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  • American Institute of Physics (AIP)  (6)
  • Springer  (4)
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  • 1
    Publication Date: 2006-02-01
    Print ISSN: 0022-2461
    Electronic ISSN: 1573-4803
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Published by Springer
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  • 2
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 68 (1990), S. 1629-1634 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: We have studied the mechanisms for formation of continuous CoSi2 layers by high dose (∼1017 cm−2) Co implantation into Si(100). For single dose implantations, a critical dose exists above which coalescence into a single layer occurs after a vacuum anneal at 1000 °C for 30 min, but below which disconnected, strongly {111} faceted precipitates form. Transmission electron microscopy and Rutherford backscattering suggest that the key condition for continuous layer coalescence to occur is the formation of a connected array of small silicide precipitates either as-implanted or during an intermediate 600 °C anneal. This postulate is supported by the observation that super-critical doses which are builtup by successive subcritical doses and 1000 °C anneals do not coalesce into single layers.
    Type of Medium: Electronic Resource
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  • 3
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Review of Scientific Instruments 63 (1992), S. 3174-3176 
    ISSN: 1089-7623
    Source: AIP Digital Archive
    Topics: Physics , Electrical Engineering, Measurement and Control Technology
    Notes: We discuss the design and performance of a radiant heating assembly for limited reaction-rate processing applications. The heating assembly is fabricated in stainless steel on a 300 mm bore flange for incorporation with an ultrahigh vacuum compatible low-pressure chemical vapor deposition system. The heating source is an array of 18 tungsten-halogen lamps; each lamp is rated at 360 W and has its own integral parabolic reflector. A 55-mm-diam "O'' ring sealed quartz window is mounted in front of each lamp allowing the transmission of infrared radiation into a water-cooled stainless-steel deposition chamber.
    Type of Medium: Electronic Resource
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  • 4
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 56 (1990), S. 2445-2447 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: It is shown that strain relaxation during annealing of Si/GexSi1−x/Si heterostructures is significantly enhanced if the strained GexSi1−x layers are implanted with p (B) or n (As) type dopants below the amorphization dose. Comparison of strain relaxation during in situ annealing studies in a transmission electron microscope between unimplanted and implanted structures reveals that the latter show residual strains substantialy below those for unimplanted structures. We propose that this enhanced relaxation is caused by increased dislocation nucleation probabilities due to the high point-defect concentrations arising from implantation.
    Type of Medium: Electronic Resource
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  • 5
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 83 (1998), S. 1988-1994 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Most boron diffusion studies in Si–Ge have been made in regions of uniform germanium content. In this paper diffusion is observed from a boron-doped epitaxial silicon layer across surrounding Si–Ge layers. Pileup of boron in the Si–Ge layers shows that the activity coefficient for boron in Si–Ge is lower than that for pure silicon. A simple pairing model for Si–B interaction fitted the pileup quite well, with the same equilibrium constant applying to both Si0.9Ge0.1 and Si0.97Ge0.03 layers. The effect of this was simply to immobilize a significant fraction of the boron while retaining its acceptor qualities, the ratio of immobile boron to normal substitutional boron being proportional to the germanium content. Quasielectric field effects at the Si–SiGe interface have a strong effect on the results obtained. © 1998 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 6
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 62 (1993), S. 2206-2208 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The activation of the secondary a/2〈110〉{110} glide systems as observed by transmission electron microscopy in epitaxial Ge(Si) and InGaAs layers grown on comparatively highly misfitting substrates, is rationalized in terms of a mechanical equilibrium analysis that includes a frictional force on the gliding dislocations. The conditions for occurrence of further secondary glide planes, such as {113} and {100}, are outlined.
    Type of Medium: Electronic Resource
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  • 7
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 60 (1992), S. 1327-1329 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: We have observed new misfit dislocation configurations and slip systems in (Al)GaAs/InxGa1−xAs/GaAs(100) heterostructures for x≥0.4. Dislocations are observed running along 〈001〉 directions in the interface, which are inconsistent with conventional glide of misfit dislocations on {111} planes in the zincblende lattice. Diffraction contrast analysis in a transmission electron microscope (TEM) shows that these dislocations are of the edge type with b=a/2〈011〉, inclined at 45° to the interface. In situ TEM heating experiments reveal dislocation propagation velocities ∼tens of μm s−1 at 600 °C, suggesting that they are moving by glide, rather than climb. The only slip planes consistent with these observations are {101} planes inclined to the interface. This represents a new relaxation mechanism in highly strained semiconductor heterostructures.
    Type of Medium: Electronic Resource
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  • 8
    Electronic Resource
    Electronic Resource
    Springer
    Journal of materials science 10 (1999), S. 339-343 
    ISSN: 1573-482X
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Abstract Using high resolution secondary ion mass spectrometry (SIMS) measurements we have studied the effects of germanium content on antimony diffusion in strained Si1−x Ge x layers. Samples were molecular beam epitaxy (MBE) grown Si1−x Ge x buried layers incorporating in situ doped antimony delta-layers. These were annealed for a variety of times and temperatures, following which SIMS profiles were taken and from these diffusivities were calculated. The results of a diffusivity versus germanium content study and a diffusivity versus time study are presented; equilibrium antimony diffusion coefficients in alloys of up to 30% germanium are given along with possible transient effects. Changes in antimony diffusivity with composition are attributed to changes in the vacancy population and the vacancy enthalpy of migration. Comparison with the diffusivity of boron versus germanium content in silicon-germanium alloys leads to the proposal that, in silicon-rich alloys, boron diffuses predominantly via the interstitialcy mechanism. The dependence of diffusivity on germanium content for boron is different from that of antimony and it is proposed that the boron diffusion mechanism changes from largely interstitialcy in silicon to vacancy in germanium—the change occurring at around 40% germanium.
    Type of Medium: Electronic Resource
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  • 9
    Electronic Resource
    Electronic Resource
    Springer
    Journal of materials science 11 (2000), S. 549-556 
    ISSN: 1573-482X
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Abstract Silicon-germanium heterostructures incorporating virtual substrates are successfully used for both microelectronic and optoelectronic applications. However, their use is limited by their surface morphology (e.g. roughness) and defect (e.g. threading dislocations) density. High quality silicon-germanium heterostructures incorporating virtual substrates have been grown epitaxially using different methods. This study reports the effects of the growth parameters on the morphology and defects in different silicon-germanium heterostructures incorporating virtual substrates grown in the Southampton University Microelectronics center (SUMC) by low pressure chemical vapor deposition (LPCVD). Two types of structures: one with a linear and the other with a step variation of the germanium concentration in the virtual substrate, were grown and characterized. Results obtained were in good agreement with others already reported in the literature for similar structures grown using different epitaxial techniques.
    Type of Medium: Electronic Resource
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  • 10
    Electronic Resource
    Electronic Resource
    Springer
    Journal of materials science 10 (1999), S. 345-349 
    ISSN: 1573-482X
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Abstract Silicon-germanium (SiGe) heterojunction bipolar transistors (HBT) have become increasingly important for high speed applications. Novel device structures are often required to fully exploit the advantages from incorporation of a heterojunction. In this work, a growth technique is described which uses both selective and non-selective growth of Si and SiGe to produce an advanced SiGe HBT structure. The surface morphology of the material grown is examined using Nomarski contrast optical microscopy and scanning electron microscopy (SEM), and the surface of the epitaxial areas appears smooth with a low defect density. The growth surface is reasonably planar, as needed for further device processing, which suggests the required thicknesses of both selective and non-selective epitaxy were achieved. The Ge and B profiles of the material are measured using secondary ion mass spectroscopy (SIMS), and the layer thicknesses are found to meet the device specification. The crystallinity and defects in the material are examined by transmission electron microscopy (TEM). The material produced is shown to be suitable for fabrication into the proposed device.
    Type of Medium: Electronic Resource
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