Publication Date:
2019-05-29
Description:
Rugged module package for thin film hybrid microcircuits incorporated a rigid, thermally conductive support structure, which serves as a heat sink, and a lead wire block in which T-shaped electrical connectors are potted. It protects the circuitry from shock and vibration loads, dissipates internal heat, and simplifies electrical connections between adjacent modules.
Keywords:
ELECTRONIC COMPONENTS AND CIRCUITS
Type:
MSC-81A
Format:
application/pdf
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