ISSN:
0001-1541
Keywords:
Chemistry
;
Chemical Engineering
Source:
Wiley InterScience Backfile Collection 1832-2000
Topics:
Chemistry and Pharmacology
,
Process Engineering, Biotechnology, Nutrition Technology
Notes:
A mathematical model of copper plating of a through-hole is developed which relates uniformity of deposition to bulk electrolyte composition, applied potential difference, aspect ratio, through-hole diameter, and deposition kinetics. The electrochemical transport equations governing plating in a through-hole are solved assuming that the fluid within the through-hole is stagnant. Conditions for uniform plating are determined both for Butler-Volmer kinetics considering the effects of dissociation of bisulfate ions in the electrolytic solution and for kinetics limited by complexation of cupric ions with an adsorbed neutral additive species.
Additional Material:
10 Ill.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1002/aic.690360804
