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  • 1
    Electronic Resource
    Electronic Resource
    Nano-Structured CrN/CN〈sub〉x〈/sub〉 Multilayer Films (2007)
    s.l. ; Stafa-Zurich, Switzerland
    Key engineering materials Vol. 334-335 (Mar. 2007), p. 893-896 
    Details
    ISSN: 1013-9826
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: CrN/CNx nano-scale multilayered films were deposited on Si (100) substrate by closed-fieldunbalanced magnetron sputtering. Designed experimental parameters enabled an evaluation of theeffects of negative substrate bias voltage (Vb), and bi-layer thickness λ (by changing substraterotation rate) during deposition on the structural and mechanical properties of multilayer films.These multilayers were characterized and analyzed by transmission electron microscope (TEM),X-ray diffraction (XRD), atomic force microscopy (AFM), and nanoindentation measurements. Inall cases, the CNx layers were amorphous and independent of Vb, while the microstructures of theCrN layers were dependent primarily on Vb. The CrN layers showed a mixed structure phaseconsisting of CrN, Cr2N, and Cr at Vb = -(40-120) V. At higher Vb values (-140 V or above), theCr2N phase was dominant along with low CrN phase content. AFM measurements revealed that theroot-mean-square (rms) surface roughness of the CrN/CNx film was 2 nm at Vb= -200 V whereasthe rms values were about 9.5-3.3 nm for lower Vb values of -(40-180 V). By nanoindentationmeasurements, a maximum hardness of about 36 GPa was observed at Vb= -140 V. The improvedmechanical properties of the films are correlated to the phase formation during deposition
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/01/53/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.334-335.893.pdf
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  • 2
    Electronic Resource
    Electronic Resource
    Nano-Structured TiN/TiBN Multilayer Thin Films (2007)
    s.l. ; Stafa-Zurich, Switzerland
    Key engineering materials Vol. 334-335 (Mar. 2007), p. 889-892 
    Details
    ISSN: 1013-9826
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Nano-structured TiN/TiBN multilayer thin films were deposited onto unheated Si(100)substrates by reactive unbalanced dc-magnetron sputtering in an Ar-N2 gas mixture at a pulsed-biasvoltage of –60 V. The effects of the bilayer thickness (Λ = 1.8-7.7 nm) on microstructures andmechanical properties have been analyzed using X-ray diffraction (XRD), high-resolutiontransmission electron microscopy (HRTEM), and microindentation measurements. Microstructurestudies revealed that the TiN layers were fcc B1-NaCl structure comprising of (111)- and(200)-oriented grains depending on Λ, while the TiBN layers were amorphous. Significantrelationships were found between hardness (H) and Λ. A maximum hardness of ~30 GPa wasobserved in a multilayer film with [removed info] = 1.8 nm. The possible hardness enhancement mechanismwas also discussed
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/01/53/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.334-335.889.pdf
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  • 3
    Electronic Resource
    Electronic Resource
    Special Surface Structures in Surface Alloy Growth (1997)
    s.l. ; Stafa-Zurich, Switzerland
    Materials science forum Vol. 248-249 (May 1997), p. 95-100 
    Details
    ISSN: 1662-9752
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/02/02/transtech_doi~10.4028%252Fwww.scientific.net%252FMSF.248-249.95.pdf
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  • 4
    Electronic Resource
    Electronic Resource
    Real-time detection of laser-induced transient gratings and surface acoustic wave pulses with a Michelson interferometer (1997)
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 82 (1997), S. 4758-4762 
    Details
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Laser-induced transient gratings (LITGs) at surfaces of absorbing materials were utilized to generate narrowband surface acoustic waves (SAWs). In these experiments, SAWs were excited thermoelastically by two crossed picosecond laser pulses and detected with an actively stabilized Michelson interferometer by measuring transient surface displacements in the sub-angstrom range in real time. In addition, coherent broadband SAW pulses with frequencies up to 350 MHz were excited by sharply focusing the laser beam with a cylindrical lens system onto the sample surface. The LITG experiments provide an extension of the frequency range achieved with the broadband SAW pulse technique. From the measurements of the dispersive SAW phase velocity for a 650 nm aluminum film on fused silica in the frequency range 10 MHz–1 GHz the density and elastic constants were determined by fitting the experimental data to the exact solution of the wave equations taking into account the boundary conditions. © 1997 American Institute of Physics.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1063/1.366332
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  • 5
    Electronic Resource
    Electronic Resource
    Photoacoustic investigation of multilayer semiconductor materials (1994)
    Springer
    Journal of nondestructive evaluation 13 (1994), S. 55-61 
    Details
    ISSN: 1573-4862
    Keywords: Photoacoustic ; thermal wave ; plasma wave ; acoustic wave ; depth characterization
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Mathematics
    Notes: Abstract A one-dimensional model to investigate the photoacoustic (PA) generation and depth profiling in multilayer semiconductor materials has been developed by considering the contributions of thermal and plasma waves. The theoretical results show that the contribution of the plasma wave induced by photo-generated carriers (PGC) to the photoacoustic signal through the electro-elastic effect is predominant at high modulation frequencies and the contribution of the thermal wave, which is caused by the recombination of PGC, to PA signal through the thermo-elastic effect is more important at low modulation frequencies. We also investigated the depth profiling ability of PA detection by changing either the modulation frequency or the phase shift of the reference signal. The theoretical analyses are consistent with the experimental results.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF00730956
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  • 6
    Electronic Resource
    Electronic Resource
    Delamination and Buckling Induced by Compressive Strain in Metal Thin Films (2005)
    s.l. ; Stafa-Zurich, Switzerland
    Materials science forum Vol. 490-491 (July 2005), p. 655-660 
    Details
    ISSN: 1662-9752
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: The pattern formation during delamination and buckling in sputter-deposited tungsten thin films under large compressive stresses was investigated. The films were analyzed in situ by a cantilever beam technique, and ex situ by atomic force microscopy (AFM) and focused ion beam. Depending on the magnitude of compressive strain in thin films, different types of buckling patterns were observed. For stresses above a critical value, there was a regime of steady growth in which theincipient blister evolves into a regular sinusoidal-like propagation. At higher strains, the sinusoidallike wrinkles were developed with constant widths and wavelengths. Some of the wrinkles bifurcated to form branches. With further increase in stress the complicated buckling patches were formed with many irregular lobes. These types of pattern formation have been supported by elastic energy calculations
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/02/10/transtech_doi~10.4028%252Fwww.scientific.net%252FMSF.490-491.655.pdf
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  • 7
    Electronic Resource
    Electronic Resource
    Microstresses in Molybdenum Nitride Thin Films Deposited by Reactive DC Magnetron Sputtering (2005)
    s.l. ; Stafa-Zurich, Switzerland
    Materials science forum Vol. 490-491 (July 2005), p. 589-594 
    Details
    ISSN: 1662-9752
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Thin films of molybdenum nitride (MoNx with 0≤x≤0.35) were deposited on Si(100) at room temperature using reactive DC magnetron sputtering. The residual stress of films was measured as a function of sputtering pressure, nitrogen incorporation, and annealing temperature by wafer curvature-based technique. It was found that the stress of the films was strongly related to their microstructure, which depended mainly on the incorporation of nitrogen in the films. The film stresses without nitrogen addition strongly depended on the argon pressure and changed from highly compressive to highly tensile in a relatively narrow pressure range of 0.8-1.6 Pa. For pressures exceeding ~5.3 Pa, the stress in the film was nearly zero. Cross-sectional transmission electron microscopy indicated that the compressively stressed films contained a dense microstructure without any columns, while the films having tensile stress had a very columnar microstructure. High sputtering-gas pressure conditions yielded dendritic-like film growth, resulting in complete relaxation of the residual tensile stresses. It was also found that the asdeposited film was poorly ordered in structure. When the film was heated at ~775 K, crystallization occurred and the stress of the film drastically changed from –0.75 to 1.65 GPa.The stress development mechanism may be due to volumetric shrinkage of the film during crystallization
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/02/10/transtech_doi~10.4028%252Fwww.scientific.net%252FMSF.490-491.589.pdf
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  • 8
    Electronic Resource
    Electronic Resource
    Monte Carlo Simulation of Microstructure and Grain Growth in nc-Ti(N, B)/a-(TiB〈sub〉2〈/sub〉, BN) Nanocomposite Films (2006)
    s.l. ; Stafa-Zurich, Switzerland
    Key engineering materials Vol. 312 (June 2006), p. 357-362 
    Details
    ISSN: 1013-9826
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: A combination of high-resolution transmission electron microscopy and x-rayphotoelectron spectroscopy are used to establish that Ti-B-N films with different boron concentrations prepared by reactive unbalanced magnetron sputtering exhibit a two-phase nanocomposite microstructure, showing nanocrystalline Ti(N, B) grains embedded in amorphous (TiB2, BN) matrices. Using Monte Carlo simulations and based on a simple model employing a kinetic grain growth theory, we also investigate the effects of the amorphous TiB2-BN phase on the microstructure evolution and grain growth in nanocrystalline-Ti(N, B). Our study demonstrates that the formation of such an amorphous phase at the grain boundary could hinder the growth of Ti(N, B) grains and the mean grain size shows an exponential decay with boron concentration, in good agreement with our experimental observations
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/01/51/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.312.357.pdf
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  • 9
    Electronic Resource
    Electronic Resource
    Indentation Size Effect on Hardness of Nanostructured Thin Films (2006)
    s.l. ; Stafa-Zurich, Switzerland
    Key engineering materials Vol. 312 (June 2006), p. 363-368 
    Details
    ISSN: 1013-9826
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Based on nanoindentation techniques, the evaluation of hardness of two nanostructured thin films, AlN and Ti-Al-N, is discussed. In the case of AlN films, the indentation size effect of hardness can be modeled using the concept of geometrically necessary dislocations, whereas in the case of Ti-Al-N films, the measured hardness increases exponentially as the indentation depthdecreases. The results show that, as thin films approach superhard, dislocation-based plastic deformation is gradually replaced by grain-boundary mediated deformation
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/01/51/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.312.363.pdf
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  • 10
    Electronic Resource
    Electronic Resource
    Influence of Residual Stresses on the Interfacial Toughness Measurement by Cross-Sectional Nanoindentation (2007)
    s.l. ; Stafa-Zurich, Switzerland
    Key engineering materials Vol. 353-358 (Sept. 2007), p. 400-403 
    Details
    ISSN: 1013-9826
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Cross-sectional nanoindentation (CSN) is a new method for measuring interface adhesionof thin films. The interfacial energy release rate (G), characterizing interfacial adhesion, iscalculated from the material and geometrical parameters relevant to the test. Effects of residualstresses on G and crack tip phase angle Ψ, have been studied by finite element simulation in thisstudy. The results show tensile residual stresses increase G and compressive stresses reduce it, andthey have similar effects on the magnitude of Ψ
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/01/55/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.353-358.400.pdf
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