ISSN:
1013-9826
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
Microcapsules self-repairing polymeric composites belong to a new kind of smartmaterials. In this work, microcapsules used for polymeric composites self-repairing were preparedby in-situ polymerization. Optical microscopy, scanning electronic microscopy (SEM), fouriertransfer infrared spectroscopy (FT-IR), and thermal gravity analysis (TGA) were used to determinethe properties of prepared microcapsules such as grain size and their distribution, wall thickness,content of core materials and thermal performances of microcapsules. Results showed that theaverage grain size was 210 μm and the wall thickness was in the range of 1.8-5 μm depending onagitation rate. Thermal analysis indicated that the repairing agent’s core materials wereencapsulated in microcapsules
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/01/53/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.334-335.569.pdf