ALBERT

All Library Books, journals and Electronic Records Telegrafenberg

Ihre E-Mail wurde erfolgreich gesendet. Bitte prüfen Sie Ihren Maileingang.

Leider ist ein Fehler beim E-Mail-Versand aufgetreten. Bitte versuchen Sie es erneut.

Vorgang fortführen?

Exportieren
  • 1
    Digitale Medien
    Digitale Medien
    Stamford, Conn. [u.a.] : Wiley-Blackwell
    Polymer Engineering and Science 19 (1979), S. 313-318 
    ISSN: 0032-3888
    Schlagwort(e): Chemistry ; Chemical Engineering
    Quelle: Wiley InterScience Backfile Collection 1832-2000
    Thema: Chemie und Pharmazie , Maschinenbau , Physik
    Notizen: The curing behavior of two commercially formulated epoxy resins composed of the tetrafunctional amine dicyandiamide and with differing epoxy components, 4,4′-bisglycidylphenyl-2,2′-propane and the tetraglycidyl ether of methylene dianiline, is characterized by dynamic spring analysis. This supported viscoelastic technique is well suited to the determination of the onset of gelation under isothermal conditions but the method is not useful for monitoring later stages of reaction when the resins become more rigid. The activation energy for the curing of the two resins is about 87 kJ/mole (20.7 kcal/mole). Rate constants for the first order curing reaction are given. Additional studies of films cured below the ultimate Tg show that two relaxations can be observed upon heating. The first relaxation occurs near the original isothermal cure temperature with a low activation energy, about 250 kJ/mole, whereas the second relaxation occurs near the ultimate Tg, under the conditions used here, with an activation energy of 500-650 kJ/mole. It is believed that these activation energies provide a unique method of characterizing the molecular mobility of epoxy resins at various states of cure.
    Zusätzliches Material: 7 Ill.
    Materialart: Digitale Medien
    Standort Signatur Erwartet Verfügbarkeit
    BibTip Andere fanden auch interessant ...
Schließen ⊗
Diese Webseite nutzt Cookies und das Analyse-Tool Matomo. Weitere Informationen finden Sie hier...