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Apparatus to measure wafer curvature for multilayer systems in a vacuum furnace (2002)

Mann, A. B.

[S.l.] : American Institute of Physics (AIP)

Review of Scientific Instruments 73 (2002), S. 1821-1827

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ISSN: 1089-7623

Source: AIP Digital Archive

Topics: Physics , Electrical Engineering, Measurement and Control Technology

Notes: A laser-based technique for measuring the curvature of a multilayer/substrate couple is described. Unlike most wafer curvature systems, the instrument described measures the local curvature of the multilayer/substrate couple, correcting for the local topography of the substrate, rather than measuring changes in the average curvature of the multilayer/substrate couple. The apparatus has been designed specifically to perform biaxial zero-creep measurements at elevated temperatures in vacuum. It can also be used to examine the development of biaxial stresses during thermal cycling of thin films deposited on substrates. © 2002 American Institute of Physics.

Type of Medium: Electronic Resource

URL: http://dx.doi.org/10.1063/1.1455132

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