or application of products from high aspect ratio micro-engineering technologies. The present paper reports on the development of a novel concept of interactive Internet-based training entities in the field of High Aspect Ratio Technologies. The training topics are dedicated towards innovative engineering technologies, particularly the LIGA technique, laser-based microtechnologies and microengineering related aspects of precision engineering. This training is addressed to graduate students, design engineers and executives mainly in small and medium sized enterprises. http://www-ttec.rs.uni-siegen.de
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s005420050009
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 30
    Electronic Resource
    Electronic Resource
    Large area, cost effective X-ray masks for high energy photons (2000)
    Springer
    Microsystem technologies 6 (2000), S. 117-120 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract The cost effectiveness of the deep X-ray lithography and electrodeposition process, LIGA, depends directly on the throughput of the process. The use of high energy photons allows the exposure of stacked photoresist and results in high throughput. High energy X-ray exposures require a different mask than low energy X-ray exposures. The high energy mask allows a large area exposure but requires a thicker X-ray absorber. The cost of generating high energy X-ray masks can be drastically reduced by using a thick optical photoresist process rather than an X-ray exposure process. The cost can be further reduced by using alternatives to the typical X-ray absorber, gold. High atomic weight (high Z) materials are ideal absorbers. Lead has been demonstrated as being a useable alternative as an X-ray absorber.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s005420050011
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 31
    Electronic Resource
    Electronic Resource
    Superplastic extrusion of microgear shaft of 10 μm in module (2000)
    Springer
    Microsystem technologies 6 (2000), S. 126-129 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract  The goal of this study is to establish microforming technologies for MEMS parts such as microgears of 10 micrometers in module. For this purpose, it is important to develop new methods to fabricate microdies and to select suitable materials for microforming. Photochemically machinable glass has been used to fabricate microdies by photolithography and anisotropic etching techniques. Al-78Zn superplastic material has been employed in microextrusion. This material has the great advantage of deformation under very low stresses in comparison with conventional plastic deformation. Furthermore, the material exhibits good microformability. A new superplastic forward extrusion machine has been developed for this study. Specimens were placed in a container and extruded by a linear actuator in a vacuum or an argon gas atmosphere. Microextrusion has succeeded in forming microgear shafts. The gear of Al-78Zn superplastic alloy is 10 micrometers in module and the diameter of the pitch circle is 100 micrometers.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s005420050180
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 32
    Electronic Resource
    Electronic Resource
    Adhesion of Ni-structures on Al2O3 ceramic substrates used for the sacrificial layer technique (2000)
    Springer
    Microsystem technologies 6 (2000), S. 121-125 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract  This study presents an investigation of the adhesion properties of a chromium-gold-titanium layer system, which is used in the LIGA process to create moveable microstructures. The main purpose has been the improvement of the process parameters to increase yield reliability. Three mechanisms affecting the adhesion have been identified. As a consequence of humidity adsorbed H2O reacts with Al2O3 to AlO(OH) (aluminum meta hydrates), which does not bond to the sputtered chromium layer. Thus the hydrate must be removed by cleaning the surface with Ar+-ions. Tight layers without pores could be realized by optimization pressure and temperature during sputtering of chromium and gold. Thus, diffusion of chromium or penetration of etchants into the gold layer as well as impact or diffusion of titanium into the gold layer could be prevented. In addition, a copper layer was introduced as a further intermediate layer by electroforming to improve the formation of stable nickel alloys at the interface between the sputtered gold and the electroplated nickel. These measures resulted in an improvement of the adhesion, so that full functional acceleration sensors were produced with a high yield.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s005420050179
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 33
    Electronic Resource
    Electronic Resource
    Metal oxide gas sensor for high temperature application (2000)
    Springer
    Microsystem technologies 6 (2000), S. 169-174 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract  The present study is focused on the development of a gas sensor for application in a high temperature environment. The sensor has been realised using thin films prepared on silicon substrates including a high temperature stable heating and wiring system. TiO2 acts as sensitive layer. Measurements have been carried out in synthetic gas mixtures as well as in gases in a given application. Neural networks and multivariate data analysis have been used for determining the gas concentrations. The capability to detect CO, NO x , and toluene is shown.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s005420000048
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 34
    Electronic Resource
    Electronic Resource
    Dimensional measurement of high aspect ratio micro structures with a resonating micro cantilever probe (2000)
    Springer
    Microsystem technologies 6 (2000), S. 179-183 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract  In non-destructive dimensional measurement of high aspect ratio micro structures (HARMS), optical methods cannot offer full three dimensional information due to the lack of observation light. Again, conventional mechanical measurement, such as a surface profiler or a coordinate measurement machine, cannot be applied because their stylus is too large. Furthermore, the AFM, though popular among the semiconductor industry, is also limited in terms of dimensional measurement, because its system is usually designed for planar samples. Thus, we have developed a new sensor-integrated micro resonating cantilever probe and a new dimensional measurement machine, which allows the probe's vertical access to microstructures in a sample. The new probe is made of tungsten carbide super hard alloy and possesses design flexibility according to its intended application. Validity of the system is confirmed through the measurement experiment of EDM drilled and chemically etched micro holes.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s005429900037
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 35
    Electronic Resource
    Electronic Resource
    Editorial (1994)
    Springer
    Microsystem technologies 1 (1994), S. 1-1 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF01367753
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 36
    Electronic Resource
    Electronic Resource
    Encapsulated micro mechanical sensors (1994)
    Springer
    Microsystem technologies 1 (1994), S. 2-9 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract Encapsulated micro mechanical sensors were fabricated using glass-silicon anodic bonding and an electrical feedthrough structure. Two parallel plates which can be used not only for capacitive sensors but also electrostatic actuators are adopted for integrated sensors as capacitive pressure sensors, accelerometers and resonating sensors. Micromachining technologies were developed for these packaged micro sensors. These include silicon etching technologies as laser assisted etching, deep RIE and in-process thickness monitoring during wet etching. Anodic bonding technologies which enable to incorporate a circuit inside the package and to keep a sealed cavity at a high vacuum are also developed.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF01367754
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 37
    Electronic Resource
    Electronic Resource
    Technology tools for a high precision accelerometer in bulk micromechanics (1994)
    Springer
    Microsystem technologies 1 (1994), S. 10-13 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract The high precision accelerometer consists of 5 silicon wafers and packages by silicon fusion bonding. The sensor has a capacitance measuring principle and works in an open loop or closed loop operation mode. The etching process for the realization of thin beams and seismic mass, the silicon fusion bonding and the metallization process are described.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF01367755
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 38
    Electronic Resource
    Electronic Resource
    Monte Carlo modelling of electron beam lithography: a scaling law (1994)
    Springer
    Microsystem technologies 1 (1994), S. 23-29 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract The Π theorem of Dimensional Analysis, usually applied to the inference of physical laws, is for the first time applied to the derivation of interpolation curves of numerical data, leading to a simplified dependence on a reduced number of arguments Π, dimensionless combination of variables. In particular, Monte Carlo modelling of electron beam lithography is considered and the backscattering coefficient η addressed, in case of a general substrate layer, in the elastic regime and in the energy range 5 to 100 keV. The many variables involved (electron energy, substrate physical constants and thickness) are demonstrated to ultimately enter in determining η through asingle dimensionless parameter Π0. Thus, a scaling law is determined, an important guide in microsystem designing, indicating, if any part of the configuration is modified, how the other parameters should change (or “scale”) without affecting the result. Finally, a simple law η=83 Π0 is shown to account for all variations of the parameters over all substrates of the periodic table.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF01367757
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 39
    Electronic Resource
    Electronic Resource
    Experimental and numerical investigations of thermo-mechanically stressed micro-components (1994)
    Springer
    Microsystem technologies 1 (1994), S. 14-22 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract Reliability and functionality of microsystems, i.e. of small scale integrated electronic, mechanical and optical components, largely depend on their mechanical and thermal constitution. Thermo-mechanical aspects of component and system reliability become more and more important with growing miniaturization as the local physical parameters and field quantities show an increase in sensitivity due to inhomogeneities in local stresses, strains and temperature fields. Since there is usually a lack of information about the local material parameters, a pure field simulation cannot, as a rule, solve the problem. The state of the art of microsystem design more and more requires direct “coupling” between simulation tools (including e.g. FE modelling) and advanced physical experiments. The authors have combined various laser technique, scanning microscopy, and X-ray diffraction with numerical field simulation. The investigations have been directed towards current problems of mechanical and thermal reliability in electronic packaging, crack and fracture behaviour within the interconnected regions and life time estimation. Special problems of mechanical behaviour in solder joints are discussed taking into account local plasticity as well as creep effects.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF01367756
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 40
    Electronic Resource
    Electronic Resource
    Process technology for the modular integration of CMOS and polysilicon microstructures (1994)
    Springer
    Microsystem technologies 1 (1994), S. 30-41 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract Modular fabrication of polysilicon surface-micromachined structures after completion of a conventional CMOS electronic process is described. Key process steps include tungsten metallization with contact diffusion barriers, LPCVD oxide and nitride passivation of the CMOS, rapid thermal processing for stress-relief annealing of the structural polysilicon film, implementation of a sacrificial spin-on-glass planarization, and the final microstructure release in hydrofluoric acid. Modularity of the process enables independent modification of either the CMOS or the microstructure process sequences. This technology is used in the fabrication of various types of sensors and actuators.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF01367758
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 41
    Electronic Resource
    Electronic Resource
    An integrated interfacing circuit for capacitive sensors (1994)
    Springer
    Microsystem technologies 1 (1994), S. 42-47 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF01367759
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 42
    Electronic Resource
    Electronic Resource
    Glucose measurement using a micromachined open tubular heterogeneous enzyme reactor (MOTHER) (1994)
    Springer
    Microsystem technologies 1 (1994), S. 48-50 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF01367760
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 43
    Electronic Resource
    Electronic Resource
    Thermal bubble powered microactuators (1994)
    Springer
    Microsystem technologies 1 (1994), S. 51-58 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract Thermal bubble powered micro mechanical actuators have been successfully demonstrated in working liquids. Micro mechanical plates which function as the mechanical actuators are 70×60×2 μm3 in size. They have been fabricated by surface-micromachining technology and suspended 2 μm above the substrate by the supports of cantilever beams. Micro thermal bubbles which are generated by heavily phosphorus doped polysilicon line resistive heaters have been used to lift the mechanical plates in a controllable manner. The typical current required to generate a single, spherical thermal bubble as the actuation source on top of the micro line resistors (60×2×0.3 μm3 in size) is 8.4 mA (80 m Watt) in FC 43 liquid (an inert, dielectrical fluid available from the 3M company). The thermal bubbles have been demonstrated to actuate the mechanical plate perpendicularly to the substrate with a maximum elevation distance of 140 μm and a maximum actuation force of 2 μN. This new actuation mechanism is expected to find applications for micro fluidic devices.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF01367761
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 44
    Electronic Resource
    Electronic Resource
    A microsystem design process (1995)
    Springer
    Microsystem technologies 1 (1995), S. 68-70 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract The design of microsystems is, because of the enormous variety of possible components and materials, and therefore of very high complexity within the whole system, a problem, that can only be solved with a continuous design concept [1] [2] [3]. The structure and the contents of such a concept must fit to a scope of application as wide as possible. On the one hand a strongly specialized form of a design concept, as in the microelectronics field, is not possible or useful here, on the other hand a much too generalized concept will bring problems in the practical application. The following contribution tries to show a possible solution for this very complex problem. In form of a design-flow-diagram there is given a step-by-step description of the various points, that are necessary for a microsystem design process. As a result, a complete concept, is shown that leads the designer from the customer's demands through the fictive microsystem to the pilot series.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF01624465
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 45
    Electronic Resource
    Electronic Resource
    Micro- and integrated optical devices in glasses and polymers for hybride integration into microsystems (1995)
    Springer
    Microsystem technologies 1 (1995), S. 59-67 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract Micro- and integrated-optical devices in glass and polymers are integrated increasingly in microsystems. Design and simulation of such optical elements are well developed. Ray tracing and a manifold of propagation and field calculation methods are available. First steps to CAD have been done. Using Ag+−Na+ ion exchange in special optical glasses, one-and two-dimensional refractive index profiles of definite shape have been realezed. Good quality one-dimensional profiles can be used for micro-cylindrical lens fabrication (N.A.≥0.5), two dimensional index gradients have been used for phase grating fabrication. E-beam direct writing with variable shaped beam has been used successfully to realize different types of surface corrugated microoptical components. Embossing in polymers is a well suitable method for fabrication of passive integrated-optical devices and of micro-optical elements as refractive and diffractive lenses and lens arrays, corrugated prisms and gratings. Applications of glass and polymer microoptical devices have been demonstrated for laser diode collimation, in miniaturized interferometers, beam deflectors and modulators.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF01624464
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 46
    Electronic Resource
    Electronic Resource
    Micromachined infrared pneumatic detector for gas sensor (1995)
    Springer
    Microsystem technologies 1 (1995), S. 71-74 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract We present a micromachined IR detector based on the principle of a pneumatic cell and suited as an IR detector in a miniaturised gas sensor. The detector basically consists of a sealed cavity, in which the heat generated by absorbed IR light results in an increased gas pressure. This pressure rise is detected capacitively. The theoretical performance of a 1 mm2 micromachined device is calculated, and it is shown that a detectivity of 3.6·109 cm. Hz1/2/W can be expected. Moreover, a pneumatic gas leak is proposed to avoid thermal drift. Using conventional Silicon micromachining techniques, a prototype was fabricated which confirmed the principle of operation., The experimental results are compared to the theory.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF01624466
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 47
    Electronic Resource
    Electronic Resource
    Low-cost pressure sensor microsystem (1995)
    Springer
    Microsystem technologies 1 (1995), S. 84-87 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF01624468
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 48
    Electronic Resource
    Electronic Resource
    Biosensors for analytical microsystems (1995)
    Springer
    Microsystem technologies 1 (1995), S. 75-83 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract A modular concept for analytical microsystems with separately developed and optimized components is proposed, where parts can be easily substituted. Since the system should be universal hybrid integration is preferred over monolithic fabrication technology. The biosensor as an essential part of an analytical microsystem is commonly restricted in its functional stability due to the lifetime of the biological component and the adhesion of the sensitive layer at the transducer. Optimum design requirements have to be derived from the particular system to be measured. For the optimization of the (bio)sensor the polymer matrix carrying or covering the enzyme has been modified, the transducer design itself has been varied, and enzymes have been coupled.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF01624467
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 49
    Electronic Resource
    Electronic Resource
    Recent progress of microactuators and micromotors (1995)
    Springer
    Microsystem technologies 1 (1995), S. 93-97 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract This paper gives a concise review of IC-compatible micromachining technologies and various types of microactuators fabricated by such technologies. A system architecture oriented to micro systems is proposed. Promising fields of application are briefly overviewed.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF01624470
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 50
    Electronic Resource
    Electronic Resource
    A system to measure 3-directional relative displacements for a biomedical application (1995)
    Springer
    Microsystem technologies 1 (1995), S. 88-92 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract A micro system for measuring the relative displacements between a bone and an implant in a prosthetic hip of a human being has been realized. Novel are the small dimensions of the system combined with the possibility to measure relative displacements in three directions. The system consists of a microsensor body, a mechanical transducer element made by precision mechanics, electronics, and the final package. The realization and test results of a prototype system are presented. Typical ranges for these prototypes are ±500 μm for lateral directions and ±50 μm in axial direction.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF01624469
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 51
    Electronic Resource
    Electronic Resource
    A study on micro force sensors for microhandling systems (1995)
    Springer
    Microsystem technologies 1 (1995), S. 105-110 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF01294799
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 52
    Electronic Resource
    Electronic Resource
    3D optimization of average torque of electrostatic micromotors (1995)
    Springer
    Microsystem technologies 1 (1995), S. 98-103 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract The paper presents a technique to optimize electrostatic micromotors. The finite element technique is combined with different types of optimization strategies, one of them, a version of the evolution strategy is discussed. It further involves an automated generation of 3D meshes where the dimensions and rotor positions of the motor models can be chosen arbitrarily. It also involves constructing equivalent circuit models for the electrostatic motors. Both, the automated 3D mesh generation and the construction of the equivalent circuit model are treated in detail in this paper. The possibilities of producing powerful tools in the field of optimization are described, but also some warnings and limitations concerning the automated optimization are mentioned.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF01624471
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 53
    Electronic Resource
    Electronic Resource
    Micromechanical structures for optical fibers in board (1995)
    Springer
    Microsystem technologies 1 (1995), S. 111-114 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract This project develops an electro-optical board technology based on the combination of discrete wiring and glass optical fibers. Such a board provides optical parallel interconnects. Meaning that 16 optical fibers will be led simultaneously in and out the board from the incomming links to the transmitter and receiver modules mounted on this board. This technology is expected to fulfil the needs of next generation broadband exchanges concerning high data rate flow. As the ligning-up of the fibers requires severe dimensional tolerances, we have to enter the field of the micromechanica. The most critical parts will therefore be manufactured with the LIGA technique. The first generation of models produced and tested by Alcatel Bell Telephone proved that this concept is perfectly feasible.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF01294800
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 54
    Electronic Resource
    Electronic Resource
    Crystallographic and transport properties of lithium ferrite epitaxial films grown by pulsed laser deposition (1995)
    Springer
    Microsystem technologies 1 (1995), S. 115-120 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract We show that good quality epitaxial films of magnetic lithium ferrite can be grown by pulsed laser deposition technique either using an XeCl excimer laser or a Nd-YAG laser. The use of the excimer laser allows to grow films with a better surface morphology but does not improve the magnetic properties of films. Structural and electrical transport measurements give indirect evidence of the incorporation of lithium in the structure. The as grown electrical resistivity (about 104Ω/cm) and its activation energy are typical of well compensated spinels. Vibrating sample magnetometer and ferromagnetic resonance measurements were used to characterize the film magnetic and microwave properties.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF01294801
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 55
    Electronic Resource
    Electronic Resource
    A two-chip accelerometer system for automotive applications (1995)
    Springer
    Microsystem technologies 1 (1995), S. 121-123 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract A two-chip accelerometer system has been designed, manufactured, and assembled in a standard dual-in-line plastic package. A capacitive sensing element is built on one chip and signal processing circuitry on a separate chip. The sensing element is designed in the form of a differential capacitor pair made from three highly doped polysilicon layers using surface micromachining technology. The circuitry is fabricated using a 1.75 μm CMOS technology and includes amplification, EPROM trim, filtering, and self-test functions. The system is designed for 50 g full scale acceleration, and operates in an open loop mode.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF01294802
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 56
    Electronic Resource
    Electronic Resource
    Integration of 3-D shape construction and assembly to realize micro systems (1995)
    Springer
    Microsystem technologies 1 (1995), S. 124-128 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract In order to make micro 3-D structures, we are designing a table-sized factory, namely “Nano Manufacturing World (NMW)”. In NMW, we challenged to use a new process fused by semiconductor process for preciseness and machine process for 3-dimensionality. In order to realize the new process, we designed three new mechanisms in this paper: multi-face shape making beam, co-focus rotational robot and micro mechanical tools. Through an evaluation to actually make a micro “Gojunoto” with the mechanisms, we confirmed their validities for functions of integration of 3-D shape construction and assembly.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF01294803
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 57
    Electronic Resource
    Electronic Resource
    Announcements (1995)
    Springer
    Microsystem technologies 1 (1995), S. 142-142 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF01294806
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 58
    Electronic Resource
    Electronic Resource
    Adhesive stabilised and pure flip chips on various substrates under thermocycling (1995)
    Springer
    Microsystem technologies 1 (1995), S. 129-136 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract The paper presents numerical simulations and experimental investigations of flip chip modules having silicon, alumina ceramics, polyimide or polyester foil, or epoxy glass laminates as substrate material under thermo cycle test conditions. Some of the flip chip modules were stabilised additionally by filling the remaining gap between chip and substrate with an epoxy underfiller. The presented results concern the stress distribution in the joints as basis of their shape optimisation for the modules without underfiller as well as the evaluation of the metallographic cross-sections of the joints before and after the thermo cycles. Both, the simulations and the experiments, lead to the unambiguous result: The flip chip modules can be made reliable enough for industrial application in all cases with the help of the underfiller.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF01294804
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 59
    Electronic Resource
    Electronic Resource
    High aspect ratio fabrication method using O2 RIE and electroplating (1995)
    Springer
    Microsystem technologies 1 (1995), S. 137-142 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract A polyimide-based process for the fabrication of vertical structures with high aspect ratio has been developed. O2 reactive ion etching (O2 RIE) has been employed in the polyimide processing. Achieved etching characteristics of the O2 RIE system are: 4.0 μm/min etching rate, 15 aspect ratio, 75 μm etching depth. Polyimide has excellent chemical and thermal properties which makes it a good building material for micromachines. Polyimide could be also used as molds for electroplating. Electroplated copper structures were formed in the polyimide molds and metal gears were fabricated by these fabrication technologies. New possibilities for micromachining were opened by the use of O2 RIE and electroplating.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF01294805
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 60
    Electronic Resource
    Electronic Resource
    A new type humidity sensor using micro-air-bridge heaters (1995)
    Springer
    Microsystem technologies 1 (1995), S. 143-148 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract A new type absolute-humidity sensor with very quick response, very small power consumption and high sensitivity, which is based on the detection of the thermal conductivity change in humid air at heated temperature above 400°C, has been developed and demonstrated. Since this new type absolute-humidity sensor is able to be easily heated up above 400°C within 30–40 msec because of a micro-air-bridge heater structure, the surface of its sensing area is refreshed by burning out adsorbed dusts, oil, etc. Thermal conductivity λmix of mixed gas expressed by Sutherland-Wassiljewa equation is applied to the humid air to study this absolute humidity sensor. Only a single micro-air-bridge heater operation driven by double pulse-currents for this humidity sensor is also proposed.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF01294807
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 61
    Electronic Resource
    Electronic Resource
    Atomic scale simulation of silicon anisotropic chemical etching (1995)
    Springer
    Microsystem technologies 1 (1995), S. 163-167 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF01371489
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 62
    Electronic Resource
    Electronic Resource
    Construction of Nano Manufacturing World (1995)
    Springer
    Microsystem technologies 1 (1995), S. 155-162 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract In order to open a nanometer region to humans, we introduce a working system newly designed, namely, “Nano Manufacturing World (NMW)”. We are designing the NMW through the following sequence: definition of required performance, analysis for functional elements, proposal of mechanism elements, development of structural elements and synthesis of total structure. Analyzing some future applications of NMW in the fields of information technology, medical science, micro mechanics etc., we clarified that preciseness and 3-dimensionality are important for NMW. To satisfy them, we applied a new fused process of semiconductor processing and normal machine processing. We introduced prototypical mechanism elements, results of their trials for nano manufacturing and the direction of future NMW.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF01294809
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 63
    Electronic Resource
    Electronic Resource
    Smart sensors (1995)
    Springer
    Microsystem technologies 1 (1995), S. 149-154 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract The term “Smart Sensors”, one of the most strategic devices of Micro System Technologies (MST), refers to sensors which contain both sensing and signal processing capabilities with objectives ranging from simple viewing to sophisticated remote sensing, surveillance, search/track, weapon guidance, robotics, perceptronics and intelligence applications. This paper deals specifically with a new class of smart sensors in infrared spectral bands whose development started some years ago, when it was recognized that the rapid advances of “very large scale integration” (VLSI) processor technology and mosaic infrared detector array technology could be combined to develop a new generation of infrared smart sensor systems with much improved performances. Sophisticated signal processing operations have been studied for these new systems by integrating microcomputers and other VLSI signal processors within or next to the sensor arrays on the same focal plane, avoiding computing systems located far away from sensors. Recently, this approach has being upgraded by introducing inside the sensor some of the basic function of living eyes, such as dynamic stare, dishomogenity compensation, spatial and temporal filtering. New objectives and requirements and the relevant microsystems technologies are presented for this type of new infrared smart sensors which has been originally developed by us.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF01294808
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 64
    Electronic Resource
    Electronic Resource
    Microsystems for independent parallel chemical and biological processing (1995)
    Springer
    Microsystem technologies 1 (1995), S. 168-172 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract Modern microsystem application is concentrated on the development of microstructured sensors and actuators in integrated devices. Examples of that approach are microoptical components for endoscopic surgery, sensors and micropumps in integrated liquid analysers for pollution measurements. Often microsystems replace normal systems like commercially available piston pumps by silicon made liquid pumps in the hope of reducing costs but there is a lack of finding new applications. In contrast our approach of combining special developed microcompartments constructed with transparent membranes or microsieves and microdosing systems based on the ink jet principle together with optical devices like CCD cameras allow to overcome a real bottleneck in the new field of evolutionary biotechnology, the problem of screening a huge number of samples at a reasonable price. The goal of this approach is to design new molecules like enzymes by means of Darwinian evolution i.e. mutation and selection. In applying the selection principle to self amplifying entities like cell populations, viruses or self-replicating molecules under controlled selection pressures there is an absolute need to process large numbers of these entities in parallel. Preferentially this can be done in arrays of different microstructured compartments. The selection process is designed that it leads to products which are optimized in regard of specific applications. Within the scope of this approach chemical products are deterministically synthesized in spatially adressable compartments by multihead microdrop systems.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF01371490
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 65
    Electronic Resource
    Electronic Resource
    Materials development for thin film actuators (1995)
    Springer
    Microsystem technologies 1 (1995), S. 178-184 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract In the development of microsystems, actuators are required which can be triggered in various different ways. The actuating principles to be used are magnetostriction, the inverse piezoelectric effect, the shape memory effect, and the bimetallic effect. The variables triggered in these cases are magnetic fields, electric fields, or temperature changes. Thin film actuators are of special interest for the development of microsystems, as they can be easily scaled down to the μm-range and as their manufacturing is compatible to microsystem fabrication processes. The common property of these materials is their ability to transform electrical into mechanical energy by the effects mentioned above. Of special interest are magnetostrictive or piezoelectric materials as they allow energy transformation in both directions. These inverse effects can therefore be employed as sensoric mechanism for mechanical sensors (e.g. for stress, pressure, torque) as well. The report contains a discussion of various PVD techniques sucessfully used for producing magnetostrictive films (TbFe, TbDyFe, SmFe), piezoelectric films (PbtiO3, ZnO, AlN), shape memory films (TiNi, TiNiPd, TiPd) and bimetallic film composites (e.g. FeNi20Mn6-FeNi42). The properties of these layers are presented and compared. Possible applications and future development are outlined.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF01371492
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 66
    Electronic Resource
    Electronic Resource
    Model transformation for coupled electro-mechanical simulation in an electronics simulator (1995)
    Springer
    Microsystem technologies 1 (1995), S. 173-177 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract The simulation of microsystems requires to handle the close coupling between electronical and mechanical components. This interaction between electronics and mechanics often is an inherent and essential property of such systems. Therefore, dynamical electro-mechanical simulations are indispensable for the examination of the system behavior. For this purpose, we developed a method which enables dynamical electro-mechanical simulations within an electronical circuit simulator. To accomplish this, the mechanical behavior of the system is modeled through electronical devices. This modeling process is automated by the CAD-tool MEXEL which translates systems of (partial) differential and algebraical equations to SPICE-3 netlists. In this way, electro-mechanical systems can be handled with one simulator and one simulation approach. Problems caused by coupling different simulators do not occur any more. All reported approaches, e.g. Herbert (1992) or Paap et al. (1993), are restricted to the simulation of ordinary differential equations within a circuit simulator. We extend this work to system descriptions including partial differential equations by applying the method of finite differences. The suitability of our method is shown by dynamical simulation of a capacitive pressure sensor system including its readout circuitry.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF01371491
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 67
    Electronic Resource
    Electronic Resource
    Static and dynamic test methods for thin mono- and polycrystalline Si-films (1995)
    Springer
    Microsystem technologies 1 (1995), S. 185-190 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract We present nondestructive optical methods for the characterization of thin (〈30 μm) mono-and polycrystalline Si-films. The thickness and homogeneity will be measured with reflectance interferometry. This method is suitable for the end point detection during the etching process of monocrystalline Si. The application of laser absorption for the measurement of the thickness is also discussed. Michelson interferometry is applied for the characterization of the dynamic behavior of thin Si-films. We have analyzed the amplitude and the function of the oscillatory motion after acoustic and electrical excitation.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF01371493
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 68
    Electronic Resource
    Electronic Resource
    Monolithic bridge-on-diaphragm structure for pressure sensor applications (1995)
    Springer
    Microsystem technologies 1 (1995), S. 191-195 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract Monolithically clamped bridge-on-diaphragm (BOD) structures for pressure sensor applications were fabricated by means of Nd: YAG-laser micromachining and anisotropic KOH-etching techniques. The pressure/frequency-dependence of the BOD structures was measured by acoustical resonance excitation and optical detection of the microbridge and applying an external pressure between-0.8 bar and+1 bar to the diaphragm. In this vacuum/atmospheric pressure range the pressure/frequency-characteristic is quite linear with a sensitivity of about 4.5 kHz/bar and a fundamental bridge resonance frequency of 82 kHz. Extensive finite-element modelling has been carried out to optimize the geometrical dimensions of the BOD structures with respect to maximum sensitivity and pressure range. Using the same BOD structure layout it is possible to realize pressure sensors with applications ranging from 0.5 to 12 bar by only varying the thickness of the diaphragm. Varying the BOD structure layout to smaller dimensions the pressure sensors can be operated up to 100 bar with sensitivities of about 141 Hz/bar.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF01371494
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 69
    Electronic Resource
    Electronic Resource
    Fabrication of relief-topographic surfaces with a one-step UV-lithographic process (1995)
    Springer
    Microsystem technologies 1 (1995), S. 196-201 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract This paper reports on a study of a methodology for fabrication of arbitrarily shaped silicon structures using technologies common to standard IC manufacturing processes. Particular emphasis is put on the design and use of halftone transmission masks for the lithography step required in the fabrication process of mechanical, optical or electronics components. The design and experimental investigation of gray-tone masks was supported by lithography simulation. Results are presented for both, simulated gray-tone patterns as well as experimental profiles.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF01371495
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 70
    Electronic Resource
    Electronic Resource
    Micromechanical elements for detection of molecules and molecular design (1995)
    Springer
    Microsystem technologies 1 (1995), S. 202-208 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract Photolithographic preparation of thin films and stacks of them were combined with anisotropic silicon etching and free standing film technology in order to realize three dimensional micro components for studies in detection and optimization of biomolecules. A polymer based SFM sensor was developed and tested in the measurement of thin film roughness and in the detection of holes in molecular films as well as in the detection of single DNA molecules. This “novolever” shows surprisingly high mechanical stability and provides high resolution SFM images of sensible molecules. Experimental arrangements of miniaturized chemical parallel processing for combinatorial and evolutionary synthesis strategies including silicon micro compartment arrays with free standing optical membranes and thin film filters have been proposed and the manufacturing of micro compartment arrays is described.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF01371496
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 71
    Electronic Resource
    Electronic Resource
    The effect of residual solvent on the profiles of thick positive DNO-photoresist for Microsystem Technologies (1996)
    Springer
    Microsystem technologies 2 (1996), S. 50-55 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract  To fabricate microstructures with heights between 10 and 100 μm and smallest structural dimensions of several micrometers optical lithography is widely used. In this case positive photoresists of the DQN-type together with contact printing have been used by various groups to produce templates for electroplating. A common feature of the resist processes described in the literature is a concave resist profile with the narrowest part at approximately 2/3 of the resist height. As the structure width becomes smaller, the vanishing of this neck determines the smallest structures that can be obtained. This corresponds to a maximum aspect ratio of about 6. Within a model for the resist development based on percolation theory, a quadratic dependence of the dissolution rate on the solvent concentration is postulated in the theoretical section. The solvent concentration may be measured by weighing samples before and after baking and the overall content may be varied by different baking times in the range between 10 and 25%. The measurement of the average dissolution rate qualitatively supports the quadratic dependence postulated by the theory. A depth resolved measurement of the dissolution rate shows a significantly reduced rate in the top 1/3 of unexposed resist which suggests that the solvent content in the top 1/3 is drastically reduced. Based on the model, a detailed discussion of various experimental effects of thick DNQ-resists follows. In particular, the dried surface of the resist is made responsible for the concave resist profile in the top parts while near the substrate details of exposure dose, resist bleaching and diffraction need to be taken into account. In view of fabricating microstructures using DQN-resists with a high aspect ratio near 10 and vertical sidewalls, the baking as well as resist performance and exposure optics will have to be optimized.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s005420050015
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 72
    Electronic Resource
    Electronic Resource
    International Conference on High Aspect-Ratio Microstructure Technology HARMST '95 (1996)
    Springer
    Microsystem technologies 2 (1996), S. 39-39 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF02447747
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 73
    Electronic Resource
    Electronic Resource
    Fabrication of stepped microoptical benches for fibre and free space applications (1996)
    Springer
    Microsystem technologies 2 (1996), S. 40-45 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract A modified LIGA process is well suited to fabricate hybrid mounted low-cost microoptical benches for fibre and free-space applications. The benches enable optical components to be assembled with lithographic precision in the LIGA plane without any active alignment. Due to the different sizes of the optical components, stepped substrates for X-ray lithography are required in order to guarantee a vertical alignment on the optical axis. Silicon and high-precision mechanical micromachining have been combined with the LIGA process to fabricate these benches. In addition, two alignment strategies were tested. For applications with single-mode fibres two examples, a bi-directional duplexer and a fibre-fibre-coupler with an imaging set-up, have been fabricated by deep X-ray lithography as well as by moulding techniques. The insertion losses are approx. 2 dB in case of the coupler and 5 dB for the laser diode/fibre coupling res. 0.5 dB for fibre/photo diode coupling in the duplexer. The experimental results demonstrate the excellent positioning quality and are promising for industrial applications. In the paper the various process techniques and the results of the precision measurements are presented. The opitcal performance of the set-ups is discussed.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF02447748
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 74
    Electronic Resource
    Electronic Resource
    The copolymer of methyl methacrylate and methacrylic acid as a sensitive resist for deep-etch X-ray lithography (1996)
    Springer
    Microsystem technologies 2 (1996), S. 46-49 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract The copolymer of methyl methacrylate and methacrylic acid was developed as a new sensitive resist for the LIGA (Lithographie, Galvanoformung, Abformtechnik) process. The resist exposures were carried out at the LIGA beamline of a superconducting compact light source NIJI-III. The absorbed energy density required to remove the entire exposed resist and produce a defect-free microstructure was between 0.4 and 7 kJ/cm3 (4 and 20 kJ/cm3 for PMMA). The sensitivity and patterning depth of the copolymer were 10 times and 3.5 times, respectively, those of poly methyl methacrylate (PMMA) assuming that both resists were exposed to synchrotron radiation (SR) of the same wavelength. Moreover, the copolymer showed high contrast and process stability.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF02447749
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 75
    Electronic Resource
    Electronic Resource
    Synchrotron radiation analysis of microstructures (1996)
    Springer
    Microsystem technologies 2 (1996), S. 56-62 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract the outstanding spectral and spatial characteristics of synchrotron radiation make it a powerful analytical tool in microstructure technology. We apply absorption spectroscopy to study foils of electroplated Permalloy (NiFe), and of nickel phosphorus, because they are of interest to microfabrication for their soft magnetic properties and their selective etching behaviour, respectively. In particular, we show that in the electroplated Permalloy foils Ni keeps the structure of pure Ni while Fe changes from b.c.c. to f.c.c. NiP foils become increasingly amorphous with growing P content. In this way, radial elemental distributions which determine magnetic or other properties can be monitored sensitively to improve electroplating process control, even in situ. We also measure the radial thickness profile of a gold layer sputtered on top of a chromium coated silicon wafer. This technique might be extended to measure a given layer in a multilayer structure selectively and non-destructively even when hidden or opaque.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF02447751
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 76
    Electronic Resource
    Electronic Resource
    The effect of residual solvent on the profiles of thick positive DNO-photoresist for Microsystem Technologies (1996)
    Springer
    Microsystem technologies 2 (1996), S. 50-55 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract To fabricate microstructures with heights between 10 and 100 μm and smallest structural dimensions of several micrometers optical lithography is widely used. In this case positive photoresists of the DQN-type together with contact printing have been used by various groups to produce templates for electroplating. A common feature of the resist processes described in the literature is a concave resist profile with the narrowest part at approximately 2/3 of the resist height. As the structure width becomes smaller, the vanishing of this neck determines the smallest structures that can be obtained. this corresponds to a maximum aspect ratio of about 6. Within a model for the resist development based on percolation theory, a quadratic dependence of the dissolution rate on the solvent concentration is postulated in the theoretical section. The solvent concentration may be measured by weighing samples before and after baking and the overall content may be varied by different baking times in the range between 10 and 25%. The measurement of the average dissolution rate qualitatively supports the quadratic dependence postulated by the theory. A depth resolved measurement of the dissolution rate shows a significantly reduced rate in the top 1/3 of unexposed resist which suggests that the solvent content in the top 1/3 is drastically reduced. Based on the model, a detailed discussion of various experimental effects of thick DNQ-resists follows. In particular, the dried surface of the resist is made responsible for the concave resist profile in the top parts while near the substrate details of exposure dose, resist bleaching and diffraction need to be taken into account. In view of fabricating microstructures using DQN-resists with a high aspect ratio near 10 and vertical sidewalls, the baking as well as resist performance and exposure optics will have to be optimized.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF02447750
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 77
    Electronic Resource
    Electronic Resource
    Tribological investigations of LIGA-microstructures (1996)
    Springer
    Microsystem technologies 2 (1996), S. 63-70 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract The performance and lifetime of micro electro mechanical systems (MEMS) is strongly affected by friction and wear. We therefore analysed the friction and wear characteristics of microstructures produced by the LIGA-process. The measurements were carried out in a special designed microtribometer, which is capable to work inside a scanning electron microscope (SEM), and hence offering the possibility of a high resolution in-situ observation of the microscopic tribological mechanism during operation of the system. The material combinations investigated were chosen in order to represent the most important tribological junctions occurring in the ‘micro-motor’ and ‘micro-turbine’ currently produced by the LIGA-technique. We studied the tribological properties of nickel-nickel micro components (LIGA-side-wall/LIGA-sidewall and LIGA-bottom side/LIGA-top side), as well as nickel micro components (bottom side)-Al2O3-ceramic substrates (contact between rotor-base). The results indicate a strong influence of the relative humidity level (RHL) on the friction and wear properties of the metal/ceramic as well as of the metal/metal contacts appearing in the LIGA-MEMS, showing the lowest level of friction and wear at high RHL-values. We also found out that the friction and wear parameters were highly influenced by the applied surface pressure. Changing the surface pressure results in the formation of different kinds of wear debris accumulating or smearing out in the wear track. The metal oxides produced hereby in the wear track can lower adhesion and thus reduce the friction of the system.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF02447752
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 78
    Electronic Resource
    Electronic Resource
    Studies of the adhesion properties of LIGA microstructures by X-ray spectroscopy and mechanical measurements (1996)
    Springer
    Microsystem technologies 2 (1996), S. 71-74 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract In the first step of the LIGA process microstructures with high aspect ratios are fabricated by patterning a resist layer with deep etch X-ray lithography. As resist typically PMMA (polymethylmethacrylate) is used. For the following electroforming process and to achieve perfect microstructures the adhesion of the PMMA on the substrates is of great importance. For a better understanding the adhesion mechanism, particular induced through the adhesion promoter MEMO (methacryloxypropyl-trimethoxysilane) was investigated on various substrates. Two methods, namely XANES/EXAFS spectroscopy under grazing incidence and shear stress measurements were modified for the specific needs of microstructures. Our studies proved that the adhesion strength is determined by two factors. A rough surface, which allows mechanical interlocking, increases the adhesion strength by about 10%. The larger part of the adhesion strength is determined by formation of chemical bonds when adding an adhesion promoter. E.g. addition of 5% adhesion promoter increases the adhesion strength by 90%. These results were, as far as possible, confirmed by the X-ray spectroscopical measurements.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF02447753
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 79
    Electronic Resource
    Electronic Resource
    Dimensional measurement of micro mechanical components with HAR (1996)
    Springer
    Microsystem technologies 2 (1996), S. 75-78 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract This paper describes a new type of interferometer which may be used for 2D and 3D surface profiling of optically rough surfaces. The system uses a wide band, low coherence light for this purpose. The brightness of the interference fringes falls from a peak to zero on profile amplitude differences which are greater than the coherence length of the light used. The brightness variations within the interference packer are digitally signal processed to extract surface position information. In addition a surface measurement system based around an autofocus sensor will be described.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF02447754
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 80
    Electronic Resource
    Electronic Resource
    A source of kolovolt X-ray (1996)
    Springer
    Microsystem technologies 2 (1996), S. 79-82 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF02447755
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 81
    Electronic Resource
    Electronic Resource
    Light opitcal deformation measurements in microbars with nanometer resolution (1996)
    Springer
    Microsystem technologies 2 (1996), S. 83-91 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract In a microsample tensile test the deformation of the testing region is observed with a light microscope. Using a new vision algorithm, elongations are determined with nanometer resolution. The image analysis system operates with adaptive least squares correlation and contains a diagnostic tool which provides information about the computational precision and determinability of the parameters to be estimated. Various tests are performed to verify the reliability and sensitivity of the presented method and to show its potential in the field of micromechanics.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF02447756
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 82
    Electronic Resource
    Electronic Resource
    International Conference on High Aspect-Ratio Microstructure Technology HARMST ’95 (1996)
    Springer
    Microsystem technologies 2 (1996), S. 39-39 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s005420050012
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 83
    Electronic Resource
    Electronic Resource
    Determination of Young's modulus and residual stress of electroless nickel using test structures fabricated in a new surface micromachining process (1996)
    Springer
    Microsystem technologies 2 (1996), S. 92-96 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract This paper reportsin situ measurement of Young's modulus and residual stress of electroless nickel films through the use of microfabricated nickel test structures, including electrostatic microactuators and passive devices. Th test structures are fabricated in a new surface micromachining process, termed “nickel surface micromachining”, using electroless plated nickel as the structural layer and polysilicon as the sacrificial layer. Subsequent to fabrication, lateral resonant-type electrostatic microactuators of different geometries are resonated by electrical excitation. Using the measured resonant frequencies and knowledge of the device geometry, the Young's modulus of the film is determined. The passive electroless nickel microstructures deform upon completion of the fabrication process due to residual stress in the film. Measurement of this deformation in conjunction with an appropriate mechanical model is used to determine the residual stress in the films.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF02447757
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 84
    Electronic Resource
    Electronic Resource
    Stereolithography and microtechniques (1996)
    Springer
    Microsystem technologies 2 (1996), S. 97-102 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract The laser stereophotolithography is a process which allows the manufacture of 3D parts by a light-induced space-resolved polymerization. In view to obtain microparts, it is necessary on one hand to reduce the polymerization depth and on the other hand the polymerization width in thex-y plane. The addition of an unreactive highly absorbing chemical succeeded in a significant reduction of the polymerization depth (8 to 10 times thinner). We studied the influences of the light flux, of the initiator and the absorbing unreactive chemical concentrations. The experimental data are in good agreement with the theoretical model. The narrowing of the width is disappointing except with one resin. These results nevertheless led us to set up a new apparatus to reduce the beam diameter by a factor of ten. Despite the increase of the light flux, some of the first results are promising.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF02447758
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 85
    Electronic Resource
    Electronic Resource
    Fabrication of stepped microoptical benches for fibre and free space applications (1996)
    Springer
    Microsystem technologies 2 (1996), S. 40-45 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract  A modified LIGA process is well suited to fabricate hybrid mounted low-cost microoptical benches for fibre and free-space applications. The benches enable optical components to be assembled with lithographic precision in the LIGA plane without any active alignment. Due to the different sizes of the optical components, stepped substrates for X-ray lithography are required in order to guarantee a vertical alignment on the optical axis. Silicon and high-precision mechanical micromachining have been combined with the LIGA process to fabricate these benches. In addition, two alignment strategies were tested. For applications with single-mode fibres two examples, a bi-directional duplexer and a fibre-fibre-coupler with an imaging set-up, have been fabricated by deep X-ray lithography as well as by moulding techniques. The insertion losses are approx. 2 dB in case of the coupler and 5 dB for the laser diode/fibre coupling res. 0.5 dB for fibre/photo diode coupling in the duplexer. The experimental results demonstrate the excellent positioning quality and are promising for industrial applications. In the paper the various process techniques and the results of the precision measurements are presented. The optical performance of the set-ups is discussed.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s005420050013
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 86
    Electronic Resource
    Electronic Resource
    The copolymer of methyl methacrylate and methacrylic acid as a sensitive resist for deep-etch X-ray lithography (1996)
    Springer
    Microsystem technologies 2 (1996), S. 46-49 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract  The copolymer of methyl methacrylate and methacrylic acid was developed as a new sensitive resist for the LIGA (Lithographie, Galvanoformung, Abformtechnik) process. The resist exposures were carried out at the LIGA beamline of a superconducting compact light source NIJI-III. The absorbed energy density required to remove the entire exposed resist and produce a defect-free microstructure was between 0.4 and 7 kJ/cm3 (4 and 20 kJ/cm3 for PMMA). The sensitivity and patterning depth of the copolymer were 10 times and 3.5 times, respectively, those of poly methyl methacrylate (PMMA) assuming that both resists were exposed to synchrotron radiation (SR) of the same wavelength. Moreover, the copolymer showed high contrast and process stability.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s005420050014
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 87
    Electronic Resource
    Electronic Resource
    Synchrotron radiation analysis of microstructures (1996)
    Springer
    Microsystem technologies 2 (1996), S. 56-62 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract  The outstanding spectral and spatial characteristics of synchrotron radiation make it a powerful analytical tool in microstructure technology. We apply absorption spectroscopy to study foils of electroplated Permalloy (NiFe), and of nickel phosphorus, because they are of interest to microfabrication for their soft magnetic properties and their selective etching behaviour, respectively. In particular, we show that in the electroplated Permalloy foils Ni keeps the structure of pure Ni while Fe changes from b.c.c. to f.c.c. NiP foils become increasingly amorphous with growing P content. In this way, radial elemental distributions which determine magnetic or other properties can be monitored sensitively to improve electroplating process control, even in situ. We also measure the radial thickness profile of a gold layer sputtered on top of a chromium coated silicon wafer. This technique might be extended to measure a given layer in a multilayer structure selectively and non-destructively even when hidden or opaque.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s005420050016
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 88
    Electronic Resource
    Electronic Resource
    Tribological investigations of LIGA-microstructures (1996)
    Springer
    Microsystem technologies 2 (1996), S. 63-70 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract  The performance and lifetime of micro electro mechanical systems (MEMS) is strongly affected by friction and wear. We therefore analysed the friction and wear characteristics of microstructures produced by the LIGA- process. The measurements were carried out in a special designed microtribometer, which is capable to work inside a scanning electron microscope (SEM), and hence offering the possibility of a high resolution in-situ observation of the microscopic tribological mechanism during operation of the system. The material combinations investigated were chosen in order to represent the most important tribological junctions occurring in the ‘micro-motor’ and ‘micro-turbine’ currently produced by the LIGA-technique. We studied the tribological properties of nickel–nickel micro components (LIGA-sidewall/LIGA-sidewall and LIGA-bottom side/LIGA -top side), as well as nickel micro components (bottom side)– Al2O3-ceramic substrates (contact between rotor-base). The results indicate a strong influence of the relative humidity level (RHL) on the friction and wear properties of the metal/ceramic as well as of the metal/metal contacts appearing in the LIGA-MEMS, showing the lowest level of friction and wear at high RHL-values. We also found out that the friction and wear parameters were highly influenced by the applied surface pressure. Changing the surface pressure results in the formation of different kinds of wear debris accumulating or smearing out in the wear track. The metal oxides produced hereby in the wear track can lower adhesion and thus reduce the friction of the system.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s005420050017
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 89
    Electronic Resource
    Electronic Resource
    A source of kilovolt X-ray (1996)
    Springer
    Microsystem technologies 2 (1996), S. 79-82 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s005420050020
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 90
    Electronic Resource
    Electronic Resource
    Dimensional measurement of micro mechanical components with HAR (1996)
    Springer
    Microsystem technologies 2 (1996), S. 75-78 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract  This paper describes a new type of interferometer which may be used for 2D and 3D surface profiling of optically rough surfaces. The system uses a wide band, low coherence light for this purpose. The brightness of the interference fringes falls from a peak to zero on profile amplitude differences which are greater than the coherence length of the light used. The brightness variations within the interference packet are digitally signal processed to extract surface position information. In addition a surface measurement system based around an autofocus sensor will be described.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s005420050019
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 91
    Electronic Resource
    Electronic Resource
    Studies of the adhesion properties of LIGA microstructures by X-ray spectroscopy and mechanical measurements (1996)
    Springer
    Microsystem technologies 2 (1996), S. 71-74 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract  In the first step of the LIGA process microstructures with high aspect ratios are fabricated by patterning a resist layer with deep etch X-ray lithography. As resist typically PMMA (polymethylmethacrylate) is used. For the following electroforming process and to achieve perfect microstructures the adhesion of the PMMA on the substrates is of great importance. For a better understanding the adhesion mechanism, particular induced through the adhesion promoter MEMO (methacryloxypropyl-trimethoxysilane) was investigated on various substrates. Two methods, namely XANES/EXAFS spectroscopy under grazing incidence and shear stress measurements were modified for the specific needs of microstructures. Our studies proved that the adhesion strength is determined by two factors. A rough surface, which allows mechanical interlocking, increases the adhesion strength by about 10%. The larger part of the adhesion strength is determined by formation of chemical bonds when adding an adhesion promoter. E.g. addition of 5% adhesion promoter increases the adhesion strength by 90%. These results were, as far as possible, confirmed by the X-ray spectroscopical measurements.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s005420050018
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 92
    Electronic Resource
    Electronic Resource
    Light optical deformation measurements in microbars with nanometer resolution (1996)
    Springer
    Microsystem technologies 2 (1996), S. 83-91 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract  In a microsample tensile test the deformation of the testing region is observed with a light microscope. Using a new vision algorithm, elongations are determined with nanometer resolution. The image analysis system operates with adaptive least squares correlation and contains a diagnostic tool which provides information about the computational precision and determinability of the parameters to be estimated. Various tests are performed to verify the reliability and sensitivity of the presented method and to show its potential in the field of micromechanics.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s005420050021
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 93
    Electronic Resource
    Electronic Resource
    Determination of Young’s modulus and residual stress of electroless nickel using test structures fabricated in a new surface micromachining process (1996)
    Springer
    Microsystem technologies 2 (1996), S. 92-96 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract  This paper reports in situ measurement of Young’s modulus and residual stress of electroless nickel films through the use of microfabricated nickel test structures, including electrostatic microactuators and passive devices. Th test structures are fabricated in a new surface micromachining process, termed “nickel surface micromachining”, using electroless plated nickel as the structural layer and polysilicon as the sacrificial layer. Subsequent to fabrication, lateral resonant-type electrostatic microactuators of different geometries are resonated by electrical excitation. Using the measured resonant frequencies and knowledge of the device geometry, the Young’s modulus of the film is determined. The passive electroless nickel microstructures deform upon completion of the fabrication process due to residual stress in the film. Measurement of this deformation in conjunction with an appropriate mechanical model is used to determine the residual stress in the films.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s005420050022
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 94
    Electronic Resource
    Electronic Resource
    Stereolithography and microtechniques (1996)
    Springer
    Microsystem technologies 2 (1996), S. 97-102 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract  The laser stereophotolithography is a process which allows the manufacture of 3D parts by a light-induced space-resolved polymerization. In view to obtain microparts, it is necessary on one hand to reduce the polymerization depth and on the other hand the polymerization width in the x-y plane. The addition of an unreactive highly absorbing chemical succeeded in a significant reduction of the polymerization depth (8 to 10 times thinner). We studied the influences of the light flux, of the initiator and the absorbing unreactive chemical concentrations. The experimental data are in good agreement with the theoretical model. The narrowing of the width is disappointing except with one resin. These results nevertheless led us to set up a new apparatus to reduce the beam diameter by a factor of ten. Despite the increase of the light flux, some of the first results are promising.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s005420050023
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 95
    Electronic Resource
    Electronic Resource
    Fabrication of LIGA-Acceleration Sensors by Aligned Molding (1996)
    Springer
    Microsystem technologies 2 (1996), S. 104-108 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract  A technology for the fabrication of movable LIGA-Microstructures by molding was developed, which enables the cheaper production of e.g. LIGA-Acceleration Sensors [1]. For this purpose an aligned molding process had to be developed. The realized experimental setup consists of two subsystems, the molding machine and the alignment arrangement [2]. After aligning a substrate it is transported into the molding machine. An effective and extremely precise dimension translation system is required. Although during molding temperature changes appear and high forces are applied, the dimension stability during the molding process has to be guaranteed. The presented system and setup deals successfully with these conditions. An alignment quality of ±10 μm is realized. Using the aligned molding technology temperature compensated LIGA-acceleration sensors [1] were fabricated. The proper function of the sensors was demonstrated.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s005420050024
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 96
    Electronic Resource
    Electronic Resource
    High aspect ratio structures obtained by electroforming in microstructured glass (1996)
    Springer
    Microsystem technologies 2 (1996), S. 109-113 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract  The application of glass in the microsystems technology becomes more and more important. Therefore, it is necessary to combine special microstructurable glasses with various other materials (e.g. joining with silicon by anodic bonding, joining with metals by electroforming, joining with polymers by glueing, joining with various other glasses by brazing or diffusion welding). In order to increase the use of glass in the microsystems technology especially four fields of research are important: –development of special glasses with various properties –technologies of microstructuring –technologies of joining –application These four topics are main research fields performed at the Institute of Glass/Ceramics-Technology and will be described in this paper.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s005420050025
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 97
    Electronic Resource
    Electronic Resource
    Fabrication of monolithic integrated fiber-lens connector arrays by deep proton irradiation (1996)
    Springer
    Microsystem technologies 2 (1996), S. 114-118 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract  Deep proton irradiation in poly (methyl methacrylate) (PMMA) is a fabrication method for monolithic integrated micro optics which offers high stability and interesting autoalignment features. The process consists of three basic steps: irradiation of a PMMA substrate followed by either a development of the irradiated regions or a swelling of the irradiated regions by organic vapor or both applied to different regions. With this technique a variety of elementary refractive microoptical components and monolithically integrated combinations can be fabricated: microlenses, microprisms, beam splitters, fiber connectors with selfaligned microlenses on top of each fiber.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s005420050026
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 98
    Electronic Resource
    Electronic Resource
    The strategic development of HARM manufacturing technologies (1996)
    Springer
    Microsystem technologies 2 (1996), S. 119-125 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract  Whether they are called Micro System Technologies (MST), Micromachine Technologies or Micro-Electro-Mechanical-Systems (MEMS) market projections for products based on these technologies are bright. The marketplace is expected to range from $8 billion (Grace, R. et al, (1992)) to $14 billion (Gabrial, K., (1994)) by the turn of the century. However, the market for these products are currently still less than $1 billion. The transition from innovation in a technological sense to innovation in a business sense continues to be arduous for the products manufactured from any of the different manufacturing technologies that comprise the MST (Walsh, S. and Schumann, E. (1994)) technology base. This work is a discussion of one of the MST technology groups, High Aspect Ratio MEMS or (HARM). HARM based products are economically interesting because of their scope, performance leadership and potential cost leadership. However, there is a caveat. This technology is among the newest production technologies and is not closely related to semiconductor technologies. As a result, this technology does not have the infrastructure enjoyed by Sacrificial Surface Micromachining (SSM) and traditional bulk micromachining methods.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s005420050027
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 99
    Electronic Resource
    Electronic Resource
    LIGA technology in BSRF (1996)
    Springer
    Microsystem technologies 2 (1996), S. 126-129 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract  Beijing Synchrotron Radiation Facility is a partly dedicated Synchrotron Radiation Source which is operated since the end of 1990. Some main specifications of the source are briefly illustrated. Beam line 3B1 is a soft X-ray beam line extracted from bending magnet exploited for lithography. In the end of 3B1 there is a simple exposure chamber, LIGA patterns were exposured in the chamber. The LIGA technologies in BSRF are in the basic research stage, only a few of demonstrated patterns of deep etching structure were obtained. A sample of electroplating apparatus has been set up for getting metal structure. Further plan of the next phase of LIGA technology are presented. A new exposure scanner is being designed and would be set up on the another beam line 4W1 which is extracted from wiggle source with critical wavelength 2.2 A which seems quite suitable for deep etching exposure.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s005420050028
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 100
    Electronic Resource
    Electronic Resource
    Development of ceramic microstructures (1996)
    Springer
    Microsystem technologies 2 (1996), S. 130-134 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract  For the production of microstructured ceramic parts, development efforts are necessary in the field of powder synthesis as well as in the area of shaping. Several processes have been developed. Powder synthesis was performed starting from metal organic precursors and using a two stage thermal process. Shaping was performed by sol-gel methods, by pressing of a ceramic slurry or an organic precursor paste as well as by direct electrophoretic deposition of gels in a microstructured form. An overview is given on the methods and the results.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s005420050029
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
Close ⊗
This website uses cookies and the analysis tool Matomo. More information can be found here...