ISSN:
1662-9779
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Physics
Notes:
Surface modification of polyimide(PI) films was treated with oxygen RIE by varying ion dosesfrom 1x1016 to 1x1018 ions/cm2 at an ion beam energy of 250 eV. Following the modification of PIsurface, metal films consisting of NiCr/Cu and Cu were deposited on modified PI films by D.C.magnetron sputtering and electroplating, respectively. The surface modified PI film wascharacterized by XPS, AFM, SEM and contact angle measurement, respectively. The water contactangle of PI film decreased significantly from 64° to 4.4° with an increase of ion dose, indicatingthat the surface energy of PI film increased. The XPS spectrum showed that functional group,particularly C-O bonding, on modified PI surface was significantly increased by interactionbetween scissored unstable chains and reactive ions. The modified PI film surfaces by oxygen RIEshowed significant improvement in adhesion to a overcoated metal film of NiCr/Cu
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/02/24/transtech_doi~10.4028%252Fwww.scientific.net%252FSSP.124-126.1593.pdf
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