ISSN:
0954-0911
Source:
Emerald Fulltext Archive Database 1994-2005
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
This paper reviews the status of lead-free solder development works. Some of the solder systems — Bi-Sn,Bi-Sn-Fe, ln-Sn, Sn, Sn-Ag, Sn-Ag-Zn,Sn-Ag-Zn-Cu, Sn-Bi-Ag, Sn-Cu,Sn-Cu-Ag, Sn-In-Ag, Sn-Sb, Sn-Zn andSn-Zn-ln — are discussed in more detail, while others are briefly commentedon. In general, compared with eutectic Sn-Pb solder, all the lead-free solderalternatives investigated more or less exhibit some shortcomings, such as price, physical,metallurgical or mechanical properties. Relatively, Sn-ln-containing systemsare more promising in terms of solder mechanical properties and soldering performance,although the price of ln may be a concern. Eutectic Sn-Ag solder doped with Zn, Cu orSb exhibits good mechanical strength and creep resistance, due to refined microstructure. TheBi-Sn systems doped with other elements may have a niche in the low temperaturesoldering field. Eutectic Sn-Cu has good potential due to its good fatigue resistance. Theeutectic Sn-Zn system modified with ln and/or Ag may be promising in terms ofmechanical properties. Finding a lead-free alternative for high temperature solderspresents the biggest challenge to the industry.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1108/09540919710800656
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