Electronic Resource
Woodbury, NY
:
American Institute of Physics (AIP)
Applied Physics Letters
54 (1989), S. 1815-1817
ISSN:
1077-3118
Source:
AIP Digital Archive
Topics:
Physics
Notes:
A plastic flow model is used to calculate the stress generated during thermal oxidation of silicon cylinders. The analysis is used to estimate stress as a function of thickness, radius of curvature, and temperature. The oxidation stress is much lower than previous analyses.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1063/1.101248
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