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  • 1
    Electronic Resource
    Electronic Resource
    Study on the Evaluation Method of Lapping Uniformity for Ceramic Balls (2008)
    s.l. ; Stafa-Zurich, Switzerland
    Advanced materials research Vol. 53-54 (July 2008), p. 147-154 
    Details
    ISSN: 1662-8985
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: To study the sphere-shaping mechanism under dual rotating plates (DRP) lapping modefor ceramic balls, the uniformity of lapping trace distribution is focused in this paper. Methods forsimulation and evaluation of the lapping trace uniformity are proposed, and the effect of velocityparameters on the lapping uniformity of ball under DRP lapping mode is analyzed. It is found that thelapping uniformity is dependent not only on the variation range of spin angle θ, but also on the spinangle speed ωb and on the variation form of θ. The analysis results indicate that the effect ofamplitude of the speed ratio function on the lapping uniformity is much greater than the effect ofphase on that. When the ratio of the inner plate speed to the outer varies from 0 to2, the best lappinguniformity is obtained under the conditions demanded by this paper
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/01/41/transtech_doi~10.4028%252Fwww.scientific.net%252FAMR.53-54.147.pdf
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  • 2
    Electronic Resource
    Electronic Resource
    Application of Taguchi Method for Optimization of Finishing Conditions in SUS440 Stainless Steel Substrate (2007)
    s.l. ; Stafa-Zurich, Switzerland
    Advanced materials research Vol. 24-25 (Sept. 2007), p. 77-82 
    Details
    ISSN: 1662-8985
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: This paper focuses on the application of Taguchi method for optimization of SUS440stainless steel polishing process parameters to obtain the best finish. An optimization experiment forpolishing stainless steel with SiO2 was designed by Taguchi method. Surface roughness Ra isconsidered as criteria for optimization. Influence of parameters involving load, speed, and slurryconcentration for a given workmaterial with given abrasive (material and size) are discussed, and theoptimum polishing conditions are figured out. Compared with single parameter experimental results,it illustrates that the experiment design based on Taguchi method can successfully applied todetermine the optimum processing conditions for SUS440 stainless steel polishing process
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/01/39/transtech_doi~10.4028%252Fwww.scientific.net%252FAMR.24-25.77.pdf
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  • 3
    Electronic Resource
    Electronic Resource
    Parameters Optimization on the Lapping Process for Advanced Ceramics by Applying Taguchi Method (2006)
    s.l. ; Stafa-Zurich, Switzerland
    Materials science forum Vol. 532-533 (Dec. 2006), p. 488-491 
    Details
    ISSN: 1662-9752
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: The surface quality is a critical factor affecting the performance and reliability of advancedceramics. This paper focuses on the application of Taguchi method for optimization of advancedceramics lapping process parameters to obtain the best finish. An optimization experiment for lappingsilicon wafer with Al2O3 was designed by Taguchi method. Surface roughness Ra and Rt areconsidered as criteria for optimization. Influence of parameters involving load, speed, and slurryconcentration for a given workmaterial with given abrasive (material and size) are discussed, and theoptimum lapping conditions are figured out. Compared with single parameter experimental results, itillustrates that the experiment design based on Taguchi method can successfully applied to determinethe optimum processing conditions for advanced ceramics lapping process
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/02/14/transtech_doi~10.4028%252Fwww.scientific.net%252FMSF.532-533.488.pdf
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  • 4
    Electronic Resource
    Electronic Resource
    Visualized Characterization of Slurry during CMP Based on LIF (2006)
    s.l. ; Stafa-Zurich, Switzerland
    Key engineering materials Vol. 315-316 (July 2006), p. 279-283 
    Details
    ISSN: 1013-9826
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Chemical mechanical polishing has emerged recently as an indispensable processingtechnique in large scale integration. In chemical and mechanical polishing process, chemical andmechanical principle is the vital factor in the removal process. Little is known about what isoccurring beneath a wafer during Chemical Mechanical Polishing (CMP) processes. The paperprovides a LIF technology to visualize the fluid flow between the wafer and pad. In this paper, theexperiment setup is built. And then, the images of fluorescence intensity excited by LIF have beenobtained from CCD. Finally, the relationships between pH, temperature, laser power, film thicknessand fluorescence intensity excited by LIF (Laser induced Fluorescence) are studied
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/01/51/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.315-316.279.pdf
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  • 5
    Electronic Resource
    Electronic Resource
    Study on the Mechanism of the Continuous Composite Electroplating Polishing for Silicon Wafer (2006)
    s.l. ; Stafa-Zurich, Switzerland
    Key engineering materials Vol. 315-316 (July 2006), p. 289-293 
    Details
    ISSN: 1013-9826
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: The pad is one of the key factors in the chemical-mechanical planarization (CMP) process.To ensure the machining capability and the quality of workpieces, the pad must be conditioned in theprocess. It will cause the pad thiner, and be replaced by a new one for losing the machining capabilityfinally. For this reason, a new method of CMP by using the continuous composite electroplating onthe polishing disc is introduced. In this process, the machining ability of the pad can be ensured due tothe continuous Sn-SiO2 composite electroplating. The effect of cathode current density and time ofplating on the characteristics of composite coating and silica wafer are investigated. The experimentindicates that the continuous composite electroplating polishing (CCEP) is an efficiency method forpolishing silicon wafer, and the surface roughness of the silicon wafer is 0.005μm
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/01/51/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.315-316.289.pdf
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  • 6
    Electronic Resource
    Electronic Resource
    Primary Study of Polishing with Flotative Abrasive Balls (2006)
    s.l. ; Stafa-Zurich, Switzerland
    Key engineering materials Vol. 315-316 (July 2006), p. 35-39 
    Details
    ISSN: 1013-9826
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: The grain size and its identity of abrasives are of high importance to obtain thedamage-free and low roughness surfaces in traditional polishing processes. The undesirablescratches will appear on the surface of workpiece, if the grain size of abrasives is of highdecentralization, or some abnormal larger grains or impurities are interfused in polishing process.And it is very difficult to polish curved surfaces. A new polishing technology, which is called aspolishing with flotative abrasive balls, is put forward in this paper, in order to solve the problemsmentioned above. Some primary experiments and theoretical analyses are carried out. It is foundthat the contact pressure between workpiece and abrasive grains may be easily controlled, as aresult, the depth of cutting may also be easily controlled and it is not sensitive to the grain size ofabrasives. The new technology may also be used in the polishing of curved surfaces
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/01/51/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.315-316.35.pdf
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  • 7
    Electronic Resource
    Electronic Resource
    Modeling and Simulation of Lapping Processes Based on Grain Size Sensitivity Model (2006)
    s.l. ; Stafa-Zurich, Switzerland
    Key engineering materials Vol. 304-305 (Feb. 2006), p. 389-392 
    Details
    ISSN: 1013-9826
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: It is of high importance to avoid scratches in lapping process. A Grain Size Sensitivity (GSS) model is put forward in this paper. The GSS is a relative parameter which defines the relative change of the depth of cutting, influenced by the change of the size of grain powders, by which it is possible to evaluate quantificationally the capability of lapping machines in avoiding scratches. It isuseful for designing and using lapping machines. The simulating of lapping processes based on GSS model is carried out. The transferring of error is also discussed and a new structure of lapping plate with spring cells developed by the authors is introduced
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/01/50/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.304-305.389.pdf
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  • 8
    Electronic Resource
    Electronic Resource
    Study on Ultra-Precise Machining of CLBO Crystal (2006)
    s.l. ; Stafa-Zurich, Switzerland
    Key engineering materials Vol. 304-305 (Feb. 2006), p. 398-402 
    Details
    ISSN: 1013-9826
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Cesium Lithium Borate (CsLiB6O10 or CLBO) is the most effective non-linear crystal which generates ultraviolet harmonics of the Nd:YAG fundamental laser wavelength. In order to enhance the damage threshold, low CLBO surface roughness, by ultra-precision machining, is needed. Because the CLBO crystal has easy hydroscopic reaction and micro scratches in machining, ultra-precise machining of the CLBO crystal is a difficult technical problem. In this paper, the new lapping slurry and polishing slurry are introduced. And the deliquescencedegree of CLBO is fallen to lowest. A new working technology is also adopted. After rough polishing, the concentration of ultra-precision polishing slurry is increased properly. So does the ultra-precision polishing speed, and the wiping speed is faster than the deliquescence speed. The CLBO crystal surface roughness can achieve 1nm and keep the surface quality well
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/01/50/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.304-305.398.pdf
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  • 9
    Electronic Resource
    Electronic Resource
    Study on Pad Conditioning Parameters in Silicon Wafer CMP Process (2007)
    s.l. ; Stafa-Zurich, Switzerland
    Key engineering materials Vol. 359-360 (Nov. 2007), p. 309-313 
    Details
    ISSN: 1013-9826
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Polishing pad plays a key role in determining polish rate and planarity of a chemicalmechanical planarization (CMP). The properties of the pad would deteriorate during polishingbecause of pad surface grazing, which results in reduced removal rates and poorer planarity ofwafer surface. Pad conditioning and its influence on pad surface structure and CMP process isintroduced and discussed in this paper. The study shows that the surface structure can beregenerated by breaking up the glazed areas with conditioner, MRR(Material Removal Rate) can bemaintained at high level with proper pad conditioning, and UN(Non-uniformity)can also improved.Orthogonal experiments design is employed in this study to determine the best conditioningparameters
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/01/55/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.359-360.309.pdf
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  • 10
    Electronic Resource
    Electronic Resource
    Research and Simulation on the Wear Uniformity of Lapping Plate (2007)
    s.l. ; Stafa-Zurich, Switzerland
    Key engineering materials Vol. 364-366 (Dec. 2007), p. 466-469 
    Details
    ISSN: 1013-9826
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Lapping plate wear is of great influence on shape precision of workpiece. Investigationon the wear uniformity of uncertain eccentricity plane lapping was carried out in this research. Therelative velocity function of the plate to the workpiece is obtained through kinematic analyses in themode of uncertain eccentricity plane lapping, and material removal rate (MRR) function and wearuniformity function were deduced based on Preston equation. Effects of the ratio and eccentricitieson the wear uniformity are discussed in detail through MATLAB simulation. Theoretical analysisand simulation results show that the ratio k1 of workpiece revolution speed to lapping plate is thekey to decide whether the lapping plate is lapped uniformly. Theoretically, when k1〈0, the greater|k1| is, the better the lapped uniformly of lapping plate can be. The ratio k2 of workpiece rotationspeed to lapping plate has great influence on the lapped uniformly when k1 approximate 1, and k2has little influence on the lapped uniformly when k1〈0 or k1〉1, Besides, a bit bigger eccentricity e1is propitious to the lapping uniformly of the lapping plate, and bigger eccentricity e2 are also helpfulto lapping uniformly of the lapping plate. And the conclusion could be extended to single-side planelapping and double-side plane lapping process
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/01/56/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.364-366.466.pdf
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