ISSN:
1662-7482
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
SnAgCu solder is a promising lead-free material for interconnections in electronicpackages. However, its melting temperature (490°K) is considerably higher than that of thetraditional SnPb solder (456°K). At the same time, SnAgCu has much better creep resistance at hightemperature. These properties may cause large residual stresses during manufacturing processes dueto the mismatch of thermal properties of electronic components that can influence the reliability ofsolder joints in electronic packages. This paper studies the residual stresses in solder joints in a flipchip package under different cooling conditions and their influence on the subsequent cyclic test bymeans of a finite element approach. The results show that the initial temperature of 453°K is highenough to induce residual stresses due to manufacturing procedures. Simulations, based ontraditional creep-fatigue models, demonstrate that the residual stresses affect the mechanicalbehaviour of solder joints in several initial thermal cycles but have little effect on their reliability
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/01/39/transtech_doi~10.4028%252Fwww.scientific.net%252FAMM.5-6.359.pdf
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