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    In:  CASI
    Publication Date: 2016-06-07
    Description: Several activities were performed in the area of silicon sheet surface studies. An interferometry technique was developed for measuring residual stresses in short, thin silicon sheets. Simulation of abrasion of silicon by diamond and by scrating and indentation tests was carried out. The wear rate in silicon was correlated with a wear model.
    Keywords: ENERGY PRODUCTION AND CONVERSION
    Type: JPL Proc. of the 24th Project Integration Meeting; p 561-570
    Format: application/pdf
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