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Influence of transport current and thermal fluctuations on the resistive properties of HTSC+CuO composites (1999)

Petrov, M. I. ; Balaev, D. A. ; Shaikhutdinov, K. A. ; [et al.]

Springer

Physics of the solid state 41 (1999), S. 881-886

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ISSN: 1063-7834

Source: Springer Online Journal Archives 1860-2000

Topics: Physics

Notes: Abstract Measurements of the temperature dependence of the electrical resistance R(T) below the superconducting transition temperature have been performed at different values of the transport current in HTSC+CuO composites modeling a network of weak S-I-S Josephson junctions (S—superconductor, I—insulator). It has been shown experimentally that the temperature dependence R(T) at different values of the transport current is adequately described by means of the mechanism of thermally activated phase slippage developed by Ambegaokar and Halperin for tunnel structures. Within the framework of this model we have numerically calculated the temperature dependence of the critical current J c(T) as defined by various criteria. Qualitative agreement obtains between the measured and calculated temperature dependences J c(T).

Type of Medium: Electronic Resource

URL: http://dx.doi.org/10.1134/1.1130895

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