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  • Chemistry  (5)
  • Erysiphe graminis f. sp. tritici resistance genes  (1)
  • 1990-1994  (6)
  • 1
    Electronic Resource
    Electronic Resource
    Springer
    Genetic resources and crop evolution 41 (1994), S. 151-158 
    ISSN: 1573-5109
    Keywords: Triticum aestivum ; Aegilops tauschii (syn. Ae. squarrosa) ; Erysiphe graminis f. sp. tritici resistance genes ; gene expression
    Source: Springer Online Journal Archives 1860-2000
    Topics: Agriculture, Forestry, Horticulture, Fishery, Domestic Science, Nutrition
    Notes: Summary A collection of 400 Ae. tauschii (syn. Ae. squarrosa) Coss. accessions were screened for powdery mildew resistance based on the response patterns of 13 wheat cultivars/lines possessing major resistance genes to nine differential mildew isolates. 106 accessions showed complete resistance to all isolates, and 174 accessions revealed isolate-specific resistance, among which were 40 accessions exhibiting an identical response pattern as wheat cultivar ‘Ulka/*8Cc’ which is known to possess resistance gene Pm2. Expression of both complete and isolate-specific resistance from Ae. tauschii was observed in some synthetic hexaploid wheats derived from four mildew susceptible T. durum Desf. parents, each crossed with five to 38 resistant diploid Ae. tauschii accessions. Synthetic amphiploids involving different combinations of T. durum and Ae. tauschii generally showed a decrease in resistance compared with that expressed by the Ae. tauschii parental lines.
    Type of Medium: Electronic Resource
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  • 2
    ISSN: 0003-3146
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Physics
    Notes: We show how narrow spectral holes burnt into the inhomogeneous absorption of dye doped polymers can be used as extremely sensitive detectors for measuring structural rearrangement processes. A model is suggested which relates the observed hole burning phenomena to the specific heat of the conformation phase space.
    Additional Material: 5 Ill.
    Type of Medium: Electronic Resource
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  • 3
    Electronic Resource
    Electronic Resource
    Weinheim : Wiley-Blackwell
    Acta Polymerica 41 (1990), S. 553-554 
    ISSN: 0323-7648
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Physics
    Additional Material: 2 Ill.
    Type of Medium: Electronic Resource
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  • 4
    Electronic Resource
    Electronic Resource
    Weinheim : Wiley-Blackwell
    Acta Polymerica 42 (1991), S. 51-52 
    ISSN: 0323-7648
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Physics
    Additional Material: 3 Ill.
    Type of Medium: Electronic Resource
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  • 5
    ISSN: 0323-7648
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Physics
    Description / Table of Contents: Two different hypotheses of the phenomenological process of etching of polymer films in a non isothermal oxygen plasma of a high frequency discharge are discussed: the successive etching on the surface and the formation of an etch-resistant surface layer with a shifting of the degradation processes in polymer bulk. This second model proposed by Valiev requires a complicated system of diffusion processes of plasma species and degradation products. Our findings are in contrast to those of Valiev, but it seems that the plasma modified surface layer plays a dominant role within the ablation process.
    Notes: Zwei unterschiedliche Vorstellungen zum Ablauf des Abtrags von Polymerschichten in einem nichtisothermen Sauerstoffplasma einer elektrischen Hochfrequenzentladung werden diskutiert: der successive Abbau an der Oberfläche und die plasmaphysikalische Verfestigung der Polymeroberfläche bei gleichzeitiger Verlagerung des Abbaus in des Polymervolumen. Das letztgenannte Modell von Valiev verlangt komplizierte Diffusionsprozesse von abbaufähigen Plasmaspezies und entsprechenden Abbauprodukten. Die hier durchgeführten Modellversuche sprechen in ihren Ergebnissen gegen das Modell von Valiey, wobei jedoch die plasmamodifizierte Polymeroberflächenschicht tatsächlich eine besondere Rolle beim Abbau der gesamten Polymerschicht spielt.
    Additional Material: 3 Ill.
    Type of Medium: Electronic Resource
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  • 6
    ISSN: 0323-7648
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Physics
    Description / Table of Contents: The investigation of the temperature dependence of polymer etching rates in an oxygen plasma was extented to some more polymers. The complex nature of the etching process becomes obvious, because the temperature dependences are often nonlinear. Characteristic changes in the slope of the curves correspond only in some cases with the glass temperature of the polymers. Therefore these points can also be connected with the formation and etching of adsorption layers. Activation energies of partial processes were determined. Based on the temperature dependence, only some general conclusions on the plasma etching mechanism could be derived.
    Notes: Die Untersuchung von Temperaturabhängigkeiten der Plasmaätzrate von Polymeren im Sauerstoffplasma wurde auf weitere Polymere ausgedehnt. Die Temperaturabhängigkeit der Plasmaätzrate ist teilweise sehr unterschiedlich, was auf einen sehr komplexen Mechanismus des Ätzprozesses hindeutet. Charakteristische Knickpunkte in den Kurven konnten nur in einigen Fällen mit der Glastemperatur des Polymers in Verbindung gebracht werden. Möglicherweise werden diese Knickpunkte auch durch Abtrag und Bildung von Adsorptionsschichten hervorgerufen. Aktivierungsenergien von Teilprozessen wurden bestimmt. Aus den Temperaturabhängigkeiten allein ließen sich nur allgemeine Schlußfolgerungen über den Mechanismus des Plasmaätzens der einzelnen Polymere ableiten.
    Additional Material: 4 Ill.
    Type of Medium: Electronic Resource
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