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  • 1
    Electronic Resource
    Electronic Resource
    Weinheim : Wiley-Blackwell
    Chemie Ingenieur Technik - CIT 68 (1996), S. 1079-1080 
    ISSN: 0009-286X
    Keywords: Chemistry ; Industrial Chemistry
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Process Engineering, Biotechnology, Nutrition Technology
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    Weinheim : Wiley-Blackwell
    Materialwissenschaft und Werkstofftechnik 26 (1995), S. 553-559 
    ISSN: 0933-5137
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Description / Table of Contents: Bestimmung der Spannungstensoren in dünnen, texturierten Kupferschichten mittels Röntgenbeugung bei streifendem EinfallIonenplattierte Kupferschichten wurden mittels Röntgenbeugung hinsichtlich Texturen und Eigenspannungen untersucht. Die vollständigen Orientierungsverteilungsfunktionen wurden bestimmt und scharfe (111)-Fasertexturen gefunden. Die Messung der Dehnungen erfolgte unter streifendem Strahleinfall. Zur Berechnung der Spannungstensoren wurden sowohl texturgewichtete elastische Moduln als auch texturunabhängige elastische Moduln verwendet. Die Bedeutung der Texturmessung für die Spannungstensorbestimmung wird diskutiert. Die gefundenen Spannungen können als thermisch verursacht verstanden werden.
    Notes: Ion-platted thin copper films were examined for residual stresses and texture by X-ray diffraction. The complete orientation distribution functions were determined and sharp (111)-fibre textures were found. The strains were measured by grazing incidence diffraction. The stress tensors were calculated using both texture-weighted elastic compliances and texture-independent X-ray elastic constants. The importance of the texture measurement for the stress tensor determination is discussed. The found stresses can be interpreted as thermally induced.
    Additional Material: 5 Ill.
    Type of Medium: Electronic Resource
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