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  • 1
    facet.materialart.
    Unknown
    In:  CASI
    Publication Date: 2019-07-13
    Description: The primary'technical objective of this project is to undertake comprehensive testing to generate information on failure modes/criteria to better understand the reliability of: Packages (e.g., Thin Small Outline Package [TSOP], Ball Grid Array [BGA], Plastic Dual In-line Package [PDIPD assembled and reworked with lead-free alloys Packages (e.g., TSOP, BGA, PDIP) assembled and reworked with mixed (lead/lead-free) alloys.
    Keywords: Electronics and Electrical Engineering
    Type: KSC-2008-045 , Cleaner, Sustainable Industrial Materials and Processes (C.S.I.M.P.) Workshop; Mar 17, 2008 - Mar 20, 2008; Coronado, CA; United States
    Format: application/pdf
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