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  • 1
    Electronic Resource
    Electronic Resource
    Experimental Study on New Bonding Materials for Developing Nano-Grinding Plates (2007)
    s.l. ; Stafa-Zurich, Switzerland
    Key engineering materials Vol. 329 (Jan. 2007), p. 489-494 
    Details
    ISSN: 1013-9826
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: This paper describes a method for experimental development of a novel fixed abrasivenano-grinding plate (FAG-plate) which is proposed for lapping some rigid brittle materials, such asquartz crystal and silicon. The FAG plate is developed with ultraviolet-cured resin by rapidprototyping technology. The analysis shows that such FAG-plate can keep its grinding abilityconstant and continuous and it can make the roughness of machined surface reach to nanometer level.Based on experimental comparisons with conventional free abrasive slurry lapping plates, the lappingprocess using FAG-plate has several distinct advantages. One is that the machining efficiency issignificantly improved. The second is that it improves the surface roughness of machinedwork-pieces, although it decreases the flatness tolerance of materials. Furthermore, the fixed abrasivenano-grinding plate is made by the new bonding materials- ultraviolet curing resin and thus thefabrication of FAG-plate is convenient and economical
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/01/52/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.329.489.pdf
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  • 2
    Electronic Resource
    Electronic Resource
    Machining Characteristics of Semibonded Abrasive Grinding Plate (2008)
    s.l. ; Stafa-Zurich, Switzerland
    Advanced materials research Vol. 53-54 (July 2008), p. 173-178 
    Details
    ISSN: 1662-8985
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: This work aims to obtain fine surface of silicon wafer during precision and ultra precisionmachining, and presents a new method called semibonded abrasive machining. A semibondedabrasive grinding plate is used in the semibonded abrasive machining. Abrasive particle of 1000#Green SiC and bond named SSB are adopted in the manufacture of the plate. Four plates withdifferent concentration of bond which are 1.5%, 2.5%, 3.5%, 4.5% respectively are made. The paperstudies the effect of concentration of bond, the control parameters which include the lapping time, theload, and the rotating velocity of the plate on the surface roughness. Experimental results indicateeach plate with different concentration of bond can obtain fine surface roughness. When the load orthe rotating velocity increases, there is little effect on the surface roughness, but the materialremoval rate increases correspondingly. The initial roughness of the silicon wafer surface lappingby the plate could be improved from Ra 0.2μm to Ra 0.02μm in 9 min
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/01/41/transtech_doi~10.4028%252Fwww.scientific.net%252FAMR.53-54.173.pdf
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  • 3
    Electronic Resource
    Electronic Resource
    Spinning- Inflated-Ballonet Polishing Tool and its Application in Curved Surface Polishing (2007)
    s.l. ; Stafa-Zurich, Switzerland
    Key engineering materials Vol. 339 (May 2007), p. 21-25 
    Details
    ISSN: 1013-9826
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: In this paper, a novel spinning-inflated-ballonet polishing tool for curved surface ofmould is proposed. The head of the tool is a spherical spinning-inflated-ballonet whose inner airpressure can be controlled on-line and the head surface is covered with a suitable polishing cloth.The head can be rotated in high speed driven by an electromotor or high pressure airflow and itsrotating speed can be adjusted. The flexibility of the head, the polishing force in radial direction andthe contact area between the head surface and the curved surface of the work-piece can becontrolled by adjusting the feeding deepness and ballonet pressure of the tool. The structure and thepolishing mechanism of the novel polishing tool are introduced. The application of robot polishingsystem based on the novel polishing tool also is discussed. Finally the polishing control strategy ofcurved surface is researched
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/01/53/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.339.21.pdf
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  • 4
    Electronic Resource
    Electronic Resource
    Research on Mechanism of Chemical Mechanical Polishing Process for Silicon Nitride Balls with CeO〈sub〉2〈/sub〉 Abrasive (2008)
    s.l. ; Stafa-Zurich, Switzerland
    Advanced materials research Vol. 53-54 (July 2008), p. 131-136 
    Details
    ISSN: 1662-8985
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Studies on chemical mechanical polishing (CMP) for silicon nitride (Si3N4) balls withCeO2 abrasive carried to investigate the mechanism of chemo-mechanical action between siliconnitride and CeO2. It is found that CeO2 is more effective to obtain smooth Si3N4 balls than otherabrasives, and extremely smooth Si3N4 balls with surface Ra 4nm were obtained after polishing.XRD test is used to detect the reaction resultants on the ball surface, and the results show that SiO2is the main resultant of the chemical reaction between Si3N4 and CeO2, and the test results confirmthe correctness of thermodynamic analysis based on Gibb’s free energy of formation. It is alsofound that water play as a key factor in CMP
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/01/41/transtech_doi~10.4028%252Fwww.scientific.net%252FAMR.53-54.131.pdf
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  • 5
    Electronic Resource
    Electronic Resource
    Study on the Evaluation Method of Lapping Uniformity for Ceramic Balls (2008)
    s.l. ; Stafa-Zurich, Switzerland
    Advanced materials research Vol. 53-54 (July 2008), p. 147-154 
    Details
    ISSN: 1662-8985
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: To study the sphere-shaping mechanism under dual rotating plates (DRP) lapping modefor ceramic balls, the uniformity of lapping trace distribution is focused in this paper. Methods forsimulation and evaluation of the lapping trace uniformity are proposed, and the effect of velocityparameters on the lapping uniformity of ball under DRP lapping mode is analyzed. It is found that thelapping uniformity is dependent not only on the variation range of spin angle θ, but also on the spinangle speed ωb and on the variation form of θ. The analysis results indicate that the effect ofamplitude of the speed ratio function on the lapping uniformity is much greater than the effect ofphase on that. When the ratio of the inner plate speed to the outer varies from 0 to2, the best lappinguniformity is obtained under the conditions demanded by this paper
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/01/41/transtech_doi~10.4028%252Fwww.scientific.net%252FAMR.53-54.147.pdf
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  • 6
    Electronic Resource
    Electronic Resource
    Optimising Shot Peening Parameters Using Finite Element and Discrete Element Analysis (2007)
    s.l. ; Stafa-Zurich, Switzerland
    Applied mechanics and materials Vol. 10-12 (Dec. 2007), p. 493-497 
    Details
    ISSN: 1662-7482
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Shot peening is a cold-work process in which a stream of small spherical shot is blastedagainst a metallic component to generate a high compressive residual stress regime at the surface ofthe target. This paper presents a computational modelling of the shot peening process, in which thefinite element (FE) method was employed to study the elastic-plastic dynamic process of the shotimpact on a metallic target, and the discrete element (DE) method was used to study the multipleparticles dynamics. Statistical analyses of the shot impact data reveal the relationships betweenpeening process parameters and peening intensity, which can be used to optimise these processparameters to produce an improved outcome
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/01/38/transtech_doi~10.4028%252Fwww.scientific.net%252FAMM.10-12.493.pdf
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  • 7
    Electronic Resource
    Electronic Resource
    Application of Taguchi Method for Optimization of Finishing Conditions in SUS440 Stainless Steel Substrate (2007)
    s.l. ; Stafa-Zurich, Switzerland
    Advanced materials research Vol. 24-25 (Sept. 2007), p. 77-82 
    Details
    ISSN: 1662-8985
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: This paper focuses on the application of Taguchi method for optimization of SUS440stainless steel polishing process parameters to obtain the best finish. An optimization experiment forpolishing stainless steel with SiO2 was designed by Taguchi method. Surface roughness Ra isconsidered as criteria for optimization. Influence of parameters involving load, speed, and slurryconcentration for a given workmaterial with given abrasive (material and size) are discussed, and theoptimum polishing conditions are figured out. Compared with single parameter experimental results,it illustrates that the experiment design based on Taguchi method can successfully applied todetermine the optimum processing conditions for SUS440 stainless steel polishing process
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/01/39/transtech_doi~10.4028%252Fwww.scientific.net%252FAMR.24-25.77.pdf
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  • 8
    Electronic Resource
    Electronic Resource
    Surface Lapping by Semi-Bonded Abrasive Grinding Plate for Copper Substrates of Amorphous Ni-Pd-P Alloy Films (2008)
    s.l. ; Stafa-Zurich, Switzerland
    Advanced materials research Vol. 53-54 (July 2008), p. 141-146 
    Details
    ISSN: 1662-8985
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: The amorphous Ni-Pd-P alloy films with superior property have good heat conductivityand wear performance. They are widely used in the protecting coating. Copper has been chosen tobe a substrate material of the produce of amorphous Ni-Pd-P alloy films with its unique electricalproperties. The precision lapping technology for the copper substrate using semi-bonded abrasivegrinding plate is studied in this paper. The influences of the different lapping parameters on thesurface roughness, material removal rate on copper substrate surface formation in the precisionlapping process are both discussed. Experimental results indicate that the copper substrate can beefficiently processed by 800# SiC semi-bonded abrasive grinding plate of, and the initial roughnessof a machined surface could be improved from 0.553μm Ra to 0.28μm in 10min, yielding a idealrarely scratch surface
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/01/41/transtech_doi~10.4028%252Fwww.scientific.net%252FAMR.53-54.141.pdf
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  • 9
    Electronic Resource
    Electronic Resource
    Experimental Validation of the ‘Trap’ Effect of the Semibonded Abrasive Grinding Plate (2008)
    s.l. ; Stafa-Zurich, Switzerland
    Advanced materials research Vol. 53-54 (July 2008), p. 161-166 
    Details
    ISSN: 1662-8985
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: The semibonded abrasive machining technique is expected to get high surface integrity andprocessing efficiency attributed to the „trap‟ effect which can reduce or even eliminate the surfacedamage induced by the larger particles. The goal of the work is to validate the „trap‟ effect by theexperiments of semibonded and loose abrasive machining under the conditions of adding and notadding the larger particles. Free surface damage monocrystal silicon wafers after polishing areadopted as workpieces, and 1000# SiC as abrasive particles while 180# SiC as the larger particles.The cast iron plate is used as grinding plate in the loose abrasive machining and different bondconcentration semibonded abrasive grinding plate SSB-1 and SSB-2 are used as grinding plates insemibonded abrasive machining. The roughness Rv and SEM photos of workpieces surface aretested to evaluate the extent of „trap‟ effect. The result shows that the semibonded abrasive grindingplate has the „trap‟ effect. The shore hardness value of the semibonded abrasive grinding plate canbe used to be one parameter to evaluate the degree of the ‟trap‟ effect of the semibonded abrasivegrinding plate
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/01/41/transtech_doi~10.4028%252Fwww.scientific.net%252FAMR.53-54.161.pdf
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  • 10
    Electronic Resource
    Electronic Resource
    Study of the Removing Depth of the Polishing Surface Based on a Novel Spinning-Inflated-Ballonet Polishing Tool (2006)
    s.l. ; Stafa-Zurich, Switzerland
    Materials science forum Vol. 532-533 (Dec. 2006), p. 452-455 
    Details
    ISSN: 1662-9752
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: In the field of the mold-curved free surface polishing, how to control the removing depthof the polishing surface exactly is one of the important problems to be solved. In this paper, a mouldautomatic polishing system that is developed on Motoman-NL20 robot is used to make theoreticalanalysis and experimental research on the removing depth of the polishing surface based on a novelSpinning-Inflated-ballonet Polishing tool for curved surface of mould. Firstly, FEM (finite elementanalysis) software is used to emulate three kinds of situation in the process of polishing, then themodel of surface removing depth of SBCT polishing is established. At last, through the analysis andcomparison, the result of emulation and experiment has a remarkable consistency which accordswith the model established by formal theory. This indicates the correctness of the model
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/02/14/transtech_doi~10.4028%252Fwww.scientific.net%252FMSF.532-533.452.pdf
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