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    NASA-DoD Lead-Free Electronics Project (2007)
    In:  CASI
    Details
    Publication Date: 2019-07-13
    Description: The primary technical objective of the project is to undertake comprehensive testing to generate information on failure modes/criteria to better understand the reliability of: Packages (e.g., TSOP, BGA, PDIP) assembled and reworked with lead-free alloys Packages (e.g., TSOP, BGA, PDIP) assembled and reworked with mixed (lead/lead-free) alloys.
    Keywords: Electronics and Electrical Engineering
    Type: KSC-2007-080 , SMTA AIMS Harsh Environment Electronics Workshop; Jun 13, 2007 - Jun 14, 2007; Indianapolis, IN; United States
    Format: application/pdf
    Location Call Number Expected Availability
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