ISSN:
1432-0630
Keywords:
61.70.Tm
;
x81.10.It
Source:
Springer Online Journal Archives 1860-2000
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
,
Physics
Notes:
Abstract The damage left by high-current-density, ∼9 μA/cm2, implants of 120 keV phosphorus into 〈100〉 and 〈111〉 silicon oriented substrates was investigated as a function of the fluence in the range 4×1015–1.5×1016/cm2. The samples were analyzed by 2 MeV He+ channeling and transmission electron microscopy. Initially a buried amorphous layer forms at low fluences until the wafer temperature saturates at ∼450 °C at a fluence of ∼4.5×1015/cm2. As the fluence is further increased ion-assisted regrowth of this initial buried amorphous layer takes place and is 2 to 2.5 times faster (with respect to ion fluence) for 〈100〉 substrates than for 〈111〉 substrates. At higher fluences, most of the residual damage is located at a depth equal to the sum of the projected range and of the straggling. In the regrown layers twins are found in both orientations, and in some cases a hexagonal silicon phase is present at high fluences. The results are compared with the ion assisted regrowth of amorphous layers at well defined temperatures in the 250°–400 °C range.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1007/BF00616691
