ISSN:
1436-2449
Source:
Springer Online Journal Archives 1860-2000
Topics:
Chemistry and Pharmacology
,
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
,
Physics
Notes:
Summary The content of total chlorine in o-cresol formaldehyde novolac epoxy resin (CNE), the main resin component for encapsulation formulation, affects the reliability of semi-conductor device greatly and it is one of the major criteria used by the electronic industry in measuring the quality of resins. A new process which synthesizes a high purity CNE with less than 300 ppm total chlorine content has been developed. This high purity resin has provided an extended device life under the accelerated stress test condition.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1007/BF00293514
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