ISSN:
1013-9826
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
This paper discusses ratchetting deformation of lead-free solder Sn/3Ag/0.5Cu andlead-containing solder alloy Sn/37Pb with several stress amplitudes and stress ratios of the maximumstress to the minimum stress. First the uniaxial ratchetting tests[removed info]are conducted with three maximumstresses and five stress ratios. The all tests are conducted using cylindrical bulk specimens of thesolder alloys at 313 K. The test results show that there is the difference in the viscoplastic deformationbehavior between two solder alloys. The relationship between ratchetting strain and time is estimatedby Biley-Norton law to explain that the uniaxial ratchetting deformation is strongly dominated by theviscous deformation. Finally, the ratchetting deformation is simulated by the dislocation basedconstitutive model proposed by Estrin [1]. The simulations show that there is a possibility to simulatethe uniaxial ratchetting by clarifying the dislocation mechanism of the solder alloys
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/01/54/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.345-346.97.pdf
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