ISSN:
1662-9752
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
A new hybrid soldering and conductive adhesive joining technology using a fusible lowmelting-point alloy (LMPA) have been developed. A numerical method for numerical analysis offusible particles behavior is proposed to investigate coalescence characteristics of fusible particlesin solderable isotropic conductive adhesives (ICAs). For finding out suitable conditions to obtainreliable conduction paths, the present study examines the influence of process-related parameterssuch as volume fraction and viscosity on coalescence characteristics of fusible particles
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/02/18/transtech_doi~10.4028%252Fwww.scientific.net%252FMSF.580-582.213.pdf
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