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  • 1
    Electronic Resource
    Electronic Resource
    s.l. ; Stafa-Zurich, Switzerland
    Advanced materials research Vol. 53-54 (July 2008), p. 141-146 
    ISSN: 1662-8985
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: The amorphous Ni-Pd-P alloy films with superior property have good heat conductivityand wear performance. They are widely used in the protecting coating. Copper has been chosen tobe a substrate material of the produce of amorphous Ni-Pd-P alloy films with its unique electricalproperties. The precision lapping technology for the copper substrate using semi-bonded abrasivegrinding plate is studied in this paper. The influences of the different lapping parameters on thesurface roughness, material removal rate on copper substrate surface formation in the precisionlapping process are both discussed. Experimental results indicate that the copper substrate can beefficiently processed by 800# SiC semi-bonded abrasive grinding plate of, and the initial roughnessof a machined surface could be improved from 0.553μm Ra to 0.28μm in 10min, yielding a idealrarely scratch surface
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    s.l. ; Stafa-Zurich, Switzerland
    Materials science forum Vol. 532-533 (Dec. 2006), p. 393-396 
    ISSN: 1662-9752
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Polishing with Flotative Abrasive Balls(FABs) is a kind of soft contact polishing means,and the conventional polishing plate and pad are not needed in this case. The pressure of polishing isthe flotage which is the upward force that a fluid exerts on the FABs, but the movement of work pieceis similar to that in conventional polishing, the removal rate and quality of polishing is influenced byFAB and its flotage. An experiment device is built up and two kinds of FAB are designed andproduced. Some primary experiments are carried out in order to investigate the influences of the sizeof FABs on the removal rate and surface roughness in polishing with FABs. It is found from theexperiments that the grain size and the layers of FAB may have great influence on the removal rate ofpolishing; the surface roughness is mainly decided by the ball diameter and the layers of FAB. Theresults of experiments are discussed and analyzed, it indicates that the efficiency and quality dependon flotage and the number of active grains when the velocity of workpiece is assigned
    Type of Medium: Electronic Resource
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  • 3
    Electronic Resource
    Electronic Resource
    s.l. ; Stafa-Zurich, Switzerland
    Materials science forum Vol. 532-533 (Dec. 2006), p. 109-112 
    ISSN: 1662-9752
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: The high precision balls are requested in national defense, astronautics and high-techcommercial domain urgently. Conventional precision machining methods are sensitive to uniformityof abrasives and machining environment. After precision machining, there are easily to produce thickdamaged layer on the ball surface because of machining stress and chemical conversion. On the basisof the floating polishing mechanism, a new scatheless ultra-precision polishing method of ball surfacecan solve the problems of abrasives uniformity effectively and damaged layer. In order to ensure thatthe new polishing method polishes ball surface equally, the appropriate angular velocities of the ballshould be selected. This paper sets up the mathematical model about the motion of ball. By analyzingand simulating the relationship of the angular velocities, the best processing parameters are acquired
    Type of Medium: Electronic Resource
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