ISSN:
1013-9826
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
This paper studies the crack propagation at Sn37Pb-copper interface in push-pull lowcycle fatigue. Bonded specimens of Sn37Pb and copper having notch holes with different distancesfrom the interface were fatigued at 313K and the crack propagation paths were observed. Crackspropagated at the interface when the notch hole was near the interface but propagated in the solderwhen the notch hole was away from the interface. The propagation rate of the interfacial crack wasfaster than that of non-interface crack. The crack path and crack propagation rate of the two typesof cracks were discussed in relation to J integral range calculated by finite element method
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/01/55/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.353-358.2962.pdf
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