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  • Electronics and Electrical Engineering  (120)
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  • 1
    Publication Date: 2019-08-05
    Description: Radioisotope Thermoelectric Generators (RTGs) have been used to power NASA missions of various types throughout the past five decades. The most recent RTG iteration, used for NASAs Mars Science Laboratory, is the Multi-Mission RTG (MMRTG), which is currently the only spaceflight-qualified system available. The U.S. planetary science community has expressed a desire for more power system options to be available to accommodate a range of ambitious future mission concepts across the solar system. Recent advancements in thermoelectric (TE) materials technology have raised a potential for significantly increased efficiency in future RTGs, which helped spur a recent in-depth NASA study of options for future systems. A next-generation RTG study was conducted to develop new RTG concepts that could meet the needs of planetary science missions through the 2030s and beyond. A Next-Generation RTG would aim to extend the types of potential NASA missions able to be supported, while fulfilling requirements related to technical risk and schedule. In this study, 21 potential thermoelectric couple configurations were analyzed by considering various high-performance, high-temperature TE materials and segmentation techniques that maximize convertor efficiency and power density. System modularity was explored, and found to be a promising means to offer improved flexibility for NASA mission concepts with varying scope and power requirements. This paper presents the results of the study, demonstrating the viability of developing an updated RTG system design, and defining conceptual system approaches for a new, potentially revolutionary RTG.
    Keywords: Electronics and Electrical Engineering
    Type: JPL-CL-CL#17-6650 , 2018 IEEE Aerospace Conference; Mar 03, 2018 - Mar 10, 2018; Bog Sky, MT; United States
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  • 2
    Publication Date: 2019-07-20
    Description: Superconducting transition-edge sensor (TES) microcalorimeters are being developed for a variety of potential astrophysics missions, including Athena. The X-ray integral field unit instrument on this mission requires close-packed pixels on a 0.25 mm pitch, and high quantum efficiency between 0.2 and 12 keV. In this work, we describe a new approach with 50 m square TESs consisting of a Mo/Au bilayer, deposited on silicon nitride membranes to provide a weak thermal conductance to a ~50 mK heat bath. Larger TESs usually have additional normal metal stripes on top of the bilayer to reduce the noise. However, we have found that excellent spectral performance can be achieved without the need for any normal metal stripes on top of the TES. A spectral performance of 1.58+/-0.12 eV at 5.9 keV has been achieved, the best resolution seen in any of our devices with this pixel size.
    Keywords: Electronics and Electrical Engineering
    Type: GSFC-E-DAA-TN68358 , GSFC-E-DAA-TN61299 , Journal of Low Temperature Physics (ISSN 0022-2291) (e-ISSN 1573-7357); 193; 3-4; 337–343
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  • 3
    Publication Date: 2019-07-20
    Description: The use of complex single and multicore processors with significant cache memory, on-chip peripherals, memory controllers, and high speed input/output (IO) that integrate many of the parts of a traditional computer system is becoming more common in space applications. Such devices are often referred to as system on a chip devices (SOCs), even though the term is used somewhat inaccurately due to the lack of analog and mixed signal subcircuits. These devices are complex combinations of single- or multi-core processors with memory controllers, high-speed input/output (IO), and other peripheral structures that formerly would have been handled by off-chip resources. In the past the processors were tested for single event effects (SEE) separately, and the peripherals were often put into custom application-specific integrated circuits (ASICs) along with other resources required by the user. Performance and cost pressures have pushed commercial devices to incorporate many of the functional blocks into a single chip, an SOC. The NASA Electronic Parts and Packaging Program (NEPP) has been examining ways to perform SEE radiation hardness assurance (RHA) testing of these processor-centric SOCs to achieve reasonable understanding of their performance in space missions.
    Keywords: Electronics and Electrical Engineering
    Type: JPL-PUB-18-2
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  • 4
    Publication Date: 2019-07-20
    Description: This presentation gives an overview of the natural space radiation environment, the ground-level radiation environment, and single-event effects (SEEs). We then discuss the impact of SEEs for road vehicle functional safety and issues with commercial electronic components in these high-reliability systems. Finally, we introduce some forward-looking concepts that the radiation effects and automotive electronics communities will have to address as aggressive technology insertion continues.
    Keywords: Electronics and Electrical Engineering
    Type: GSFC-E-DAA-TN61069 , Automotive Semiconductor Safety Innovation Conference (ASSIC); Sep 21, 2018; Seoul; Korea, Democratic People''s Republic of
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  • 5
    Publication Date: 2019-07-19
    Description: Operational testing of prototype 4H-SiC JFET ICs across an unrivaled ambient temperature span in excess of 1000 C, from -190 C to +812 C, has been demonstrated without any change/adjustment of input signal levels or power supply voltages. This unique ability is expected to simplify infusion of this IC technology into a broader range of beneficial applications.
    Keywords: Electronics and Electrical Engineering
    Type: GRC-E-DAA-TN58766 , European Conference on Silicon Carbide and Related Materials (ECSCRM 2018); Sep 02, 2018 - Sep 06, 2018; Birmingham; United Kingdom
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  • 6
    Publication Date: 2019-07-20
    Description: These charts provide an overview of the NASA electronic parts management implementation and execution process as well as the agency-wide radiation test facility block buy. Near-term challenges and future management team efforts are also described.
    Keywords: Electronics and Electrical Engineering
    Type: GSFC-E-DAA-TN66547
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  • 7
    Publication Date: 2019-07-19
    Description: Model-based diagnostics and prognostics rely on state estimation and uncertainty management algorithms to produce useful information for system operators and maintainers. This information enables more informed operational decisions, condition-based maintenance, and overall mission safety assurance. Typically, uncertainty is associated with vehicle state-of-health estimation and prediction results because of modeling errors, internal or external sources of noise, and sensor inaccuracy. Probabilistic uncertainty management methods including Sequential Monte Carlo simulation are commonly used to reason about state-of-health estimates and predictions in the presence of these sources of uncertainty. However, such algorithms can be computationally expensive as they require a very large number of samples to obtain a sufficiently accurate quantification of the end of life probability distribution. As a result, highly mobile autonomous systems that leverage the prognostic results for mission-level replanning are often constrained in their processing capability because of these computationally expensive simulation approaches. Therefore, in this paper, we investigate algorithmic methods for dynamically adjusting simulation time step as well as number of samples to achieve highly efficient prognostic results while maintaining results accuracy. Results obtained from simulated flight experiments of an electric unmanned aerial vehicle are presented to verify the efficacy of such algorithms.
    Keywords: Electronics and Electrical Engineering
    Type: ARC-E-DAA-TN53265 , European Conference of the Prognostics and Health Management Society 2018; Jul 03, 2018 - Jul 06, 2018; Utrecht; Netherlands
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  • 8
    Publication Date: 2019-07-12
    Description: This presentation describes the accelerating use of Commercial off the Shelf (COTS) parts in space applications. Component reliability and threats in the context of the mission, environment, application, and lifetime. Provides overview of traditional approaches applied to COTS parts in flight applications, and shows challenges and potential paths forward for COTS systems in flight applications it's all about data!
    Keywords: Electronics and Electrical Engineering
    Type: GSFC-E-DAA-TN54594
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  • 9
    Publication Date: 2019-07-12
    Description: Printed electronic device comprising a substrate onto at least one surface of which has been applied a layer of an electrically conductive ink comprising functionalized graphene sheets and at least one binder. A method of preparing printed electronic devices is further disclosed.
    Keywords: Electronics and Electrical Engineering
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  • 10
    Publication Date: 2019-07-12
    Description: This is an independent investigation that evaluates the single event destructive and transient susceptibility of the Xilinx Kintex-UltraScale device. Design/Device susceptibility is determined by monitoring the device under test (DUT) for Single Event Transient (SET) and Single Event Upset (SEU) induced faults by exposing the DUT to a heavy ion beam. Potential Single Event Latch-up (SEL) is monitored throughout heavy-ion testing by examining device current. This device does not have embedded mitigation. Hence, user implemented mitigation is investigated using Synopsys mitigation tools.
    Keywords: Electronics and Electrical Engineering
    Type: GSFC-E-DAA-TN45195
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  • 11
    Publication Date: 2019-07-12
    Description: Electronics designed for space exploration missions must display efficient and reliable operation under extreme temperature conditions. For example, lunar outposts, Mars rovers and landers, James Webb Space Telescope, Europa orbiter, and deep space probes represent examples of missions where extreme temperatures and thermal cycling are encountered. Switching transistors, small signal as well as power level devices, are widely used in electronic controllers, data instrumentation, and power management and distribution systems. Little is known, however, about their performance in extreme temperature environments beyond their specified operating range; in particular under cryogenic conditions. This report summarizes preliminary results obtained on the evaluation of commercial-off-the-shelf (COTS) automotive-grade NPN small signal transistors over a wide temperature range and thermal cycling. The investigations were carried out to establish a baseline on functionality of these transistors and to determine suitability for use outside their recommended temperature limits.
    Keywords: Electronics and Electrical Engineering
    Type: GRC-E-DAA-TN46661
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  • 12
    Publication Date: 2019-07-20
    Description: One time programmable (OTP) antifuse base memory is demonstrated based on a bulk junctionless gate-all-around (GAA) nanowire transistor technology. The presented memory consists of a single transistor (1T) footprint without any process modification. The source/drain (S/D) and gate respectively become bit line and word line where the antifuse is formed by oxide breakdown across the gate and the channel. The channel is connected directly to the bit line due to junctionless S/D and inherently isolated from the neighboring cell by the GAA channel. Therefore, an array of 1T antifuse OTP can be a candidate for the sub-5-nanometer technology node.
    Keywords: Electronics and Electrical Engineering
    Type: ARC-E-DAA-TN56598
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  • 13
    Publication Date: 2019-07-19
    Description: Ionic liquids are versatile electrolytes whose properties at electrified interfaces have the potential to enable technologies such as supercapacitors and Li-metal battery anodes. At electrified carbon surfaces, ionic liquids form an electric double layer that stores energy and provides the foundation for supercapacitors. At electrified lithium surfaces, ionic liquids decompose to form a solid electrolyte interphase that has the potential to stabilize Li-metal anodes in rechargable batteries. The behavior of two ionic liquids of technological importance, [pyr14][TFSI] and [EMIM][BF4], are examined at these electrified interfaces through molecular dynamics and ab initio techniques.
    Keywords: Electronics and Electrical Engineering
    Type: ARC-E-DAA-TN53814 , American Chemical Society (ACS) National Meeting & Exposition; Aug 19, 2018 - Aug 23, 2018; Boston, MA; United States
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  • 14
    Publication Date: 2019-07-19
    Description: Highly popular due to their high energy density lithium-ion battery cells have increased in energy density approximately 2.5 times since their commercial debut in 1991. As a result, the hazard severity of a sudden inadvertent release of stored energy has greatly increased. The high energy density of lithium-ion battery cells coupled with the flammable toxic electrolytes they contain and unique failure modes can lead to a potentially catastrophic thermal runaway. This can result in spewing flames even while setting on a shelf unused. The metal oxide cathodes in lithium-ion battery cells can release their oxygen into the cells when they overheat. There is enough oxygen contained in the metal oxide cathodes to combust up to 20 percent of the electrolytes in the cells without any outside oxygen sources. These cells can therefore be viewed as miniature rocket motors capable of venting a considerable blow-torch type flame and up to 2.5 liters of hot flammable toxic gases per cell. This presents special challenges for spaceflight safety. In this paper we will examine roots causes of 18650 lithium-ion battery cell failures and how to best mitigate them at the cell and battery assembly levels. We will also look at some promising future trends that could yield both much greater stored energy and safety.
    Keywords: Electronics and Electrical Engineering
    Type: M17-6159 , IEEE Aerospace Conference; Mar 03, 2018 - Mar 10, 2018; Big Sky, MT; United States
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  • 15
    Publication Date: 2019-07-20
    Description: This presentation covers the basics of the medium voltage electrical system on the Kennedy Space Center. The material will include the process of selective coordination between protective devices and the analysis of a fault that occurred in the electrical system. I will discuss the most common causes of faults found and how the system reacts to the faults at different locations in the subsystem. Explain the importance of the sensitivity and coordination between the devices to protect the equipment it is supplying.
    Keywords: Electronics and Electrical Engineering
    Type: KSC-E-DAA-TN63183
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  • 16
    Publication Date: 2019-07-20
    Description: The GOES R series lithium-ion battery life test results are presented for the next-generation GOES R series weather satellites. Lockheed Martin is under contract to NASA Goddard to build and deliver four GOES-R series satellites which are operated by NOAA. In addition, Lockheed Martin is required to build a GOES R series flight battery to flight drawings and processes and perform an accelerated geosynchronous earth-orbiting (GEO) life test consisting of 30 real-time eclipse seasons and 30 accelerated solstice seasons. The GOES R series batteries are designed and built by Saft America, Inc. Space and Defense Division in Cockeysville, MD with Saft VL48E cells. The GOES R series life test battery which has been built to flight drawings and processes has undergone 21 seasons of accelerated GEO testing (which is equivalent to over 10 years on-orbit). This presentation includes a description of the life test and latest test results through season 20. The life test battery capacity measurements prior to cycling and after seasons 4, 10, and 20 which have shown little or no change are summarized. In addition, the performance of the GOES R series workhorse batteries performance are presented. These GOES R series workhorse batteries are used during spacecraft testing and have shown no discernable capacity loss after 7 years of mostly ambient operation and cold storage since activation. An overview of the electrical power subsystem and battery charge is, also, addressed.
    Keywords: Electronics and Electrical Engineering
    Type: GSFC-E-DAA-TN63402 , NASA Aerospace Battery Workshop; Nov 27, 2018 - Nov 28, 2018; Huntsville, AL; United States
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  • 17
    Publication Date: 2019-07-20
    Description: The paper will present an overview of the current NASA project on development of electric propulsion technologies and in particular, a newly discovered insulation technology, namely micromultilayer multifunctional electrical insulation (MMEI). Results of extensive dielectric performance evaluations and its potential capabilities including efforts of demonstrating scale-up and commercial applicability of MMEI will be summarized.
    Keywords: Electronics and Electrical Engineering
    Type: GRC-E-DAA-TN62266 , EnergyTech 2018; Oct 22, 2018 - Oct 25, 2018; Cleveland, OH; United States
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  • 18
    Publication Date: 2019-07-20
    Description: This work describes recent progress in the design, processing, upscaling, and testing of 500C durable two-level interconnect 4H-SiC JFET IC technology undergoing development at NASA Glenn Research Center. For the first time, stable electrical operation of semiconductor ICs for 1 year (8760 hours) at 500C in air atmosphere is reported. These groundbreaking durability results were attained on two-level interconnect JFET demonstration ICs with 175 or more transistors on each chip. This corresponds to a more than 7-fold increase in 500C-durable circuit complexity from the 24 transistor ring oscillator ICs reported at HiTEC 2016.
    Keywords: Electronics and Electrical Engineering
    Type: GRC-E-DAA-TN56142 , International Conference and Exhibition on High Temperature Electronics (HiTEC 2018); May 08, 2018 - May 10, 2018; Albuquerque, NM; United States
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  • 19
    Publication Date: 2019-07-20
    Description: Bulk metal foil and thin film resistors occasionally contain localized defects within the etched resistor pattern. Common defects of this type include in-line constrictions referred to as notches, unremoved resistor material bridges between adjacent pattern lines, and embedded non-conductive particles in the resistor material. Such defects are prone to fracture due to thermomechanical fatigue during powered operation, especially power cycling, resulting in positive resistance change and open circuit failure modes. Common screening methods of optical microscopy, short time overload power tests (e.g., 6.25x rated power for 5 seconds) and burn-in (e.g., 1.5x rated power for 100 hours) are useful, but they are not always effective at removing devices with such defects. An improved method has been developed to screen for localized resistor pattern defects. The method involves the application of brief, high power electrical pulses at a low duty cycle while inspecting the resistor with a high resolution, high speed infrared camera. The following test conditions were found to be suitable for this purpose: 6.25x rated power, 1 to 5 pulses, 50 ms pulse width and 10% duty cycle. During the power pulsing, localized constrictions in the resistor pattern are identifiable as hot spots via the infrared camera. Reject criteria can be established based on observations of hot spots. To assess its effectiveness, a total of two hundred eighty (280) surface mount foil resistors (40 each from 7 different lots) were screened using this infrared technique. The screening identified twenty-nine (29) resistors with significant hot spots in the resistor pattern. All 280 resistors were then subjected to an industry standard 10,000 hour life test at 1x rated power at 70C with power cycled for 90 minutes on and 30 minutes off. During life testing, three resistors exhibited positive resistance change failure mode. All three failures were due to thermomechanical fatigue failure of localized bridge defects at the locations identified via infrared screening. The results of this evaluation illustrate the benefits of the pulsed-power infrared detection screening technique to identify reliability suspect foil or thin film resistors that may escape common screening methods.
    Keywords: Electronics and Electrical Engineering
    Type: GSFC-E-DAA-TN61419 , GSFC-E-DAA-TN65343 , Space Passive Component Days (SPCD 2018); Oct 09, 2018 - Oct 12, 2018; Noordwijk; Netherlands|Annual Components for Military & Space Electronics (CMSE); Apr 16, 2019 - Apr 18, 2019; Los Angeles, CA; United States
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  • 20
    Publication Date: 2019-07-20
    Description: A standardized test method has been created to characterize and stress graphics processing units (GPU) during radiation effects testing.
    Keywords: Electronics and Electrical Engineering
    Type: GSFC-E-DAA-TN65823 , Nuclear and Space Radiation Effects Conference (NSREC); Jul 16, 2018 - Jul 20, 2018; Kona, HI; United States
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  • 21
    Publication Date: 2019-07-20
    Description: Final Paper, not the Abstract, is attached. Johnson Space Center has been experimenting with various methods of igniting Li-ion cells into thermal runaway (TR). Recently, it was demonstrated that using a high power IR laser, an Li-ion cell can be successfully triggered into TR without perforating its can wall. This method creates a zone of highly localized heat energy that transfers through the can wall and melts nearby layers of the cell separator. Using this method, we are able to trigger various cell designs into a TR response. With unique test conditions, we've been able trigger TR in an elliptical cylindrical cell design without perforating its aluminum can. The method holds promise as an effective single cell TR trigger method in battery assemblies with minimal thermal biasing to adjacent cells.
    Keywords: Electronics and Electrical Engineering
    Type: JSC-E-DAA-TN64226 , NASA Battery Workshop; Nov 27, 2018 - Nov 29, 2018; Huntsville, AL; United States
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  • 22
    Publication Date: 2019-07-13
    Description: Heavy-ion radiation effects knowledge across SiC power devices is examined and insights for more rugged designs and appropriate test methods geared toward space applications are extracted. The conclusions drawn are supported by recent publicly reported heavy-ion test results of a modified SiC MOSFET design.
    Keywords: Electronics and Electrical Engineering
    Type: GSFC-E-DAA-TN59752 , Microelectronics Reliability and Qualification Working (MRQW) Meeting; Feb 06, 2018 - Feb 08, 2018; El Segundo, CA; United States
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  • 23
    Publication Date: 2019-07-13
    Description: Many of the mission targets that NASA and the planetary-science community are interested in are located in deep space, in the 5-10AU range. This provides compelling motivation to develop solar cells and arrays that are highly efficient in low irradiance low temperature (LILT) environments. We give several examples of the iterative process our team has employed to develop cell designs that optimize the performance at LILT. We also provide results on advanced-architecture devices that have already demonstrated very high efficiencies in the Jupiter and Saturn LILT and radiation environments, specifically four-junction inverted metamorphic and triple-junction upright metamorphic solar cells, respectively.
    Keywords: Electronics and Electrical Engineering
    Type: JPL-CL-18-2484 , IEEE World Conference on Photovoltaic Energy Conversion; Jun 10, 2018 - Jun 15, 2018; Waikoloa, HI; United States
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  • 24
    Publication Date: 2019-07-13
    Description: From the outside looking in, the NEPP program supports NASA's traditional approach to providing electrical, electronic, and electromechanical (EEE) assurance for space missions. Standards (military and commercial) for EEE parts are based on risk averse methodologies, drive higher costs and schedules, and, in general, provide devices that significantly lag behind commercial devices in performance aspects (speed, power efficiency, etc...). This is NOT the model most small missions realistically can use. However, when you look behind the curtain, NEPP has been considering the risk trade space for small missions for over five years and has consistently provided resources that the small mission regime would find useful. In this paper, we provide a brief overview of these resources as well as NEPP's current research/development efforts that are relevant. While we'll primarily discuss radiation assurance related issues such as data availability and usage, assurances processes for not only the radiation effects side, but also the EEE parts reliability will be touched upon.
    Keywords: Electronics and Electrical Engineering
    Type: GSFC-E-DAA-TN66200 , GSFC-E-DAA-TN57788 , AIAA Small Satellite Conference; Aug 04, 2018 - Aug 09, 2018; Logan, UT; United States
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  • 25
    Publication Date: 2019-07-13
    Description: The presentation will discuss fuel cell research and development for earth and space applications.
    Keywords: Electronics and Electrical Engineering
    Type: GRC-E-DAA-TN56340 , Department of Energy Hydrogen and Fuel Cells Program Annual Merit Review and Peer Evaluation Meeting; Jun 13, 2018 - Jun 15, 2018; Washington, D.C.; United States
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  • 26
    Publication Date: 2019-07-13
    Description: The following are updated or new subjects added to the FPGA SEE Test Guidelines manual: academic versus mission specific device evaluation, single event latch-up (SEL) test and analysis, SEE response visibility enhancement during radiation testing, mitigation evaluation (embedded and user-implemented), unreliable design and its affects to SEE Data, testing flushable architectures versus non-flushable architectures, intellectual property core (IP Core) test and evaluation (addresses embedded and user-inserted), heavy-ion energy and linear energy transfer (LET) selection, proton versus heavy-ion testing, fault injection, mean fluence to failure analysis, and mission specific system-level single event upset (SEU) response prediction. Most sections within the guidelines manual provide information regarding best practices for test structure and test system development. The scope of this manual addresses academic versus mission specific device evaluation and visibility enhancement in IP Core testing.
    Keywords: Electronics and Electrical Engineering
    Type: GSFC-E-DAA-TN65859 , GSFC-E-DAA-TN53721 , Government Microcircuits Applications and Critical Technologies (GOMAC) Tech 2018 Conference; Mar 12, 2018 - Mar 15, 2018; Miami, FL; United States
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  • 27
    Publication Date: 2019-07-13
    Description: The following are updated or new subjects added to the FPGA SEE Test Guidelines manual: academic versus mission specific device evaluation, single event latch-up (SEL) test and analysis, SEE response visibility enhancement during radiation testing, mitigation evaluation (embedded and user-implemented), unreliable design and its affects to SEE Data, testing flushable architectures versus non-flushable architectures, intellectual property core (IP Core) test and evaluation (addresses embedded and user-inserted), heavy-ion energy and linear energy transfer (LET) selection, proton versus heavy-ion testing, fault injection, mean fluence to failure analysis, and mission specific system-level single event upset (SEU) response prediction. Most sections within the guidelines manual provide information regarding best practices for test structure and test system development. The scope of this manual addresses academic versus mission specific device evaluation and visibility enhancement in IP Core testing.
    Keywords: Electronics and Electrical Engineering
    Type: GSFC-E-DAA-TN52006 , GSFC-E-DAA-TN65829 , Government Microcircuits Applications and Critical Technologies Conference (GOMAC) Tech 2018; Mar 12, 2018 - Mar 15, 2018; Miami, FL; United States
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  • 28
    Publication Date: 2019-07-13
    Description: The aerospace and semiconductor industries lost approximately 2000 hours annually of research access when IUCF closed. An ad hoc team between the U.S. government and industry was formed to evaluate other facility options. In this presentation, we will discuss: 1) Why aerospace, semiconductor manufacturers, and others are interested in proton facility access, as well as, 2) Some of the basics of a typical tests for electronics, and 3) We'll conclude with the brief current status on progress.
    Keywords: Electronics and Electrical Engineering
    Type: GSFC-E-DAA-TN65827 , GSFC-E-DAA-TN51786 , JEDEC JC-13, Joint Electron Device Engineering Council (JEDEC), Committee Meeting; Jan 22, 2018 - Jan 24, 2018; Savannah, GA; United States
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  • 29
    Publication Date: 2019-07-13
    Description: This presentation includes NASA Electronic Parts and Packaging (NEPP) Program Future Approaches, Radiation Hardness Assurance (RHA) Examples.
    Keywords: Electronics and Electrical Engineering
    Type: GSFC-E-DAA-TN59754 , 2018-561-NEPP , Small Satellite Conference 2018; Aug 04, 2018 - Aug 09, 2018; Logan, UT; United States
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  • 30
    Publication Date: 2019-07-13
    Description: From the outside looking in, the NEPP program supports NASA's traditional approach to providing electrical, electronic, and electromechanical (EEE) assurance for space missions. Standards (military and commercial) for EEE parts are based on risk averse methodologies, drive higher costs and schedules, and, in general, provide devices that significantly lag behind commercial devices in performance aspects (speed, power efficiency, etc...). This is NOT the model most small missions realistically can use. However, when you look behind the curtain, NEPP has been considering the risk trade space for small missions for over five years and has consistently provided resources that the small mission regime would find useful. In this paper, we provide a brief overview of these resources as well as NEPP's current research/development efforts that are relevant. While we'll primarily discuss radiation assurance related issues such as data availability and usage, assurances processes for not only the radiation effects side, but also the EEE parts reliability will be touched upon.
    Keywords: Electronics and Electrical Engineering
    Type: GSFC-E-DAA-TN59835 , 2018 Small Satellite Conference; Aug 04, 2018 - Aug 09, 2018; Logan, UT; United States
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  • 31
    Publication Date: 2019-07-13
    Description: No abstract available
    Keywords: Electronics and Electrical Engineering
    Type: GSFC-E-DAA-TN61078 , Radiation Effects on Components and Systems (RADECS) 2018 Conference; Sep 18, 2018 - Sep 21, 2018; Gothenburg; Sweden
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  • 32
    Publication Date: 2019-07-13
    Description: The high power density of emerging electronic devices is driving the transition from remote cooling, which relies on con-duction and spreading, to embedded cooling, which extracts dissipated heat on-site. Two-phase microgap coolers employ the forced flow of dielectric fluids undergoing phase change in a heated channel within or between devices. Such coolers must work reliably in all orientations for a variety of applications (e.g., vehicle-based equipment), as well as in microgravity and high-g for other applications (e.g., spacecraft and aircraft). The lack of acceptable models and correlations for orientation- and gravity-independent operation has limited the use of two-phase coolers in such applications. Previous research has revealed that gravita-tional acceleration plays a diminishing role in establishing flow regimes and transport rates as the channel size shrinks, but there is considerable variation among the proposed microscale criteria and limited research on two-phase flows in low aspect ratio mi-crogap channels. Reliable criteria for achieving orientation- and gravity-independent flow boiling would enable emerging sys-tems to exploit this thermal management technique and streamline the technology development process. As a first step toward understanding the effect of gravity on two-phase microgap flow and transport, in the present effort the authors have studied the effect of evaporator orientation and mass flux on near-saturated flow boiling of HFE7100 in a 1.01 mm tall by 13.0 mm wide by 12.7 mm long microgap channel. Orientation-independence, defined as achieving similar critical heat fluxes, heat transfer coefficients, and flow regimes across evaporator orientations, was achieved for mass fluxes of 400 kg/m2-s and greater. The present results are compared to pub-lished criteria for achieving gravity-independence.
    Keywords: Electronics and Electrical Engineering
    Type: GSFC-E-DAA-TN56408 , International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK); Aug 28, 2018 - Aug 30, 2018; San Francisco, CA; United States
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  • 33
    Publication Date: 2019-07-13
    Description: AQUIFER establishes technical feasibility of an early-stage technology, a high-energy density, aqueous-based, flow battery, resulting in a near-term increase of 1.7 times range over an all-electric battery, while retiring fire and explosion hazards associated with lithium-based chemistries. The Nano-electrofuel (NEF) flow battery will be integrated with a rim-driven motor (RDM) as a multi-functional design to eliminate conductive EMI and weight from long cable runs, and provide liquid cooling from the aqueous fuel. When successful, the technology provides an improved safety energy storage solution for emission-free electric propulsion in commercial aviation.
    Keywords: Electronics and Electrical Engineering
    Type: AFRC-E-DAA-TN60723 , Annual Convergent Aeronautics Solutions (CAS) Showcase; Sep 18, 2018 - Sep 20, 2018; Moffett Field, CA; United States
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  • 34
    Publication Date: 2019-07-13
    Description: Commercialization of lithium-air batteries face many challenges, such as electrolyte decomposition, short cycle life, low energy efficiency, low power density, etc. However, commercialization of Li-air batteries for mass sensitive applications such as electric vehicles, portable power source, and drones is more challenging due to additional constraints of safety, electrolyte evaporation, high specific energy requirements, and reliable discharge times. In this presentation, we will present our finite element simulation results comparing Li-O2 and Li-air batteries using power density, energy density, specific power, and discharge times as metrics to evaluate different electrolytes and electrode geometry to reduce total mass and maximize discharge current. We use a finite element model and a discharge product model developed in which is based on porous electrode and concentrated electrolyte theories and the discharge product is modeled using quantum tunneling; for reaction kinetics and oxygen diffusion, an improved model was used. The electrolyte properties such as ion conductivity and ion diffusion were obtained from Molecular Dynamics (MD) simulations while the other parameters for the finite element model were calibrated to match experiments at high discharge current densities (〉1.5 mA/cm2). The mass densities of different electrolytes were computed using MD simulations as well. For this presentation, we examine the practical electrochemical mass of a system at different current ratings, the sensitivity of mass to the use of ambient air as compared to pure oxygen as well as the electrolyte, which affects maximum current density and the total mass associated with the electrolyte (which includes the mass of additional components), and, the optimization of battery geometry for total discharge time, average discharge voltage, maximum discharge current, and minimum electrochemical mass.
    Keywords: Electronics and Electrical Engineering
    Type: ARC-E-DAA-TN58914 , Beyond Lithium Ion; Jul 24, 2018 - Jul 26, 2018; Cleveland, OH; United States
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  • 35
    Publication Date: 2019-07-13
    Description: We present the results of single event effects (SEE) testing and analysis investigating the effects of radiation on electronics. This paper is a summary of test results.
    Keywords: Electronics and Electrical Engineering
    Type: GSFC-E-DAA-TN58916 , Nuclear and Space Radiation Effects Conference (NSREC); Jul 16, 2018 - Jul 20, 2018; Waikoloa, HI; United States
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  • 36
    Publication Date: 2019-07-13
    Description: Total ionizing dose and displacement damage dose testing were performed to characterize and determine the suitability of candidate electronics for NASA spacecraft and program use.
    Keywords: Electronics and Electrical Engineering
    Type: GSFC-E-DAA-TN58915 , 2018-561-NEPP , Nuclear and Space Radiation Effects Conference (NSREC); Jul 16, 2018 - Jul 20, 2018; Kona, Hi; United States
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  • 37
    Publication Date: 2019-07-13
    Description: While some Graphical Processing Units (GPUs) are discrete components (i.e.GTX1050), others take the form of an IP block or embedded engine within a System on Chip (SoC) device such as the Qualcomm Snapdragon"TM" 820 which contains a Qualcomm Adreno"TM" 530 GPU. Within this device are various functional blocks which can be exercised with software payloads. NVidia's Jetson"TM" TX1 SoC is provided on a System on Module (SOM). Within it are Central Processing Unit (CPU) cores and an nVidia GPU which can be accessed similarly to a discrete GPU coprocessor. While the packaging is different, each one of these GPUs needs to be tested using the same standardized code.
    Keywords: Electronics and Electrical Engineering
    Type: GSFC-E-DAA-TN58575 , Nuclear and Space Radiation Effects Conference (NSREC); Jul 16, 2018 - Jul 20, 2018; Kona, HI; United States
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  • 38
    Publication Date: 2019-07-13
    Description: Polymeric aircraft electrical insulation normally degrade by partial discharge with increasing voltage, which causes excessive localized Joule heating in the material and ultimately leads to dielectric failure of the insulator through thermal breakdown. Self-healing insulation may be a viable option to mitigate permanent mechanical degradation, thus increasing the longevity of the material. Instead of relying on catalyst and monomer-filled microcapsules to crack, flow, and cure at the damaged sites described in well-published mechanisms, self-healing through establishment of ionic crosslinks allows for multiple healing events to occur as well as achieving full recovery strength under certain thermal environments. Surlyn, a commercial ionically-crosslinked material, was investigated as a self-healing insulation candidate based on prior demonstrations of self-healing behavior. Thin films of varying thicknesses were investigated and the effects of thickness on the dielectric strength were evaluated and compared to representative polymer insulators. The effects of thermal conditioning on the recovery strength and healing were observed as a function of time following dielectric breakdown. Moisture absorption was studied to determine if moisture absorption rates in Surlyn were lower than that of common polyimide insulators. Preliminary data showed that when cut, Surlyn films lost nearly 60 percent of its original dielectric strength. However, when Surlyn was cut and subsequently annealed, the films not only re-mended, but also recouped approximately 93 percent of its original dielectric strength, along with 90-97 percent of its mechanical strength.
    Keywords: Electronics and Electrical Engineering
    Type: GRC-E-DAA-TN53154 , James Madison University, College of Integrated Science and Engineering; Mar 19, 2018; Cleveland, OH; United States
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  • 39
    Publication Date: 2019-07-13
    Description: In this study, all-solid-state structural lithium-ion batteries, a type of load bearing electrochemical energy storage that provides systems-level weight savings is being pursued for the realization of inherently safe next generation hybrid-electric and all-electric green aerospace propulsion systems. Currently investigated all-solid-state batteries do not meet the requirements for specific power and mechanical stability. To address these issues, freeze casting of lithium aluminum germanium phosphate (LAGP) electrolyte material has been explored for the creation of a textured 3D electrolyte scaffold with large interfacial surface area for high power discharge and hierarchical porosity for accommodation of active material volume changes during electrochemical cycling. We report the effects of freeze casting processing parameters on the microstructural development and mechanical performance of the scaffolds, characterized through scanning electron microscopy and ring-on-ring mechanical testing. Slurry composition and casting parameters such as solids loading, casting speed, tape angle, and temperature gradients have been modified to determine the impact on density, lamellar morphology, and final load-bearing performance.
    Keywords: Electronics and Electrical Engineering
    Type: GRC-E-DAA-TN51562 , 2018 Conference on Electronic and Advanced Materials; Jan 17, 2018 - Jan 19, 2018; Orlando, FL; United States
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  • 40
    Publication Date: 2019-07-13
    Description: We will present the first ever single-event effects testing results on a 22 nm fully-depleted silicon-on-insulator test chip. The 128 MB SRAMs were irradiated with heavy ions and the results are compared to previous technology generations.
    Keywords: Electronics and Electrical Engineering
    Type: GSFC-E-DAA-TN66187 , GSFC-E-DAA-TN56702 , Annual Single Event Effects (SEE) Symposium; May 21, 2018 - May 24, 2018; San Diego, CA; United States|Military and Aerospace Programmable Logic Devices (MAPLD) Workshop; May 21, 2018 - May 24, 2018; San Diego, CA; United States
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  • 41
    Publication Date: 2019-07-13
    Description: This work describes recent progress in the design, processing, and testing of significantly up-scaled 500 C durable 4H-SiC junction field effect transistor (JFET) integrated circuit (IC) technology with two-level interconnect undergoing development at NASA Glenn Research Center. For the first time, stable electrical operation of semiconductor ICs for over one year at 500 C in air atmosphere is reported. These groundbreaking durability results were attained on two-level interconnect JFET demonstration ICs with 175 or more transistors on each chip. This corresponds to a more than 7-fold increase in 500 C-durable circuit complexity from the 24 transistor ring oscillator ICs reported at HiTEC 2016. These results advance the technology foundation for realizing long-term durable 500 C ICs with increased functional capability for combustion engine sensing and control, planetary exploration, deep-well drilling monitoring, and other harsh-environment applications.
    Keywords: Electronics and Electrical Engineering
    Type: GRC-E-DAA-TN54916 , International Conference on High Temperature Electronics (HiTEC 2018); May 08, 2018 - May 10, 2018; Albuquerque, NM; United States
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  • 42
    Publication Date: 2019-07-13
    Description: Li-O2 batteries have traditionally used carbon based electrodes (graphite, buckypaper) as the cathode of choice due to its good electrical conductivity, stability against non-aqueous electrolytes like Dimethyl ether (DME) and ease of handling. But, the carbon cathode also leads to formation of carbonate by-products that increase overpotentials during charging leading to degradation of cathode and reduction of cyclability. In this work, we investigate some of the well-known oxides as cathodes with focus on the interface between the oxide surfaces and the discharge product: Li2O2, in the Li-O2 battery using first principles computations. Our results show that attention must be paid on choosing the appropriate surface of the oxides. We extend the analysis to suggest other possible oxide chemistries that should be investigated as cathodes in Li-O2 batteries.
    Keywords: Electronics and Electrical Engineering
    Type: ARC-E-DAA-TN59072 , Beyond Lithium Ion XI; Jul 24, 2018 - Jul 26, 2018; Westlake, OH; United States
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  • 43
    Publication Date: 2019-07-13
    Description: Using commercially-available monolayer graphene, synthesized by means of chemical vapor deposition, microwave power sensing elements have been nanofabricated and integrated with microwave-grade test structures suitable for on-wafer probing. The graphene, situated on a thermal oxide, was first cleaned of stray contaminants in a forming gas environment briefly held at 250 degrees Celsius using a rapid thermal annealer. Immediately following this step, the graphene was passivated with a protective aluminum oxide layer (approximately S nm in thickness). Micrometer-scale Corbino disc test structures were then fabricated in direct contact with the graphene using a self-aligned process, which relies on the fact that tetramethylammonium hydroxide develops the photoresist while removing the aluminum oxide. Graphene nanoribbons (with widths as small 400 nm) were then fabricated across the Corbino disc gaps using electron-beam writing in conjunction with a negative tone resist. The same developer exposed the majority of the graphene while defining nanometer-scale lines of photoresist stacked upon aluminum oxide. These stacks served as etch-stops while the unprotected graphene was ion-milled in an oxygen plasma. Finally, the photoresist was removed leaving behind passivated graphene nanoribbons. Damage caused by the fabrication was evaluated by comparing the Raman spectra of the grapheme before and after processing.
    Keywords: Electronics and Electrical Engineering
    Type: GRC-E-DAA-TN58257 , IEEE Nanotechnology Materials and Devices Conference (NMDC); Oct 14, 2018 - Oct 17, 2018; Portland, OR; United States
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  • 44
    Publication Date: 2019-07-13
    Description: Bulk metal foil and thin film resistors occasionally contain localized defects within the etched resistor pattern. Common defects of this type include in-line constrictions referred to as notches, unremoved resistor material bridges between adjacent pattern lines, and embedded non-conductive particles in the resistor material. Such defects are prone to fracture due to thermomechanical fatigue during powered operation, especially power cycling, resulting in positive resistance change and open circuit failure modes. Common screening methods of optical microscopy, short time overload power tests (e.g., 6.25x rated power for 5 seconds) and burn-in (e.g., 1.5x rated power for 100 hours) are useful, but they are not always effective at removing devices with such defects. An improved method has been developed to screen for localized resistor pattern defects. The method involves the application of brief, high power electrical pulses at a low duty cycle while inspecting the resistor with a high resolution, high speed infrared camera. The following test conditions were found to be suitable for this purpose: 6.25x rated power, 1 to 5 pulses, 50 ms pulse width and 10% duty cycle. During the power pulsing, localized constrictions in the resistor pattern are identifiable as hot spots via the infrared camera. Reject criteria can be established based on observations of hot spots. To assess its effectiveness, a total of two hundred eighty (280) surface mount foil resistors (40 each from 7 different lots) were screened using this infrared technique. The screening identified twenty-nine (29) resistors with significant hot spots in the resistor pattern. All 280 resistors were then subjected to an industry standard 10,000 hour life test at 1x rated power at 70C with power cycled for 90 minutes on and 30 minutes off. During life testing, three resistors exhibited positive resistance change failure mode. All three failures were due to thermomechanical fatigue failure of localized bridge defects at the locations identified via infrared screening. The results of this evaluation illustrate the benefits of the pulsed-power infrared detection screening technique to identify reliability suspect foil or thin film resistors that may escape common screening methods.
    Keywords: Electronics and Electrical Engineering
    Type: GSFC-E-DAA-TN58702 , Space Passive Component Days (SPCD 2018); Oct 09, 2018 - Oct 12, 2018; Noordwijk; Netherlands
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  • 45
    Publication Date: 2019-07-13
    Description: No abstract available
    Keywords: Electronics and Electrical Engineering
    Type: M18-6776 , Annual NASA Electronics Parts and Packaging (NEPP) Electronics Technology Workshop (ETW); Jun 18, 2018 - Jun 21, 2018; Greenbelt, MD; United States
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  • 46
    facet.materialart.
    Unknown
    In:  CASI
    Publication Date: 2019-07-13
    Description: This presentation will include information about Graphics Processing Unit (GPU) technology, NASA Electronic Parts and Packaging (NEPP) tasks and their purpose, collaborations, a roadmap, NEPP partners, results to date, and future plans.
    Keywords: Electronics and Electrical Engineering
    Type: GSFC-E-DAA-TN57824 , 2018 NEPP Electronics Technology Workshop (ETW); Jun 18, 2018 - Jun 21, 2018; Greenbelt, MD; United States
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  • 47
    facet.materialart.
    Unknown
    In:  CASI
    Publication Date: 2019-07-13
    Description: This presentation will include information about Double Data Rate (DDR) technology, NASA Electronic Parts and Packaging (NEPP) tasks and their purpose, collaborations, a roadmap, NEPP partners, results to date, and future plans.
    Keywords: Electronics and Electrical Engineering
    Type: GSFC-E-DAA-TN57825 , 2018 NEPP Electronics Technology Workshop (ETW); Jun 18, 2018 - Jun 21, 2018; Greenbelt, MD; United States
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  • 48
    Publication Date: 2019-07-13
    Description: Agenda: Marshall EMI (Electromagnetic Interference) Test Facility (METF) Overview; Brushed DC Motor Overview; Literature Review; System Level Radiated Emissions; Component Radiated Emissions; Additional Data with COTS Hardware; Conclusion.
    Keywords: Electronics and Electrical Engineering
    Type: M18-6651 , Annual DoD Electromagnetic Environmental Effects (E3) Program Review / Department of Defense; May 07, 2018 - May 11, 2018; Huntsville, AL; United States
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  • 49
    Publication Date: 2019-07-13
    Description: Focus: Marshall seeks to support the Agency in the development of next generation printed electronics technologies for living and working in space, with emphasis on enhanced electronics manufacturing processes and capabilities development on the ground and in-space. Near-Term: Human Habitation Elements and Life Support Systems - pursuing integrated flexible wearable air, water, vital monitoring solutions for next generation printed technologies; Complete startup printing technology demonstrations which prove basic processes and establish ISM (In-Space Manufacturing) infrastructure needed for future applications including metals based manufacturing. Medium Term: Target low-cost research and demonstration activities that support multi-material additive manufacturing, more sophisticated parts production, printed electronics and ISM; Maturation and flight demonstration of printed propulsion system components, with emphasis on infusion into small-spacecraft-based missions. Long-Term: Evolve systems capabilities to be supportive of destination (lunar or Mars) resources and requirements, increase autonomy in systems and utilize in-situ resources towards manufacturing; Support development of self-replicable systems and their infusion into future spacecraft and missions.
    Keywords: Electronics and Electrical Engineering
    Type: M18-6626 , Presentation to Louisiana State University; Apr 05, 2018; Baton Rouge, LA; United States
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  • 50
    Publication Date: 2019-07-13
    Description: This presentation includes NASA Electronic Parts and Packaging (NEPP) Program FY18 overview, key efforts, concerns, and current status.
    Keywords: Electronics and Electrical Engineering
    Type: GSFC-E-DAA-TN66204 , GSFC-E-DAA-TN57799 , 2018 NEPP Electronics Technology Workshop (ETW); Jun 18, 2018 - Jun 21, 2018; Greenbelt, MD; United States
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  • 51
    Publication Date: 2019-07-13
    Description: We have developed a new microshutter array (MSA) subassembly. The MSA and a silicon substrate are flip-bonded together. The MSA has a new back side fabrication process to actuate the microshutters electrostatically, and the new silicon substrate has light shields. The microshutters with a pixel size of 100 x 200 sq micrometers are fabricated on silicon with thin silicon nitride membranes. The microshutters rotate 90 deg on torsion bars. The selected microshutters are actuated, held, and addressed electrostatically by applying voltages on the electrodes the front and back sides of the microshutters. The substrate has the light shield to block lights around the microshutters. Also, electrical connections are made from the MSA to a controller board via the substrate.
    Keywords: Electronics and Electrical Engineering
    Type: GSFC-E-DAA-TN54479 , Hilton Head Workshop 2018: A Solid-State Sensors, Actuators and Microsystems Workshop; Jun 03, 2018 - Jun 07, 2018; Hilton Head Island, SC; United States
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  • 52
    Publication Date: 2019-07-13
    Description: New design features and test methods are in development at NASA to take advantage of the newest high power and energy dense commercial Li-ion cell designs and to achieve passively thermal runaway (TR) propagation resistant (PPR) designs for manned missions requiring high power/voltage. The goal is to minimize the parasitic mass and volume of the battery components; thus reaching a balance between high battery specific power (W/kg) and energy (Wh/kg) as well as power (W/L) and energy density (Wh/L). Current 18650 cell designs achieve greater than 275 Wh/kg, greater than 725 Wh/L, but present high risks of side wall breaching during TR which can defeat many other safety features resulting in nearly immediate TR propagation. This work seeks to better understand the phenomena of cell side wall breaches and to determine the effectiveness of promising battery design features for achieving safe, high performing battery designs for high voltage/power applications.
    Keywords: Electronics and Electrical Engineering
    Type: JSC-E-DAA-TN56375 , Power Sources Conference; Jun 11, 2018 - Jun 14, 2018; Denver, CO; United States
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  • 53
    Publication Date: 2019-07-13
    Description: Overview of relevant radiation effects for Deep Space Gateway science payloads as well as examples of system-level mitigation strategies.
    Keywords: Electronics and Electrical Engineering
    Type: GSFC-E-DAA-TN65856 , GSFC-E-DAA-TN53197 , Deep Space Gateway Concept - Science Workshop; Feb 27, 2018 - Mar 01, 2018; Denver, CO; United States
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  • 54
    Publication Date: 2019-07-13
    Description: SiC power MOSFETs are space-ready in terms of typical reliability measures. However, single event burnout (SEB) often occurs at voltages 50% or lower than specified breakdown. Data illustrating burnout for 1200 V devices is reviewed and the space reliability of SiC MOSFETs is discussed.
    Keywords: Electronics and Electrical Engineering
    Type: GSFC-E-DAA-TN65899 , GSFC-E-DAA-TN54861 , 2018 HEART Hardened Electronics and Radiation Technology; Apr 16, 2018 - Apr 20, 2018; Tucson, AZ; United States
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  • 55
    Publication Date: 2019-08-24
    Description: An axial flux brushless permanent magnet electrical machine having a stator and at least one rotor. The rotor includes a Halbach array of magnets with at least four magnets per magnetic cycle. The rotor magnets are contained within pockets in the rotor. The pockets are formed with magnet pocket walls being radial walls, active surface walls, and/or inactive surface walls where the walls retain the magnets within the pockets.
    Keywords: Electronics and Electrical Engineering
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  • 56
    Publication Date: 2019-08-24
    Description: A method and apparatus for determining a presence, color and/or brightness of a plurality of components in a printed circuit board, where the components are biased either with constant current or with a current pulse.
    Keywords: Electronics and Electrical Engineering
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  • 57
    Publication Date: 2019-08-24
    Description: A process of fabrication and the resulting integrated circuit device is made of patterned metal electrical interconnections between semiconductor devices residing on and forming extremely harsh environment integrated circuit chips. The process enables more complicated wide band gap semiconductor integrated circuits with more than one level of interconnect to function for prolonged time periods (over 1000 hours) at much higher temperatures (500 C).
    Keywords: Electronics and Electrical Engineering
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  • 58
    Publication Date: 2019-08-13
    Description: No abstract available
    Keywords: Electronics and Electrical Engineering
    Type: GSFC-E-DAA-TN56141 , Trilateral Safety and Mission Assurance Conference (TRISMAC); Jun 04, 2018 - Jun 06, 2018; Kennedy Space Center; United States
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  • 59
    Publication Date: 2019-08-13
    Description: Heavy-ion test data for 3D NAND flash memories is presented, along with a discussion of modern testing challenges and near-term plans for a broad survey of currently-available product lines.
    Keywords: Electronics and Electrical Engineering
    Type: GSFC-E-DAA-TN66182 , GSFC-E-DAA-TN56695 , 2018 Single Event Effects (SEE) Symposium; May 21, 2018 - May 24, 2018; San Diego, CA; United States|Military and Aerospace Programmable Logic Devices (MAPLD) Workshop; May 21, 2018 - May 24, 2018; San Diego, CA; United States
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  • 60
    Publication Date: 2019-08-13
    Description: A standardized test method has been created to characterize and stress graphics processing units (GPU) during radiation effects testing.
    Keywords: Electronics and Electrical Engineering
    Type: GSFC-E-DAA-TN66178 , GSFC-E-DAA-TN56645 , Military and Aerospace Programmable Logic Devices (MAPLD) Workshop; May 21, 2018 - May 24, 2018; San Diego, CA; United States|2018 Single Event Effects (SEE) Symposium; May 21, 2018 - May 24, 2018; San Diego, CA; United States
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  • 61
    Publication Date: 2019-08-13
    Description: We present updates to the conventional methodology of triple modular redundancy (TMR) insertion as it pertains to clock domain crossings (CDCs). Three types of TMR schemes and their suggested corresponding CDC revisions are discussed.
    Keywords: Electronics and Electrical Engineering
    Type: GSFC-E-DAA-TN65900 , GSFC-E-DAA-TN54872 , 2018 HEART Hardened Electronics and Radiation Technology; Apr 16, 2018 - Apr 20, 2018; Tucson, AZ; United States
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  • 62
    Publication Date: 2019-08-13
    Description: The aerospace and semiconductor industries lost approx. 2000 hours annually of research access when IUCF closed. An ad hoc team between the U.S. government and industry was formed to evaluate other facility options. In this presentation, we will discuss: 1) Why aerospace, semiconductor manufacturers, and others are interested in proton facility access, as well as, 2) Some of the basics of a typical test for electronics, and 3) We"ll conclude with the brief current status on progress.
    Keywords: Electronics and Electrical Engineering
    Type: GSFC-E-DAA-TN53079 , GSFC-E-DAA-TN65837 , National Association for Proton Therapy (NAPT) 2018 National Proton Conference; Mar 25, 2018 - Mar 28, 2018; Scottsdale, AZ; United States
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  • 63
    Publication Date: 2019-08-13
    Description: Reverse Ta capacitors are not expected to last for any length of time much less the over 74000 hours that they have been flying on Express (i.e. ExPRESS (Expedite the Processing of Experiments to the Space Station) Logistics Carrier (ELC) on the International Space Station. The report looks at the effects of moisture and temperature have on the capacitors. The removal of moisture has a far greater role in the survival of the capacitors than one would expect. Over 10000 hours of testing will be reviewed.
    Keywords: Electronics and Electrical Engineering
    Type: GSFC-E-DAA-TN61429 , Spacecraft Anomalies and Failure Workshop (SCAF 2018); Dec 11, 2018 - Dec 12, 2018; Chantilly, VA; United States
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  • 64
    Publication Date: 2019-08-26
    Description: A solid state device chip including diodes (generating a higher frequency output through frequency multiplication of the input frequency) and a novel on-chip power combining design. Together with the on-chip power combining, the chip has increased efficiency because the diodes' anodes, being micro-fabricated simultaneously on the same patch of a GaAs wafer under identical conditions, are very well balanced. The diodes' GaAs heterostructure and the overall chip geometry are designed to be optimized for high power operation. As a result of all these features, the device can generate record-setting power having a signal frequency in the F-band and W-band (30% conversion efficiency).
    Keywords: Electronics and Electrical Engineering
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  • 65
    Publication Date: 2019-08-26
    Description: Systems and methods in accordance with embodiments of the invention implement tailored metallic glass-based strain wave gears and strain wave gear components. In one embodiment, a method of fabricating a flexspline of a strain wave gear includes: forming a MG-based composition into a flexspline using one of a thermoplastic forming technique and a casting technique; where the forming of the MG-based composition results in a formed MG-based material; where the formed flexspline is characterized by: a minimum thickness of greater than approximately 1 mm and a major diameter of less than approximately 4 inches.
    Keywords: Electronics and Electrical Engineering
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  • 66
    Publication Date: 2019-08-26
    Description: The present invention provides an electronic apparatus, such as a lighting device comprised of light emitting diodes (LEDs) or a power generating apparatus comprising photovoltaic diodes, which may be created through a printing process, using a semiconductor or other substrate particle ink or suspension and using a lens particle ink or suspension. An exemplary apparatus comprises a base; at least one first conductor; a plurality of diodes coupled to the at least one first conductor; at least one second conductor coupled to the plurality of diodes; and a plurality of lenses suspended in a polymer deposited or attached over the diodes. The lenses and the suspending polymer have different indices of refraction. In some embodiments, the lenses and diodes are substantially spherical, and have a ratio of mean diameters or lengths between about 10:1 and 2:1. The diodes may be LEDs or photovoltaic diodes, and in some embodiments, have a junction formed at least partially as a hemispherical shell or cap.
    Keywords: Electronics and Electrical Engineering
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  • 67
    Publication Date: 2019-08-26
    Description: Metal hydride-air batteries and methods for their use are provided. An exemplary metal-hydride air battery includes an alkaline exchange membrane provided between the positive electrode and the negative electrode of the battery. The alkaline exchange membrane provides for transfer of hydroxide ions through the membrane. Optionally the alkaline exchange membrane limits transport of other species through the membrane.
    Keywords: Electronics and Electrical Engineering
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  • 68
    Publication Date: 2019-08-28
    Description: A via-less crossover for use in broadband microwave/mm-wave circuitry, including: a dielectric substrate; a top layer disposed on one side of the substrate and including a microstrip line with an input and an output, two tapered sections placed around the microstrip line along a co-planar waveguide (CPW) central line, one microstrip portion having an input and which connects to one top layer, rectangular stub disposed adjacent to one of the tapered sections, and another microstrip portion having an output and which connects to another top layer, rectangular stub disposed adjacent to the other of the tapered sections; and a ground layer disposed on an opposite side of the substrate and including a bottom layer CPW central line situated in a central cutout and which connects between a bottom layer, rectangular stub on one side and a bottom layer, rectangular stub on the other side situated in ground cutouts, respectively.
    Keywords: Electronics and Electrical Engineering
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  • 69
    Publication Date: 2019-08-28
    Description: A diode pumped, solid state laser is provided that can produce over 16 billion, 15 mJ, 10 ns Q-Switched laser pulses with a low measured decay rate. The laser can be integrated into a global biomass measuring instrument, and mounted on the International Space Station (ISS).
    Keywords: Electronics and Electrical Engineering
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  • 70
    Publication Date: 2019-08-28
    Description: A system and sensor provides for radio frequency identification (RFID)-enabled information collection. The system includes a ring-shaped element and an antenna. The ring-shaped element includes a conductive ring and an RFID integrated circuit. The antenna is spaced apart from the ring-shaped element and defines an electrically-conductive path commensurate in size and shape to at least a portion of the conductive ring. In an alternate embodiment, the sensor system further comprises a reference ring-shaped element in a fixed relationship with respect to the antenna, with the reference ring-shaped element defining another series circuit to include an electrically-conductive reference ring and a reference RFID integrated circuit. The system may include an interrogator for energizing the ring-shaped element and receiving a data transmission from the RFID integrated circuit that has been energized for further processing by a processor.
    Keywords: Electronics and Electrical Engineering
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  • 71
    facet.materialart.
    Unknown
    In:  CASI
    Publication Date: 2019-08-28
    Description: A Gated CDS Integrator (GCI) may amplify low-level signals without introducing excessive offset and noise. The GCI may also amplify the low level signals with accurate and variable gain. The GCI may include a modulator preceding a linear amplifier such that offset or noise present in a signal path between the modulator and a demodulator input is translated to a higher out of band frequency.
    Keywords: Electronics and Electrical Engineering
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  • 72
    Publication Date: 2019-08-28
    Description: An optimized wavelength-tuned nonlinear frequency conversion process using a liquid crystal clad waveguide. The process includes implanting ions on a top surface of a lithium niobate crystal to form an ion implanted lithium niobate layer. The process also includes utilizing a tunable refractive index of a liquid crystal to rapidly change an effective index of the lithium niobate crystal.
    Keywords: Electronics and Electrical Engineering
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  • 73
    Publication Date: 2019-08-28
    Description: A metal oxide vertical graphene hybrid supercapacitor is provided. The supercapacitor includes a pair of collectors facing each other, and vertical graphene electrode material grown directly on each of the pair of collectors without catalyst or binders. A separator may separate the vertical graphene electrode materials.
    Keywords: Electronics and Electrical Engineering
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  • 74
    facet.materialart.
    Unknown
    In:  CASI
    Publication Date: 2019-08-28
    Description: An ink of the formula: 60-80% by weight BaTiO3 particles coated with SiO2; 5-50% by weight high dielectric constant glass; 0.1-5% by weight surfactant; 5-25% by weight solvent; and 5-25% weight organic vehicle. Also a method of manufacturing a capacitor comprising the steps of: heating particles of BaTiO3 for a special heating cycle, under a mixture of 70-96% by volume N2 and 4-30% by volume H2 gas; depositing a film of SiO2 over the particles; mechanically separating the particles; incorporating them into the above described ink formulation; depositing the ink on a substrate; and heating at 850-900 C for less than 5 minutes and allowing the ink and substrate to cool to ambient in N2 atmosphere. Also a dielectric made by: heating particles of BaTiO3 for a special heating cycle, under a mixture of 70-96% by volume N2 and 4-30% by volume H2 gas; depositing a film of SiO2 over the particles; mechanically separating the particles; forming them into a layer; and heating at 850-900 C for less than 5 minutes and allowing the layer to cool to ambient in N2 atmosphere.
    Keywords: Electronics and Electrical Engineering
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  • 75
    facet.materialart.
    Unknown
    In:  CASI
    Publication Date: 2019-08-28
    Description: A Gated CDS Integrator (GCI) may amplify low-level signals without introducing excessive offset and noise. The GCI may also amplify the low level signals with accurate and variable gain. The GCI may include a modulator preceding an amplifier such that offset or noise present in a signal path between the modulator and a demodulator input is translated to a higher out of band frequency, and thereafter reduced by a double sampled discrete time integrator which also reduces thermal noise. The thermal noise may also be reduced by averaging the output of the discrete time integrator.
    Keywords: Electronics and Electrical Engineering
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  • 76
    Publication Date: 2019-08-28
    Description: A method of crimping wires includes positioning a wire/terminal combination between first and second crimp forming tools. A force is applied to the crimp forming tools to deform the wire/terminal combination. The method further includes measuring ultrasonic energy that is transmitted across the wire/terminal combination as the terminal is being deformed. A rate of change of the magnitude of the ultrasonic energy is also determined as the terminal is being deformed. The crimping process is terminated if the rate of change of the magnitude of the ultrasonic energy falls below a predefined threshold level. Data gathered during the crimping process can also be utilized to determine if a faulty crimp has occurred.
    Keywords: Electronics and Electrical Engineering
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  • 77
    Publication Date: 2019-08-28
    Description: A current source logic gate with depletion mode field effect transistor ("FET") transistors and resistors may include a current source, a current steering switch input stage, and a resistor divider level shifting output stage. The current source may include a transistor and a current source resistor. The current steering switch input stage may include a transistor to steer current to set an output stage bias point depending on an input logic signal state. The resistor divider level shifting output stage may include a first resistor and a second resistor to set the output stage point and produce valid output logic signal states. The transistor of the current steering switch input stage may function as a switch to provide at least two operating points.
    Keywords: Electronics and Electrical Engineering
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  • 78
    Publication Date: 2019-08-28
    Description: A nanostructure device is provided and performs dual functions as a nano-switching/sensing device. The nanostructure device includes a doped semiconducting substrate, an insulating layer disposed on the doped semiconducting substrate, an electrode formed on the insulating layer, and at least one polymer nanofiber deposited on the electrode. The at least one polymer nanofiber provides an electrical connection between the electrode and the substrate and is the electroactive element in the device.
    Keywords: Electronics and Electrical Engineering
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  • 79
    Publication Date: 2019-08-28
    Description: The disclosed subject matter relates to a reaction wheel system for controlling and stabilizing a satellite or other spacecraft. The reaction wheel system includes a reaction wheel rotor and a containment structure stator including a plurality of contactor assemblies for securing the reaction wheel rotor when not in rotation and for electromagnetically inducing substantially frictionless rotation of the reaction wheel rotor.
    Keywords: Electronics and Electrical Engineering
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  • 80
    Publication Date: 2019-08-28
    Description: Aspects of the present disclosure involve a system and method for generating noise waves at millimeter wave frequencies. A noise source generator is designed to be connected to a crystalline structure for efficient heat transfer and compatibility with millimeter wave receivers. The use of crystalline structure coupled to the noise source generator allows heat from a biasing device, such as a diode, to be carried away such that the diode is able to generate noise waves while being reversed biased without compromising the device. In another embodiment, the noise source generator includes the use of a backshort transmission line with vias that is connected to the biasing device for heat transfer from the biasing device to the backshort.
    Keywords: Electronics and Electrical Engineering
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  • 81
    Publication Date: 2019-08-28
    Description: One or more embodiments of the present invention describe an apparatus and method to combine unequal powers. The apparatus includes a first input port, a second input port, and a combiner. The first input port is operably connected to a first power amplifier and is configured to receive a first power from the first power amplifier. The second input port is operably connected to a second power amplifier and is configured to receive a second power from the second power amplifier. The combiner is configured to simultaneously receive the first power from the first input port and the second power from the second input port. The combiner is also configured to combine the first power and second power to produce a maximized power. The first power and second power are unequal.
    Keywords: Electronics and Electrical Engineering
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  • 82
    Publication Date: 2019-08-28
    Description: Disclosed are systems, methods, and non-transitory computer-readable storage media for fabrication of silicon on insulator (SOI) wafers with a superconductive via for electrical connection to a groundplane. Fabrication of the SOI wafer with a superconductive via can involve depositing a superconducting groundplane onto a substrate with the superconducting groundplane having an oxidizing layer and a non-oxidizing layer. A layer of monocrystalline silicon can be bonded to the superconducting groundplane and a photoresist layer can be applied to the layer of monocrystalline silicon and the SOI wafer can be etched with the oxygen rich etching plasma, resulting in a monocrystalline silicon top layer with a via that exposes the superconducting groundplane. Then, the fabrication can involve depositing a superconducting surface layer to cover the via.
    Keywords: Electronics and Electrical Engineering
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  • 83
    Publication Date: 2019-10-08
    Description: The purpose of this testing was to obtain total ionizing dose (TID) information about custom-built research prototype silicon carbide (SiC) junction field effect transistor (JFET) integrated circuits (ICs) capable of prolonged operation in extremely high-temperature (500 degrees Centigrade) environments. The circuits included ring oscillators and operational amplifiers as well as individual n-channel JFETs. This technology is being considered for use in high temperature, high pressure applications such as Long-Lives Surface System Explorer (LLISSE). These devices were developed at NASA Glenn Research Center (GRC). Testing occurred from July 9th-July 13th, 2018.
    Keywords: Electronics and Electrical Engineering
    Type: GSFC-E-DAA-TN69538
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  • 84
    Publication Date: 2019-08-27
    Description: An apparatus for measuring a distance between a first and second terminal includes a frame counter for determining a number of data frames traversing a distance between the first terminal 105 and the second terminal, a frame bit counter for determining a number of data clock bits offset between a transmitted data frame and a concurrently received data frame, a data clock phase detector for determining a phase difference between an RF data clock for the transmitted data frame and an RF data clock for the concurrently received data frame, and an optical carrier phase detector for determining a phase difference between an optical carrier used to transmit the transmitted data frame and an optical carrier for the concurrently received data frame. The distance between the first and second terminal is determined from a round trip transit time T between the first and second terminals.
    Keywords: Electronics and Electrical Engineering
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  • 85
    Publication Date: 2019-08-27
    Description: Systems and methods for forming conductive materials. The conductive materials can be applied using a printer in single or multiple passes onto a substrate. The conductive materials are composed of electrical conductors such as carbon nanotubes (including functionalized carbon nanotubes and metal-coated carbon nanotubes), grapheme, a polycyclic aromatic hydrocarbon (e.g. pentacene and bisperipentacene), metal nanoparticles, an inherently conductive polymer (ICP), and combinations thereof. Once the conductive materials are applied, the materials are dried and sintered to form adherent conductive materials on the substrate. The adherent conductive materials can be used in applications such as damage detection, particle removal, and smart coating systems.
    Keywords: Electronics and Electrical Engineering
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  • 86
    Publication Date: 2019-08-27
    Description: A radio frequency identification (RFID) system includes an RFID interrogator and an RFID tag having a plurality of information sources and a beamforming network. The tag receives electromagnetic radiation from the interrogator. The beamforming network directs the received electromagnetic radiation to a subset of the plurality of information sources. The RFID tag transmits a response to the received electromagnetic radiation, based on the subset of the plurality of information sources to which the received electromagnetic radiation was directed. Method and other embodiments are also disclosed.
    Keywords: Electronics and Electrical Engineering
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  • 87
    Publication Date: 2019-08-27
    Description: A lithium ion battery cell includes a housing, a cathode disposed within the housing, wherein the cathode comprises a cathode active material, an anode disposed within the housing, wherein the anode comprises an anode active material, and an electrolyte disposed within the housing and in contact with the cathode and anode. The electrolyte consists essentially of a solvent mixture, a lithium salt in a concentration ranging from approximately 1.0 molar (M) to approximately 1.6 M, and an additive mixture. The solvent mixture includes a cyclic carbonate, an non-cyclic carbonate, and a linear ester. The additive mixture consists essentially of lithium difluoro(oxalato)borate (LiDFOB) in an amount ranging from approximately 0.5 weight percent to approximately 2.0 weight percent based on the weight of the electrolyte, and vinylene carbonate (VC) in an amount ranging from approximately 0.5 weight percent to approximately 2.0 weight percent based on the weight of the electrolyte.
    Keywords: Electronics and Electrical Engineering
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  • 88
    Publication Date: 2019-08-27
    Description: A magnetostrictive alternator configured to convert pressure waves into electrical energy is provided. It should be appreciated that the magnetostrictive alternator may be combined in some embodiments with a Stirling engine to produce electrical power. The Stirling engine creates the oscillating pressure wave and the magnetostrictive alternator converts the pressure wave into electricity. In some embodiments, the magnetostrictive alternator may include aerogel material and magnetostrictive material. The aerogel material may be configured to convert a higher amplitude pressure wave into a lower amplitude pressure wave. The magnetostrictive material may be configured to generate an oscillating magnetic field when the magnetostrictive material is compressed by the lower amplitude pressure wave.
    Keywords: Electronics and Electrical Engineering
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  • 89
    Publication Date: 2019-07-19
    Description: Field Programmable Gate Arrays (FPGAs) integrated circuits (IC) are one of the key electronic components in today's sophisticated launch and space vehicle complex avionic systems, largely due to their superb reprogrammable and reconfigurable capabilities combined with relatively low non-recurring engineering costs (NRE) and short design cycle. Consequently, FPGAs are prevalent ICs in communication protocols and control signal commands. This paper will demonstrate guidelines to estimate FPGA failure rates for ascent and in space operations. The guidelines will account for hardware and radiation-induced failures, as well as Bayesian updates to failure rates. The hardware contribution of the approach accounts for physical failures of the FPGA IC. The radiation portion will expand on FPGA susceptibility to different space radiation environments.
    Keywords: Electronics and Electrical Engineering
    Type: M17-6139 , IEEE Aerospace Conference; Mar 03, 2018 - Mar 10, 2018; Big Sky, MT; United States
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  • 90
    Publication Date: 2019-07-12
    Description: Graphics Processing Units (GPU) have emerged as a proven technology that enables high performance computing and parallel processing in a small form factor. GPUs enhance the traditional computer paradigm by permitting acceleration of complex mathematics and providing the capability to perform weighted calculations, such as those in artificial intelligence systems. Despite the performance enhancements provided by this type of microprocessor, there exist tradeoffs in regards to reliability and radiation susceptibility, which may impact mission success. This report provides an insight into GPU architecture and its potential applications in space and other similar markets. It also discusses reliability, qualification, and radiation considerations for testing GPUs.
    Keywords: Electronics and Electrical Engineering
    Type: NEPP-BOK-2018 , 2018-561-NEPP , GSFC-E-DAA-TN60884
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  • 91
    facet.materialart.
    Unknown
    In:  CASI
    Publication Date: 2019-07-12
    Description: Single-Event Effects (SEE) testing was conducted on the nVidia GTX 1050 Graphics Processor Unit (GPU); herein referred to as device under test (DUT). Testing was conducted at Massachusetts General Hospital's (MGH) Francis H. Burr Proton Therapy Center on April 28th, 2018 using 200-MeV protons. This testing trip was purposed to provide additional radiation susceptibility data from payloads compiled in Q3FY18. While not all radiation-induced errors are critical, the effects on the application need to be considered. More so, failure of the device and an inability to reset itself should be considered detrimental to the application. Radiation effects on electronic components are a significant reliability issue for systems intended for space.
    Keywords: Electronics and Electrical Engineering
    Type: 2018-561-NEPP , GSFC-E-DAA-TN58471
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  • 92
    Publication Date: 2019-07-12
    Description: Copper wire bond technology developments continue to be a subject of technical interest to the NASA (National Aeronautics and Space Administration) NEPP (NASA Electronic Parts and Packaging Program) which funded this update. Based on this new research, additional copper bond wire vulnerabilities were found in the literature - Crevice corrosion, intrinsic degradation of palladium coated copper wire, congregation of palladium near ball bond interface leading to failure, residual aluminum pad metallization impact on device lifetimes, stitch cracking phenomena, package delamination's that have resulted in wire bond failures and device failure due to elemental sulfur. A search of the U.S.A. patent web site found 3 noteworthy patents on the following developments: claim of a certain IMC (Intermetallic Compound) thickness as a mitigation solution to chlorine corrosion; claim of using materials with different pHs to neutralize contaminants in a package containing copper wire bonds; and a discussion on ball shear test threshold values for different applications. In addition, an aerospace contractor of military hardware had a presentation on copper bond wires where it was reported that there was a parametric shift and noise susceptibility of devices with copper bond wires which affected legacy design performance. A review of silver bond wire (another emerging technology) technical papers found that an electromigration failure mechanism was evident in device applications that operate under high current conditions. More studies may need to be performed on a comprehensive basis. Research areas for consideration are suggested, however, these research and or qualification/standard test areas are not all inclusive and should not be construed as the element (s) that delivers any potential copper wire bond solution. A false sense of security may occur, whenever there is a reliance on passing any particular qualification, standard, or test protocol.
    Keywords: Electronics and Electrical Engineering
    Type: GSFC-E-DAA-TN60639
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  • 93
    Publication Date: 2019-07-12
    Description: Climate concerns have instigated serious research for weight-critical batteries to enable what are termed EVs, electric vehicles, initially for ground transportation. This research has advanced to the point where, at the system level, parity with combustion engines, via vehicle weight and drag reductions to reduce battery requirements, along with continued battery research, can conceivably be achieved in less than 10 years.. Concomitantly, renewable electric generation, which would enable essentially emission-less transportation, has via cost reductions, efficiency improvements and storage research advanced to the point of producing 25% of current electrical generation and 62% of new generation capability with continued rapid cost reductions and consequent rapid further adoption projected. The present report examines the resultant electric aircraft possibilities and opportunities including technologies to reduce requisite battery size and weight via airframe performance improvements, the benefits of electric propulsion and the enablement of a massive new aeronautics market for affordable, safe personal air vehicles that operate off of local streets.
    Keywords: Electronics and Electrical Engineering
    Type: NASA/TM-2018-220088 , L-20935 , NF1676L-30493
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  • 94
    Publication Date: 2019-07-12
    Description: The planetary science community is interested in targets far from the Sun. Solar arrays are relatively low-cost, readily available, highly reliable. However, high-AU environments are challenging for solar arrays e.g. Jupiter: high radiation and 3-4% of one sun Saturn: milder radiation but only 1% of one sun. Currently, solar arrays for low irradiance low temperature (LILT) are typically large and massive, e.g. ~600kg for planned Europa Clipper. There is a need for cells optimized for Jupiter and/or Saturn.
    Keywords: Electronics and Electrical Engineering
    Type: JPL-CL-18-2920
    Format: text
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  • 95
    Publication Date: 2019-07-12
    Description: This report presents the parametric characterization results of four GaN field-effect transistor (FET) devices from three manufacturers, one of which is a cascode device, and compares those results to a Si power metal-oxide-semiconductor fieldeffect transistor (MOSFET) and a SiC power MOSFET. The devices were first characterized at ambient temperature, then at cryogenic temperatures down to -196 C (LN2 temperature), and finally at ambient temperature again in the event that the device parameters were permanently affected by the cryogenic temperatures. In general, the results indicate that the GaN devices show significant improvement overall at cryogenic temperatures in the parameters characterized, such as onresistance and leakage currents, compared to the Si and SiC devices. The results show that the SiC device tested should not be used at cryogenic temperatures due to the significant increase in on-resistance. The results also show that the GaN and Si parameters characterized were either not affected by the cryogenic temperatures or changed by no more than +/-20 percent post LN2 submersion. The device that exhibited the most parametric change post LN2 submersion was the SiC power MOSFET in its leakage currents.
    Keywords: Electronics and Electrical Engineering
    Type: NASA/TP-2018-219973 , E-19579 , GRC-E-DAA-TN57157
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  • 96
    Publication Date: 2019-07-12
    Description: A battery charger system includes a power supply and a switch connected to the power supply wherein the switch has a first switch half and a second switch half. First and second batteries are selectively connected to the power supply via the switch. The first and second switch halves are moved between a plurality of operational positions to fully charge the first battery, discharge the first battery into the second battery, discharge the second battery into the first battery, and fully charge the second battery.
    Keywords: Electronics and Electrical Engineering
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  • 97
    Publication Date: 2019-08-26
    Description: Photon absorption, and thus current generation, is hindered in conventional thin-film solar cell designs, including quantum well structures, by the limited path length of incident light passing vertically through the device. Optical scattering into lateral waveguide structures provides a physical mechanism to increase photocurrent generation through in-plane light trapping. However, the insertion of wells of high refractive index material with lower energy gap into the device structure often results in lower voltage operation, and hence lower photovoltaic power conversion efficiency. The voltage output of an InGaAs quantum well waveguide photovoltaic device can be increased by employing a III-V material structure with an extended wide band gap emitter heterojunction. Analysis of the light IV characteristics reveals that non-radiative recombination components of the underlying dark diode current have been reduced, exposing the limiting radiative recombination component and providing a pathway for realizing solar-electric conversion efficiency of 30% or more in single junction cells.
    Keywords: Electronics and Electrical Engineering
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  • 98
    Publication Date: 2019-08-26
    Description: Systems, methods, and devices of the various embodiments provide a field effect transistor (FET) that controls equilibrium by reversing the effects of leakage currents affecting the gate response of the FET by using an equilibrium pump electrode. The equilibrium reversing gate FETs (ergFETs) of the various embodiments, may include an equilibrium pump electrode located within a non-conducting gap. The ergFETs of the various embodiments may provide solid state ephemeral electric potential and electric field sensor systems and methods for measuring ephemeral electric potentials and electric fields.
    Keywords: Electronics and Electrical Engineering
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  • 99
    Publication Date: 2019-08-26
    Description: Systems and methods are provided for designing and fabricating contact-free support structures for overhang geometries of parts fabricated using electron beam additive manufacturing. One or more layers of un-melted metallic powder are disposed in an elongate gap between an upper horizontal surface of the support structure and a lower surface of the overhang geometry. The powder conducts heat from the overhang geometry to the support structure. The support structure acts as a heat sink to enhance heat transfer and reduce the temperature and severe thermal gradients due to poor thermal conductivity of metallic powders underneath the overhang. Because the support structure is minimally or not connected to the part, the support structure can be removed with minimal or no post-processing step.
    Keywords: Electronics and Electrical Engineering
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  • 100
    Publication Date: 2019-08-26
    Description: The invention relates to devices and methods of maintaining the current starved delay at a constant value across variations in voltage and temperature to increase the speed of operation of the sequential logic in the radiation hardened ASIC design.
    Keywords: Electronics and Electrical Engineering
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