ISSN:
0305-6120
Source:
Emerald Fulltext Archive Database 1994-2005
Topics:
Electrical Engineering, Measurement and Control Technology
Notes:
Theexplosive growth of high-density packaging has created a tremendous impact on theelectronics assembly and manufacturing industry. Ball Grid Array (BGA), Chip ScalePackaging (CSP), Direct Chip Attach (DCA), and flip-chiptechnologies are taking the lead in this advanced manufacturing process. Many major equipmentmakers and leading electronic companies are now gearing up for these emerging and advancedpackaging technologies. In this paper, they will be briefly discussed.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1108/03056129710370277