ISSN:
1432-1858
Source:
Springer Online Journal Archives 1860-2000
Topics:
Electrical Engineering, Measurement and Control Technology
,
Technology
Notes:
Abstract Capillary adhesive bonding is used successfully to integrate microsystems. To ensure high reliability and quality of the interconnection technique, it is imperative that the propagation of adhesives in the joints be controlled. Two adhesives frequently used in capillary adhesive bonding were examined: a one-component, UV-curing methacrylate adhesive (Dymax 191-M), and a two-component epoxy resin bonding adhesive curing at room temperature (Epo-tek 302-3M). The propagation of these adhesives in joints with different gap heights of 2–20 μm between two PMMA surfaces and between one PMMA and one PI surface was measured and compared with the theoretical adhesive propagation in accordance with the Hagen–Poiseuille equation for a gap flow, with the capillary pressure taken into account. Once the dynamic viscosity, the wetting angle and the surface tension of the adhesive have been determined as a function of the measuring time, the measured propagation of the Epo-tek 302-3M and Dymax 191-M adhesives can be described in good agreement with the theory for all the gap heights under study.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1007/s005420050169
