ISSN:
1042-7147
Schlagwort(e):
Crystalline interphase
;
Interfacial polymer chain orientation
;
Elastic modulus of interphase
;
Stress-free temperature
;
Reversible energy of adhesion
;
Chemistry
;
Polymer and Materials Science
Quelle:
Wiley InterScience Backfile Collection 1832-2000
Thema:
Chemie und Pharmazie
,
Maschinenbau
Notizen:
The aim of this third part is to analyze the structure and properties of the interfacial region between carbon fibers and PEEK as a function of different thermal conditioning treatments. First, it is shown by means of optical microscopy that the interfacial zone is not different from the bulk matrix when standard cooling conditions are used. On the contrary, a transcrystalline interphase is formed near the carbon fiber surface in systems that have been subjected to isothermal treatments. By comparison with previous results concerning the mechanical properties of the fiber-matrix interface, it appears that the interfacial shear strength decreases in the presence of a transcrystalline interphase or when the crystallization rate of PEEK increases. Moreover, it seems that the “constraint state” of the amorphous phase of PEEK near the fiber surface could also play a role in the interfacial shear strength. Secondly, a method is proposed in order to estimate the elastic modulus of crystalline interphases. It seems that this modulus is strongly dependent on the crystallization rate of the polymer. Finally, the determination of the stress-free temperature, defined as the temperature at which a longitudinal compressive stress just appears on the carbon fiber during the processing of the composites, is performed by recording the acoustic events corresponding to the fragmentation process in single-fiber composites. The results confirm that the crystallization rate and the “constraint state” of the amorphous phase of the matrix play an important role in the mechanical behavior of carbon fiber-PEEK interfaces.
Zusätzliches Material:
6 Ill.
Materialart:
Digitale Medien
URL:
http://dx.doi.org/10.1002/pat.1991.220020401
