ISSN:
1013-9826
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
Sputtering rate Sr was proposed as an alternative parameter instead of sputtering yield Yto calibrate the sputtering ability of the target, defined as the mass loss of the target per unit timeand sputtering current. The approach is more reliable for glow discharge processes since the intensebackscattering effect was taken into consideration. The effects of processing parameters on Sr wereinvestigated through orthogonal test, the results indicated that target temperature affects Srobviously, and among the discharge parameters, the target voltage and discharge pressure were thegoverning factors. Through regression analysis, the sputtering rate Sr was expressed as a function ofsputtering voltage and discharge pressure which could be used to evaluate or predict the real outputof the sputtering target
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/01/55/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.353-358.1891.pdf
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