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  • 1
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    Unknown
    Development of autoclavable addition type polyimides (1974)
    In:  CASI
    Details
    Publication Date: 2019-07-13
    Description: Two highly promising approaches to yield autoclavable addition-type polyimides were identified and evaluated in the program. Conditions were established for autoclave preparation of Hercules HMS graphite fiber reinforced composites in the temperature range of 473 K to 505 K under an applied pressure of 0.7 MN/m2 (100 psi) for time durations up to four hours. Upon oven postcure in air at 589 K, composite samples demonstrated high mechanical property retention at 561 K after isothermal aging in air for 1000 hours. Promise was shown for shorter term mechanical property retention at 589 K upon exposure in air at this temperature.
    Keywords: MATERIALS, NONMETALLIC
    Type: NASA-CR-121251 , TRW-21863-6013-RU-00
    Format: application/pdf
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    NASA TECHNICAL REPORTS
  • 2
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    Cryogenic/high temperature structural adhesives (1974)
    In:  CASI
    Details
    Publication Date: 2019-06-27
    Description: Results are described of the work performed to develop a structural adhesive system which possesses useful properties over a 20K (-423 F) to 589 K (600 F) temperature range. Adhesives systems based on polyimide, polyphenylquinoxaline polyquinoxaline, polybenzothiazole and polybenzimidazole polymers first were screened for suitability. Detailed evaluation of two polyimide adhesive sytems, Br34/FM34 and P4/A5F or P4A/A5FA, and one polyphenylquinoxaline adhesive system, PPQ II (IMW), then was performed. Property information was generated over the full temperature range for shear strength, stressed and unstressed thermal aging, thermal shock and coefficient of thermal expansion. Both polyimide adhesive systems were identified as being capable of providing structural adhesive joints for cryogenic/high temperature service.
    Keywords: MATERIALS, NONMETALLIC
    Type: NASA-CR-134465 , TRW-22898-6012-TU-00
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    NASA TECHNICAL REPORTS
  • 3
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    Feasibility study for the development of low temperature curing adhesives (1974)
    In:  CASI
    Details
    Publication Date: 2019-07-13
    Description: The feasibility of a new approach for the development of stable, easily handled, room temperature (293 K - 311 K) curing adhesives was studied and demonstrated. The work concentrated on a family of unsaturated amide/ester resins. Twelve candidate resins were synthesized and tested for completeness of cure at room temperature, adhesion to aluminum and titanium, shear strength, moisture resistance and heat stability. The three most promising candidate resins were selected and recommended for further development.
    Keywords: MATERIALS, NONMETALLIC
    Type: NASA-CR-132422 , TRW-22743-6009-RU-00
    Format: application/pdf
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    NASA TECHNICAL REPORTS
  • 4
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    Development of a low void polyimide resin for autoclave processing of glass and graphite reinforced composites. (1971)
    In:  Other Sources
    Details
    Publication Date: 2019-07-13
    Description: Experimental studies are described in which new A-type polyimide prepolymer chemical modifications were investigated with the aim of increasing the melt phase duration and temperature range permitting autoclave processing, yet retaining the addition-type cure mechanism required for low-void content composites. Several modification candidates were examined, and one specific formulation was selected for detailed investigation. This A-type polyimide prepolymer formulation is shown to possess the desired characteristics.
    Keywords: MATERIALS, NONMETALLIC
    Type: Space shuttle materials; Proceedings of the National Technical Conference; Oct 05, 1971 - Oct 07, 1971; Huntsville, AL
    Format: text
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    NASA TECHNICAL REPORTS
  • 5
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    Cryogenic/high temperature structural adhesives (1974)
    In:  Other Sources
    Details
    Publication Date: 2019-07-13
    Description: Studies were conducted to develop a structural adhesive system possessing useful properties over a 20 to 589 K temperature range. Adhesive systems based on polyimide, polyphenylquinoxaline, polyquinoxaline, polybenzothiazole and polybenzimidazole polymers first were screened for suitability. Detailed evaluation of two polyimide adhesive systems, BR34/FM34 and P4/A5F or P4A/A5FA, and one polyphenylquinoxaline adhesive system, PPQ (IMW), then was performed. Property information was generated over the full temperature range for shear strength, stressed and unstressed thermal aging, thermal shock, and coefficient of thermal expansion. Both polyimide adhesive systems were identified as being capable of providing structural adhesive joints for cryogenic/high temperature service.
    Keywords: MATERIALS, NONMETALLIC
    Type: National Symposium and Exhibition; Apr 23, 1974 - Apr 25, 1974; Buena Park, CA
    Format: text
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    NASA TECHNICAL REPORTS
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