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Part 2: Multi-wire slicing. Fixed Abrasive Slicing Technique (FAST) (1982)

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Publication Date: 2011-08-18

Description: The Fixed Abrasive Slicing Techniques (FAST) is a new slicing technique that was developed to slice ingots more effectively. It was demonstrated that 25 wafers/cm can be sliced from 10cm diameter and 19 wafers/cm from 15 cm diameter ingots. Over 99% yield (222 out of a possible 224) was demonstrated during slicing of a 10 cm diameter ingots at 25 wafers/cm. The average thickness of wafers was 0.249 mm and the kerf was 0.151 mm. Slicing rates as high as 0.14 mm/min were also demonstrated for 10 cm diameter ingots.

Keywords: ENERGY PRODUCTION AND CONVERSION

Type: Silicon Ingot Casting, Phase 3 and Phase 4; 67 p

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