ISSN:
0021-8995
Schlagwort(e):
Chemistry
;
Polymer and Materials Science
Quelle:
Wiley InterScience Backfile Collection 1832-2000
Thema:
Chemie und Pharmazie
,
Maschinenbau
,
Physik
Notizen:
An investigation into the wear process of five polymers tested under different contact conditions is presented. Polymer pin on metal plate and metal pin on polymer plate configurations were used. The metal pin on polymer plate configuration gave significantly lower wear rates compared to that observed for the polymer pin on metal plate configuration. The results are discussed in terms of morphology of wear debris generated.
Zusätzliches Material:
15 Ill.
Materialart:
Digitale Medien
URL:
http://dx.doi.org/10.1002/app.1992.070451116
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