ISSN:
1662-8985
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
For optimum fabrication and usage of Cu films, an understanding of the relationshipbetween processing and microstructure is required. The existence of twins is another significantfactor for texture development in Cu films. Texture character and strength in the Cu film isdependent on the twin boundary development that is a function of processing conditions and filmthickness. In this study, determination of grain growth and texture in the sputtered andelectroplated Cu films during annealing was performed for films of 100, 480 and 850 nm inthickness deposited on a Ta(25 nm)/Si wafer. The texture was measured by X-ray pole figure.The effect of film thickness on the annealing texture in the sputtered and electroplated Cu films isexamined and discussed
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/01/39/transtech_doi~10.4028%252Fwww.scientific.net%252FAMR.15-17.982.pdf
