ISSN:
0954-0911
Source:
Emerald Fulltext Archive Database 1994-2005
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
The most commonly used solder for electricalinterconnects in electronic packages is the near eutectic 60Sn-40Pb alloy. This alloy hasa number of processing advantages(suitable melting point of 183°C and good wettingbehaviour). However, under conditions of cyclic strain and temperature(thermomechanical fatigue) the microstructure of this alloy undergoes aheterogeneous coarsening and failure process that makes the prediction of solder joint lifetimecomplex. A finite element simulation methodology to predict solder joint mechanical behaviour,that includes microstructural evolution, has been developed. The mechanical constitutivebehaviour was incorporated into the time-dependent internal state variable viscoplasticmodel through experimental creep tests. The microstructural evolution is incorporated through aseries of mathematical relations that describe mass flow in a temperature/strainenvironment. The model has been found to simulate observed thermomechanical fatiguebehaviour in solder joints.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1108/09540919710800601
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