ISSN:
0305-6120
Quelle:
Emerald Fulltext Archive Database 1994-2005
Thema:
Elektrotechnik, Elektronik, Nachrichtentechnik
Notizen:
Theexplosive growth of high-density packaging has created a tremendous impact on theelectronics assembly and manufacturing industry. Ball Grid Array (BGA), Chip ScalePackaging (CSP), Direct Chip Attach (DCA), and flip-chiptechnologies are taking the lead in this advanced manufacturing process. Many major equipmentmakers and leading electronic companies are now gearing up for these emerging and advancedpackaging technologies. In this paper, they will be briefly discussed.
Materialart:
Digitale Medien
URL:
http://dx.doi.org/10.1108/03056129710370277
