Publication Date:
2019-07-13
Description:
The primary'technical objective of this project is to undertake comprehensive testing to generate information on failure modes/criteria to better understand the reliability of: Packages (e.g., Thin Small Outline Package [TSOP], Ball Grid Array [BGA], Plastic Dual In-line Package [PDIPD assembled and reworked with lead-free alloys Packages (e.g., TSOP, BGA, PDIP) assembled and reworked with mixed (lead/lead-free) alloys.
Keywords:
Electronics and Electrical Engineering
Type:
KSC-2008-045
,
Cleaner, Sustainable Industrial Materials and Processes (C.S.I.M.P.) Workshop; Mar 17, 2008 - Mar 20, 2008; Coronado, CA; United States
Format:
application/pdf