ISSN:
0305-6120
Source:
Emerald Fulltext Archive Database 1994-2005
Topics:
Electrical Engineering, Measurement and Control Technology
Notes:
High density interconnect (HDI) printed circuits are now being designed in ever-increasing quantities for very high-speed applications. The challenge of opto-electronics and integration of photonics into the printed circuit has started to take off. In the next 7 years, expectations are that photonic printed circuit boards will grow to a $2.5 billion industry. This paper looks at the issues, materials and current processes being researched by European, Japanese and North American organizations to create this integrated opto-electronic circuit board. In addition to reviewing the global players in polymer photonics, this paper will review the current programs of four of the six groups globally, namely EOBC-OptoFoil (University of Ulm, Fraunhafer Inst., Daimler-Chrysler, Siemens), PolyGuide (Dupont, HP), TOPCat (NIST, 3M, Goodyear), Truemode™ (Terahertz), NTT and JIEP.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1108/03056120310478578
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