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Device processing using the trilevel technique (1980)

Moran, J. M. ; Maydan, D.

Stamford, Conn. [u.a.] : Wiley-Blackwell

Polymer Engineering and Science 20 (1980), S. 1097-1101

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ISSN: 0032-3888

Keywords: Chemistry ; Chemical Engineering

Source: Wiley InterScience Backfile Collection 1832-2000

Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics

Notes: Three front runners for the next generation of devices for fine line lithography are photo, electron, and X-ray lithography. Each of these techniques has both advantages and disadvantages when considered for direct wafer processing. This paper discusses the problems encountered using each of these techniques and how a trilevel technique can be applied to make each of these techniques more viable.

Additional Material: 10 Ill.

Type of Medium: Electronic Resource

URL: http://dx.doi.org/10.1002/pen.760201612

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