Electronic Resource
[S.l.]
:
American Institute of Physics (AIP)
Journal of Applied Physics
78 (1995), S. 945-952
ISSN:
1089-7550
Source:
AIP Digital Archive
Topics:
Physics
Notes:
The stress evolution of unpassivated Al(Cu) fine lines under thermal cycling has been investigated as a function of linewidth using a bending beam technique. The results show that the stresses parallel (σ(parallel)) and perpendicular (σ⊥) to the line direction are lower than those measured for thin films as a consequence of stress reduction at the line edges. The edge effect is particularly effective in reducing σ⊥, although σ(parallel) is also affected. With decreasing linewidth, the effect became more pronounced, leading to an increasingly unequal biaxial stress state and a reduction in line deformation. The observed linewidth dependence can be satisfactorily accounted for by analytic or finite element calculations of the average line stresses as a function of the line aspect ratio. Results of this study validates the use of the bending beam technique for measuring the average stresses in fine line structures. © 1995 American Institute of Physics.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1063/1.360288
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