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  • 1
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 79 (1996), S. 4087-4095 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The use of "Kissinger'' plots to analyze in situ resistance monitoring of thin-film reactions during heating at a constant rate is widely accepted. One obtains the activation energy for diffusion, at least in the case of diffusion-controlled reactions. The aim of this article is to extend the analysis one step further and show that, provided that the thickness of the layers formed is known, the same experimental and analytical techniques may yield the pre-exponential growth factor. The validity of the procedure is demonstrated by comparing the results thus obtained with data from the literature derived by conventional analysis of compound growth during isothermal annealing. Such comparisons have been made for Co2Si, CoSi, CoSi2, Pt2Si, PtSi, Ni2Si, and NiSi formation on undoped polycrystalline Si and single-crystal Si on sapphire substrates with ramp rates ranging from 10−2 °C/s to 102 °C/s. Measurements used both conventional furnace and rapid thermal annealing. In the past, the common practice has been to use the Kissinger method regardless of the sequence of growing phases. However, for phases other than the first one to be formed the direct Kissinger analysis needs to be modified. In the present cases the results obtained by means of an appropriately corrected procedure are not significantly different; that may not always be true. © 1996 American Institute of Physics.
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  • 2
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 75 (1994), S. 3423-3434 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The microstructure and Cu distribution were determined for blanket and patterned Al(≤4 wt % Cu) thin films as a function of annealing. The growth of aitch-theta-phase (Al2Cu) precipitates in blanket and patterned submicrometer-wide lines was quantified along with the Cu concentrations within the Al grains. The reliability of 0.5-μm-wide lines was found to be strongly influenced by the details of the annealing sequence; however, 1-μm-wide lines were less affected. The difference in the electromigration behavior of 0.5-μm-wide lines is shown to be due to the different film microstructures formed in the patterned lines as a function of annealing history. Specifically, the amount of Cu in the grains and the size and distribution of the aitch-theta-phase precipitates were found to be a strong function of both the annealing conditions and the linewidth in 0.5–1-μm-thick Al(Cu) films.
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  • 3
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 82 (1997), S. 4319-4326 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: We show that dramatically different in-plane textures can be produced in body centered cubic (bcc) metal thin films deposited on amorphous substrates under different deposition conditions. The crystallographic orientation distribution of polycrystalline bcc metal thin films on amorphous substrates often has a strong 〈110〉 fiber texture, indicating that {110} planes are parallel to the substrate plane. When deposition takes place under bombardment by energetic ions or atoms at an off-normal angle of incidence, the 〈110〉 fiber texture develops an in-plane texture, indicating nonrandom azimuthal orientations of the crystallites. Three orientations in Nb films have been observed under different deposition geometries, in which the energetic particle flux coincides with channeling directions in the bcc crystal structure. In-plane orientations in Mo films have also been obtained in magnetron sputtering systems with various configurations. These are described, and an example is given in which the in-plane orientation of Mo films deposited in two different in-line magnetron sputtering systems differs by a 90° rotation. In these two cases, there is a strong 〈110〉 fiber texture, but the in-plane 〈100〉 direction is oriented parallel to the scan direction in one system, and perpendicular to the scan direction in the other system. The conditions which produce such different in-plane textures in two apparently similar sputtering systems are discussed. © 1997 American Institute of Physics.
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  • 4
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 77 (1995), S. 614-619 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The activation energies, Ea's, for CoSi and CoSi2 formation were determined using in situ resistance measurements during rapid thermal annealing. Co films were evaporated on undoped polycrystalline Si (poly-Si) and single-crystal Si on sapphire (SOS) substrates. The resistance was monitored for heating rates from 1 to 60 °C/s up to 900 °C. There was significant thermal lag between the samples and thermocouple embedded in the susceptor wafer for heating rates greater than 20 °C/s. The thermal lag was quantified by melting Au-Si, Al-Si, and Ag-Si eutectics, and shown to be consistent with finite element modeling. The Ea's determined from Kissinger plots for heating rates ≤20 °C/s were 2.09±0.11 and 2.03±0.08 eV for CoSi formation and 2.91±0.22 and 2.81±0.23 eV for CoSi2 formation, for Co/poly-Si and Co/SOS samples, respectively. © 1995 American Institute of Physics.
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  • 5
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 76 (1994), S. 2781-2790 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The apparent activation energy Ea for Al grain growth, Al2Cu (aitch-theta-phase) precipitation, and Al2Cu dissolution were determined by ramped resistance measurements for both Al(Cu) blanket films and patterned lines. The Ea's measured for the initial stages of grain growth in 0.5-, 1-, and 2-μm-thick Al(4 wt % Cu), Al(2 wt % Cu), and Al films ranged from 1.19 to 1.46 eV. The Ea's for grain growth were higher for 0.6–0.9-μm-wide Al(Cu) lines than for blanket Al(Cu) films 1.89–3.1 eV, and the temperature of the peak transformation rate occurred at a much higher temperature, 310–400 vs 90–155 °C. This is due to the geometric constraints in patterned lines. The Ea's for Al2Cu precipitation in Al(4 wt % Cu) and Al(2 wt % Cu) films varied from 0.86 to 1.25 eV. For 0.6-μm-wide Al(4 wt % Cu) lines, the Ea for Al2Cu precipitation was 1.7 eV. The Ea's for Al2Cu dissolution increased with decreasing Cu content from 1.62–1.74 eV to 2.23–2.30 eV with Al(4 wt % Cu) and Al(2 wt % Cu) films, respectively. The temperature of the peak reaction rate Tp for Al2Cu dissolution increased markedly with increasing film thickness at constant ramp rates. These results demonstrate that the microstructure and Cu distribution in Al(Cu) interconnections on microelectronic chips vary as a function of feature size. This implies that blanket film data is not necessarily applicable to patterned features.
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  • 6
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 70 (1991), S. 2820-2827 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The oxidation kinetics of copper thin films have been studied at temperatures below 200 °C in air. The protection of copper from oxidation can be achieved by alloying copper film with Ti, Pd, Cr, or Al. The influence of the composition and microstructure to the oxidation rate has been studied. The compounds Cu3Ti, Cu3Pd, and CuAl2 are stable in the oxidation ambient. The formation of Cr-oxide, which is a passive oxide, explains the inhibition of oxidation on Cu-Cr films. Compared with the crystalline phase, the amorphous Cu65Ti35 alloy film is more oxidation resistant. A TiN layer with oxygen incorporated is more effective in preventing copper oxidation than a TiN layer without oxygen incorporated. A passivating Si3N4 layer on copper thin films can prevent copper oxidation effectively at 350 °C in oxygen ambient.
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  • 7
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 70 (1991), S. 253-258 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The effects of current crowding near circular contacts has been analyzed. We analyze a simple system of two parallel plates connected by a cylindrical plug. Under a given set of assumptions the problem can be reduced from three-dimensional to one-dimensional geometry. Given this assumption, analytic solutions are obtained for the current and voltage distributions within the plug. From these expressions the correct values for contact resistivity (Pc) are derived. Finally, the analytical expressions are compared with the results from two-dimensional numerical calculations.
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  • 8
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 58 (1985), S. 4125-4129 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: We have investigated the interactions of Al/Ni, Al/NiAl/Ni, Al/Ni3Al, and NiAl3/Ni thin films between 300 and 425 °C. The films were prepared by sequential evaporation and coevaporation, then vacuum annealed and analyzed by Rutherford backscattering and x-ray diffraction. The reaction always started at the interface in contact with the most Al-rich film and resulted in formation and growth of NiAl3, unless that was the most Al-rich layer. Subsequently the reaction proceeded to Ni2Al3. We conclude that the kinetics rather than the thermodynamics is responsible for determining the growth of these phases.
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  • 9
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 62 (1987), S. 2269-2274 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Phase formation has been investigated for thin films in the following systems: Al/Pd, Pd2Al/Al and Pd/PdAl/Al between 200 and 450 °C. The films were prepared by sequential evaporation and coevaporation, annealed under vacuum, and analyzed by Rutherford backscattering and x-ray diffraction. Pd2Al3 is the dominant growing phase in the initial stages of the reaction for these samples. Al is the dominant moving species during the formation of Pd2Al3.
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  • 10
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 60 (1986), S. 4177-4181 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Coevaporated amorphous Co50Ta50 and Co50Mo50 alloys were investigated for applications as diffusion barriers in Al-Si and Au-Si metallization. The high-temperature stability of diffusion barriers has been found to be correlated with the thermodynamical driving forces for chemical reaction between the barrier constituents and their surroundings. Amorphous Co50Ta50 films react with Al overlayers at temperatures around 450 °C, much lower than the crystallization temperature. A TaAl3 layer interposed between the amorphous film and the Al overlayer provides an ideal scheme against degradation during high-temperature annealing. Amorphous Co50Mo50 alloys possess low mutual solubilities and unfavorable free energies for compound formation with Au; it thus remains intact and prevents the interaction between the Si substrate and an overlay Au film during thermal annealing at 550 °C. Degradation of the layered structure at localized points is observed and attributed to the presence of pinholes and other macroscopic defects in the amorphous film.
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