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  • 1
    Electronic Resource
    Electronic Resource
    Springer
    Il nuovo cimento della Società Italiana di Fisica 11 (1989), S. 1805-1818 
    ISSN: 0392-6737
    Keywords: Methods of crystal growth and purification ; Growth from solid phases ; Radiation damage and other irradiation effects, ions
    Source: Springer Online Journal Archives 1860-2000
    Topics: Physics
    Description / Table of Contents: Riassunto Nel presente lavoro è stata analizzata la ricrescita epitassiale indotta da fasci ionici di strati di Si amorfo depositati da fase di vapore su substrati di Si monocristallino di orientazione (100). La ricrescita è stata indotta da un fascio di ioni Kr++ da 600 keV e con dosi variabili tra 2·1015 e 6·1015 ioni/cm2, mantenendo costante e pari a 1·1012 ioni/cm2s il flusso, di ioni incidenti. La temperatura del campione è stata posta a 450°C. Durante gli irraggiamenti la velocità dell'interfaccia cristallo-amorfo è stata misuratain situ seguendo il segnale di riflettività della luce di un laser He-Ne incidente sulla superficie del campione. Dopo l'irraggiamento alcuni campioni sono stati anche analizzati tramite retrodiffusione alla Rutherford di4He+ da 2 MeV in combinazione con l'effetto di incanalamento e mediante microscopia elettronica in trasmissione. La velocità di crescita degli strati depositati dipende dalla procedura di pulizia eseguita sui campioni prima della deposizione, vale a dire dalla quantità totale di ossigeno presente all'interfaccia tra strato depositato e substrato. È stato anche osservato che gli strati ricristallizzati contengono del materiale geminato la cui concentrazione è fortemente dipendente dalla pulizia del substrato. Questi fenomeni sono spiegati in termini di una diminuzione della velocità di crescita assistita da fasci ionici in presenza di alte concentrazioni di ossigeno. I dati sono discussi e confrontati con quelli ottenuti con trattamenti termici convenzionali.
    Abstract: Резюме Наблюается ионно-стимулированный рост пленок Si, осажденных из химического пара на подложках (100)Si. Рост был индуцирован пучком ионов Kr++ с энергией 600 кэВ при дозах в области (2·1015÷6·1015) см−2 и при интенсивности изменения дозы 1·1012 см−2с−1. Температура мишени составляяла 450°C. Во время облучения скорость границы раздела «кристалл-аморфное тело» измерялось посредством мониторирования коэффициента отражения пучка He-Ne лазера, сфокусированного на поверхности образца. После облучения также проводился анализ некоторых образцов с помощью обратного Резерфордовского рассеяния в сочетании с эффектом каналирования и трансмиссионной электронной спектроскопией. Скорость роста осажденных слоев зависит от процедуры очистки перед непылением, т.е. от результирующего количества кислорода, имеющегося на границе раздела между осажденным слоем и подложкой. В рекристаллизованных слоях наблюдается двойниковый материал и его концентрация сильно зависит от частоты подложки. Эти явления объясняются терминах уменьшения скорости роста при высоких концентрациях кислорода. Полученные данные обсуждаются и сравниваются с данными, полученными при чистом температурном отжиге.
    Notes: Summary The ion-assisted regrowth of chemical-vapour deposited Si films onto (100) Si substrates is reported. The regrowth was induced by a 600 keV Kr++ beam at doses in the range (2·1015÷6·1015)/cm2 and at a dose rate of 1·1012/cm2s. The target temperature was set at 450°C. During irradiations the crystal-amorphous interface velocity was measuredin situ by monitoring the reflectivity of a He-Ne laser light focused onto the sample surface. After irradiation some samples were also analysed by Rutherford backscattering in combination with the channelling effect and by transmission electron microscopy. The growth rate of deposited layers depends on the cleaning procedure performed prior to deposition,i.e on the total amount of oxygen present at the deposited layer/substrate interface. Moreover, twinned material is observed in the recrystallized layers and its concentration is strongly dependent on substrate cleaning. These phenomena are explained in terms of a decrease in the ion-assisted growth rate in the presence of high oxygen concentrations. The data are discussed and compared with those obtained during pure thermal annealing.
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    Amsterdam : Elsevier
    Nuclear Physics B (Proceedings Supplements) 23 (1991), S. 107-113 
    ISSN: 0920-5632
    Source: Elsevier Journal Backfiles on ScienceDirect 1907 - 2002
    Topics: Physics
    Type of Medium: Electronic Resource
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  • 3
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 69 (1991), S. 726-731 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The diffusion into a p-type Si substrate of arsenic ions implanted into TiSi2 layers has been investigated for several thermal diffusion treatments in the 900–1100 °C temperature range. The drive-in was performed using either a rapid thermal annealing system or a traditional furnace. Shallow (20–80-nm depth) junctions were obtained with a high (1019–1020/cm3) dopant concentration at the silicide-silicon interface. The amount of diffused arsenic atoms measured by Rutherford backscattering spectrometry increases linearly with the square root of the annealing time. A similar relation was found for the amount of electrically active arsenic, as measured by Van der Pauw structure in combination with anodic oxidation. The two quantities differ and the inactive dopants precipitate in the diffused layer as seen by transmission electron microscopy. This behavior might be associated to the high tensile stress induced by the silicide layer on the surface silicon region and to its influence on the solid solubility and clustering of arsenic atoms. Precipitates are easily dissolved after thermal annealing in the absence of the TiSi2 layer.
    Type of Medium: Electronic Resource
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  • 4
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 68 (1990), S. 1601-1605 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Rutherford backscattering spectrometry and spreading resistance techniques have been used to determine the concentration profiles of gold implanted and diffused in n-type silicon. Diffusion has been performed at 1243 K for times ranging between 1 and 20 h in a dry-nitrogen flux. Resistivity profiles were transformed into concentration profiles by solving the charge balance equation. The entropy factor for the ionization of gold acceptor level was determined to be 50±5. By using this value and solving the charge balance equation we have calculated the silicon resistivity versus gold concentration (and therefore minority-carrier lifetime) curves as a function of the resistivity of starting material. Experimental gold concentration profiles were compared to the profiles obtained by numerical solution of the diffusion equation for gold in silicon. The measured diffusion coefficients coincide with the values determined for p-type material.
    Type of Medium: Electronic Resource
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  • 5
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 67 (1990), S. 7174-7176 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The matter transport of arsenic ions implanted into titanium silicide layers has been investigated after thermal diffusion treatment in the 800 °C–1100 °C temperature range. The arsenic atoms redistribute between TiSi2 and Si with a segregation coefficient depending on temperature. The diffused amount increases linearly with the square root of annealing time at 1100 °C. The n-doped shallow Si layer has a quite good electrical activity with a mean resistivity of about 1.2 MΩ cm. The leakage current of the reverse-biased n+/p junction is instead quite high. Stacking faults are observed in the diffused layer.
    Type of Medium: Electronic Resource
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  • 6
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 64 (1988), S. 6291-6295 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: We report detailed measurements of gold concentration profiles in 〈100〉, p-type silicon. The gold has been introduced by ion implantation and diffused in the temperature range 1073–1473 K and for times ranging from 60 s to 100 h. The resistivity profiles have been converted into gold concentration profiles by using the recently measured value of the entropy factor for the ionization of the gold donor level. The measured profiles and their time dependence can be accounted for by the kick-out diffusion mechanism. The activation energies for the effective diffusion coefficient and for the gold substitutional concentration are 1.7±0.1 and 1.6±0.1 eV, respectively. The resulting flux of silicon self-interstitials is thus described by an activation energy of 3.3±0.1 eV.
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  • 7
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 59 (1986), S. 4038-4042 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The damage left by high current density∼10 μA/cm2 implants of 120-keV P+ into 4-in. (500-μm-thick) and 5-in. (600-μm-thick) Si wafers of 〈100〉 orientation has been measured by 2.0-MeV He backscattering in combination with the channeling effect technique. The fluences ranged between 1 and 7.5×1015/cm2. The amount of disorder is highest at 1×1015/cm2 and then decreases with fluence. The annealing of the amorphous layer takes place by the movement of two and one amorphous–single crystal interfaces for the 500- and 600-μm-thick wafers, respectively. The experimental data are compared with a beam annealing model based on the temperature-rise profile, the amount of point defects generated by the ion in the collision cascade volume, and the assumption of a regrowth process governed by an activation energy of 0.25 eV.
    Type of Medium: Electronic Resource
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  • 8
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 69 (1991), S. 1350-1354 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Diffusion of ion-implanted gold in a silicon single crystal has been studied by the spreading resistance technique. In this work we investigate both unidimensional and bidimensional diffusion across the wafer and along the wafer surface, respectively, by using limited or unlimited gold sources. We will show that by using ion implantation of gold it is possible to produce unique concentration profiles through the fine control of the amount of gold atoms in the diffusion source; both depth and surface profiles can be tailored. All the measured profiles are in good agreement with the theoretical prediction of the kick-out mechanism for gold diffusion in silicon.
    Type of Medium: Electronic Resource
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  • 9
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 52 (1988), S. 558-560 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Rutherford backscattering spectrometry and spreading resistance techniques have been used to determine the concentration profiles of gold implanted on and diffused in p-type silicon. The measurement of the gold concentration is possible by the solution of the charge neutrality condition and thus it requires the determination of the entropy factor X associated with the ionization of the gold donor level. The value of 28±2 compares well with the latest determination of X obtained by using rather complex techniques.
    Type of Medium: Electronic Resource
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  • 10
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 52 (1988), S. 712-714 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Thin layers of Si were chemical vapor deposited onto as-received 〈100〉 p-type Si wafers. The samples were subsequently implanted with 1×1015/cm2, 80 keV As. The native oxide film impedes the growth even at 800 °C, 1 h; instead irradiation with 600 keV Kr++ at 450 °C causes the epitaxial growth of the entire deposited and amorphized Si layer. The sheet resistance of these As-doped layers (130 Ω/(D'Alembertian)) coincides with that of samples in which the amorphous layer was obtained by As ion implantation only. The value is at least ten times lower than that of the polycrystalline layer doped with the same amount of As.
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