ISSN:
1662-8985
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
Ceramic radiator fins were produced by screen-printing copper paste on ceramicsubstrate, which could replace the traditional technique of direct bestrow copper and meet therequirements of surface mounted technology. This method could be used to manufacture highdensity, superior thin and micro-sized molectrons. The key processes were screen-printing copperpaste, sintering and electroless plating of nickel. The adhesion of copper film onto the ceramicsubstrate was often reduced after the process of electroless plating of nickel, resulting in the lowquality of manufacturing. In this study, we analyzed the ceramic radiator fins which were obtainedby the screen-printing copper paste method and using scanning electron microscopy to examine thesurface and the cross-sections of copper film and Cu/Ni film. The adhesive properties of copperfilm during electroless plating was studied. The corrosion resistance of copper film and sinteringglass phase on alumina substrate (96%) was also studied in an electroplating bath. The studyrevealed that the glass phase of acidity of silicon, softening temperature, the interaction conjunctionbetween glass phase and ceramics were important factors
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/01/40/transtech_doi~10.4028%252Fwww.scientific.net%252FAMR.41-42.215.pdf
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