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  • 61.80  (2)
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  • 1
    Electronic Resource
    Electronic Resource
    Springer
    Applied physics 16 (1978), S. 339-343 
    ISSN: 1432-0630
    Keywords: 61.80
    Source: Springer Online Journal Archives 1860-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: Abstract Radiation damage in silicon was investigated by monitoring the absorbed sample current in a scanning electron microscope. The existence of different types of damage after implantation of light or heavy ions, respectively, could be revealed by plotting the change in sample current at the implantation boundary versus beam voltage. Results are explained by considering the yield and the anisotropy of electron backscattering in the presence of either small isolated defects or extended damaged zones. Applications of the new method are described.
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    Springer
    Applied physics 10 (1976), S. 111-119 
    ISSN: 1432-0630
    Keywords: 79.20 ; 61.80
    Source: Springer Online Journal Archives 1860-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: Abstract SEM signals were used to image ion-implanted surfaces and to quantitatively analyze implanted layers. Silicon was used as substrate material for implantation, but some measurements on GaAs are also reported. Various ion species were implanted and the dependence of the signals upon fluence was studied. Electron backscattering and absorbed current were found to be influenced by the radiation damage rather than by the species of implanted ions. The degree of damage could be characterized by absorbed current measurements. The ion fluence necessary to produce amorphous layers was determined for N, P, and As in Si using this technique. This fluence was found to correspond to an energy deposition of 2.8×1021 keV/cm3. For the detection of very small amounts of implanted ions by characteristic X-rays, the electron energy must be fitted to the penetration depth of the ions under conditions maintaining reasonable excitation cross sections. The lowest value of the normalized detectability obtained in our measurements was 2.5×1013 Ions/cm2 for 45 keV phosphorus.
    Type of Medium: Electronic Resource
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