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  • 1
    Electronic Resource
    Electronic Resource
    Stamford, Conn. [u.a.] : Wiley-Blackwell
    Polymer Engineering and Science 3 (1963), S. 251-259 
    ISSN: 0032-3888
    Keywords: Chemistry ; Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: The influence of bulk physical properties on the bond strength of an adhesive was studied. A conventional epoxy resin when cured with various mixtures of phthalic acid and anhydride exhibits maximum bond strength when the curing agent is 75% acid and 25% anhydride. This effect is explained on the basis of physical properties of the unfilled resin systems. Most significant of these were the heat distortion temperature and the compressive break and yield strengths.
    Additional Material: 11 Ill.
    Type of Medium: Electronic Resource
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