ISSN:
1662-9752
Quelle:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Thema:
Maschinenbau
Notizen:
In order to study the effect of trace impurities on high-cycle fatigue damage of ultrafinegrained (UFG) copper, fatigue tests were carried out for two samples: oxygen-free copper (OFC,99.99 wt% Cu) and deoxidized low-phosphorous copper (DLP, 99.95 wt% Cu). After the processingby equal channel angular pressing (ECAP) using eight passes, equiaxed grains with an average sizeof 250 nm were formed for both the samples. Fatigue strength of UFG copper was enhanced by theimpurities. The formation behavior of surface damage and the change in surface hardness wasmonitored. A close relationship was observed between the change in hardness and the formationbehavior of surface damage. The physical background of the effect of trace impurities on the fatiguedamage was discussed from the viewpoints of surface damage formation behavior
Materialart:
Digitale Medien
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/02/19/transtech_doi~10.4028%252Fwww.scientific.net%252FMSF.584-586.809.pdf