ALBERT

All Library Books, journals and Electronic Records Telegrafenberg

Ihre E-Mail wurde erfolgreich gesendet. Bitte prüfen Sie Ihren Maileingang.

Leider ist ein Fehler beim E-Mail-Versand aufgetreten. Bitte versuchen Sie es erneut.

Vorgang fortführen?

Exportieren
  • 1
    Digitale Medien
    Digitale Medien
    Springer
    Journal of materials science 28 (1993), S. 735-741 
    ISSN: 1573-4803
    Quelle: Springer Online Journal Archives 1860-2000
    Thema: Maschinenbau
    Notizen: Abstract Thermal shock resistance of an SiC fibre-(Nicalon®) reinforced borosilicate glass (Pyrex) and lithium aluminosilicate (LAS) matrix composite has been investigated experimentally in the temperature range 0–1000 K. Longitudinal Young's modulus and flexure strength of the composites after thermal shock were obtained as a function of thermal shock temperature. The results are discussed with the observed damage of the composite. The borosilicate glass matrix composite showed multiple cracking of the glass matrix perpendicular to the fibre axis when the thermal shock temperature was above 600 K. Decreases in Young's modulus and flexure strength were also recognized after multiple cracking of the matrix was initiated. On the other hand, the LAS matrix composite showed no damage at thermal shock temperatures below 800 K. However, at 800 K and above, microcracking of the matrix along the fibre axis was observed. After thermal shock, no decrease in the flexure strength was recognized, while the Young's modulus decreased due to microcracking of the matrix when the thermal shock temperatures were 800 K and above. It was found that the major advantage of the composite against thermal shock was to retain non-catastrophic failure properties even after the development of thermally induced damage in the composite.
    Materialart: Digitale Medien
    Standort Signatur Erwartet Verfügbarkeit
    BibTip Andere fanden auch interessant ...
Schließen ⊗
Diese Webseite nutzt Cookies und das Analyse-Tool Matomo. Weitere Informationen finden Sie hier...