ISSN:
1013-9826
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
In the process of CMP SiO2 ILD, the nano-particle with high surface energy in slurry hasan essential impact on the efficiency and quality of CMP. In this paper the mode of nano-particle onthe surface of SiO2 ILD is analysed and adhesion removal model corresponding to that is established.Through cycle polishing experiments, the change of nano-particle size and the state of particlesurface before and after polishing is observed with TEM and Zeta potential analyzer, based on whichthe adhesion removal model is verified
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/01/57/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.389-390.475.pdf
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