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  • 1
    Electronic Resource
    Electronic Resource
    Interfacial chemistry at real resin-metal interfaces of electronics devices (1985)
    Chichester [u.a.] : Wiley-Blackwell
    Surface and Interface Analysis 7 (1985), S. 129-140 
    Details
    ISSN: 0142-2421
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Physics
    Notes: An amine and an anhydride cured commercial epoxy resin were moulded to real Ag, Ni and Cu surfaces in plant conditions. The joints were mechanically broken and the two faces obtained in the fracture analysed by ESCA. The interfacial chemical compositions were found to be different with respect to that of the corresponding resin and metal bulk.Some of the resin constituents were confined in the bulk of the resin itself. Others were found to be homogeneously distributed between the bulk of the resin and the interface. Another group of resin constituents were found to segregate to the interfacial zone, often in a chemical state different from that found in the bulk. Also some trace elements present as additives in the metals were found to migrate to the interfacial zone.The migration phenomena were found to selectively depend on the chemical nature of the metal and resin respectively. Dramatic chemical composition differences were found between the two faces obtained in the fracture.The effect of time and moulding temperature on the interfacial chemistry was studied. Proof of various chemical reactions taking place at the interfaces with time or moulding temperature could be obtained.The results are discussed also in terms of performance of the electronic devices where the studied interfaces are present.
    Additional Material: 13 Ill.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/sia.740070305
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  • 2
    Electronic Resource
    Electronic Resource
    ECASIA 93 preface (1994)
    Chichester [u.a.] : Wiley-Blackwell
    Surface and Interface Analysis 22 (1994), S. i 
    Details
    ISSN: 0142-2421
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Physics
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/sia.740220102
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  • 3
    Electronic Resource
    Electronic Resource
    ESCA study of the adhesion of Ag, Cu and Ni to polysiloxane resins used in the semiconductor industry (1983)
    Chichester [u.a.] : Wiley-Blackwell
    Surface and Interface Analysis 5 (1983), S. 161-166 
    Details
    ISSN: 0142-2421
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Physics
    Notes: Commercial polysiloxane resins used in the semiconductor industry were moulded on Ag, Ni and Cu real surfaces. The samples were broken by using a pull test machine and the joint strength measured. The ‘resin’ and ‘metal’ faces obtained in the rupture process were analysed by ESCA. The chemical composition of the two faces was very different. The one from the resin side resembled that of the bulk. That from the metal side was rich in additives from the commercial resin. Some differences were found between the three metals, whilst the spiral flow of the resin in the range examined influenced the results in only a very limited way. The weak boundary layer in which the above additives accumulate seems responsible for the low adhesion level found. The Pb/Si concentration ratio at the fracture locus is correlated with the adhesive joint strength. The multifactorial nature of the adhesion in practical samples is discussed. It is suggested that the influence of the heavy elements present in the additive has to be explored in connection not only with the adhesion problem but also with the electrical reliability of the device.
    Additional Material: 9 Ill.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/sia.740050407
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  • 4
    Electronic Resource
    Electronic Resource
    Does photoelectron spectrometry give the energy distribution of molecular ions obtained by electron-impact? (1972)
    Chichester : Wiley-Blackwell
    Biological Mass Spectrometry 6 (1972), S. 113-118 
    Details
    ISSN: 0030-493X
    Keywords: Chemistry ; Analytical Chemistry and Spectroscopy
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology
    Notes: Photoelectron spectroscopy gives too crude an approximation to the energy distribution of molecular ions obtained by electron-impact.
    Additional Material: 3 Ill.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/oms.1210060112
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  • 5
    Electronic Resource
    Electronic Resource
    Energetic data as a guide to the interpretation of mass spectral features of dicarbonyl diketonates of Rh and Ir (1972)
    Chichester : Wiley-Blackwell
    Biological Mass Spectrometry 6 (1972), S. 971-976 
    Details
    ISSN: 0030-493X
    Keywords: Chemistry ; Analytical Chemistry and Spectroscopy
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology
    Notes: The relative intensities and appearance potentials of the principal ions formed from a series of rhodium and iridium dicarbonyl diketonates were measured by mass spectrometry. These compounds show the usual CO losses generally found in the fragmentation of metal carbonyls. Additionally several fragmentation peculiarities characteristic of metal acetylacetonates were found. Energetic data were used to interpret some aspects of the cracking patterns.
    Additional Material: 3 Tab.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/oms.1210060906
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  • 6
    Electronic Resource
    Electronic Resource
    The activation energy as guiding factor in the fragmentation of substituted diphenylmethanes (1973)
    Chichester : Wiley-Blackwell
    Biological Mass Spectrometry 7 (1973), S. 1399-1406 
    Details
    ISSN: 0030-493X
    Keywords: Chemistry ; Analytical Chemistry and Spectroscopy
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology
    Notes: The mass spectra of a series of substituted diphenylmethanes were obtained. The mass spectral features were compared with those of the corresponding 1,2 diphenylethanes and discussed in terms of the factors which influence the electron-impact fragmentation. In the series examined, it is shown that the activation energy is the most important factor in determining cracking patterns. The meaning of the averaged rate constants is criticised.
    Additional Material: 9 Ill.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/oms.1210071214
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  • 7
    Electronic Resource
    Electronic Resource
    Ionization energies of Rhodium and Iridium β-Diketonates: On the nature of the last occupied orbital (1971)
    Weinheim : Wiley-Blackwell
    Zeitschrift für anorganische Chemie 386 (1971), S. 107-112 
    Details
    ISSN: 0044-2313
    Keywords: Chemistry ; Inorganic Chemistry
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology
    Description / Table of Contents: Das erste Ionisierugspotential einer Reihe von (CO)2M(β-Diketonato)-Komplexverbindungen wurden durch Elektronenstoß gemessen. Es wird die Annahme vorgeschlagen, daß die erste Ionisierung auf ein Molekularorbital, in der das atomare Orbital des zentralen Metallatoms eine nicht untergeordnete Rolle spielt, stattfindet. Die Ergebnisse älterer Untersuchungen an anderen β-Diketonato-Verbindungen können durch unseren Vorschlag erklärt werden.
    Notes: The first ionization energies of a number of (CO)2M(β-diketonate) complexes (M = Rh, Ir) were measured by electron impact. The hypothesis of a first ionization from a molecular orbital with a significant participation of the central metal atomic orbital is proposed for these complexes. The results obtained previously with other metal β-diketonates are shown to be consistent with the proposed rationalisation.
    Additional Material: 2 Tab.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/zaac.19713860112
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  • 8
    Electronic Resource
    Electronic Resource
    Ni surface chemistry and quality of the Al/Ni bond in electronic devices (1987)
    Chichester [u.a.] : Wiley-Blackwell
    Surface and Interface Analysis 10 (1987), S. 306-310 
    Details
    ISSN: 0142-2421
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Physics
    Notes: Four chemically different nickel surfaces, as revealed by ESCA, have been ultrasonically bonded to Al/Mg wires. Under normal conditions there was found to be very little difference in the pull strength of the various surfaces; there were small variations when the samples were tested in stress conditions such as high temperature storage (200 ° C), or a water vapour pressure environment (121 °C, 1.04 atm). However, the bonds have been found to be reliable for the four surfaces and when tested in the encapsulating resin environment of an actual electronic device. The thickness of nickel chemical species overlaying the nickel substrate was estimated to range from 5 to 13 Å for the four nickel surfaces simulating possible plant conditions. This relatively low thickness is considered to be responsible for the above positive results. These results are compared with those previously obtained for the Al/Cu joints.
    Additional Material: 1 Ill.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/sia.740100607
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  • 9
    Electronic Resource
    Electronic Resource
    Characterization and reliability of Ti/Ni/Au, Ti/Ni/Ag and Ti/Ni back-side metallizations in the die-bonding of power electronic devices (1994)
    Chichester [u.a.] : Wiley-Blackwell
    Surface and Interface Analysis 22 (1994), S. 353-357 
    Details
    ISSN: 0142-2421
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Physics
    Notes: The surface compositions of three different back-side metals: Ti/Ni/Au 0.1/0.4/0.1 μm, Ti/Ni/Ag 0.1/0.4/0.1 and 0.1/0.4/2 μm and Ti/Ni 0.1/04 μm after thermal treatment at 180°C in air were investigated by means of XPS technique. In the Ti/Ni/Au metal the Ni diffusion through the Au layer was observed, while in the Ti/Ni/Ag metal Ni was not found on the silver surface. Ti/Ni/Ag was found to be sensitive to contamination from elements such as sulphur and chlorine found on the silver surface after thermal treatment, while Ti/Ni metal is sensitive to oxidation. NiO, Ni(OH)2, NiOOH and Ni2O3 species were found on the Ni as deposited surface. The surface compositions were correlated to their wetting property using the Pb88—Sn10—Ag2 and Pb95.5—Sn2—Ag2.5 wt.% soft solder alloys. The wetting was studied measuring the contact angle between the surface and the drop of molten solders.
    Additional Material: 6 Ill.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/sia.740220177
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