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    Transducer measures embedment stresses in electronic modules (1967)
    In:  CASI
    Details
    Publication Date: 2019-06-27
    Description: Strain gage load transducer measures axial embedment stresses in resins used for encapsulation of welded electronic modules. It simulates the geometry of an actual electronic component and can be modified in size, shape, and operating temperature.
    Keywords: ELECTRONIC COMPONENTS AND CIRCUITS
    Type: MFS-13486
    Format: application/pdf
    Location Call Number Expected Availability
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